Si4825DDY-T1-GE3 (Lead (Pb)-free and Halogen-free)
ABSOLUTE MAXIMUM RATINGS
T
A
= 25 °C, unless otherwise noted
Parameter
Drain-Source Voltage
Gate-Source Voltage
T
C
= 25 °C
T
C
= 70 °C
T
A
= 25 °C
T
A
= 70 °C
T
C
= 25 °C
T
A
= 25 °C
L = 0.1 mH
T
C
= 25 °C
T
C
= 70 °C
T
A
= 25 °C
T
A
= 70 °C
Symbol
V
DS
V
GS
Limit
- 30
± 25
- 13.5
- 11.9
- 10.9
a, b
- 8.6
a, b
- 60
- 4.1
- 2.2
a, b
- 20
20
5.0
3.2
2.7
a, b
1.7
a, b
- 55 to 150
Unit
V
Continuous Drain Current (T
J
= 150 °C)
I
D
Pulsed Drain Current
Continuous Source-Drain Diode Current
Avalanche Current
Single-Pulse Avalanche Energy
I
DM
I
S
I
AS
E
AS
A
mJ
Maximum Power Dissipation
P
D
W
Operating Junction and Storage Temperature Range
T
J
, T
stg
°C
THERMAL RESISTANCE RATINGS
Parameter
Maximum Junction-to-Ambient
a, c
Maximum Junction-to-Foot
Notes:
a. Surface mounted on 1" x 1" FR4 board.
b. t = 10 s.
c. Maximum under Steady State conditions is 85 °C/W.
d. Based on T
C
= 25 °C.
1
t
≤
10 s
Steady State
Symbol
R
thJA
R
thJF
Typical
38
20
Maximum
46
25
Unit
°C/W
www.din-tek.jp
SPECIFICATIONS
T
J
= 25 °C, unless otherwise noted
Parameter
Static
Drain-Source Breakdown Voltage
V
DS
Temperature Coefficient
V
GS(th)
Temperature Coefficient
Gate-Source Threshold Voltage
Gate-Source Leakage
Zero Gate Voltage Drain Current
On-State Drain Current
a
Drain-Source On-State Resistance
a
Forward Transconductance
a
Dynamic
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Total Gate Charge
Gate-Source Charge
Gate-Drain Charge
Gate Resistance
Turn-On Delay Time
Rise Time
Turn-Off DelayTime
Fall Time
Turn-On Delay Time
Rise Time
Turn-Off DelayTime
Fall Time
Drain-Source Body Diode Characteristics
Continous Source-Drain Diode Current
Pulse Diode Forward Current
Body Diode Voltage
Body Diode Reverse Recovery Time
Body Diode Reverse Recovery Charge
Reverse Recovery Fall Time
Reverse Recovery Rise Time
I
S
I
SM
V
SD
t
rr
Q
rr
t
a
t
b
I
F
= - 10 A, dI/dt = 100 A/µs, T
J
= 25 °C
I
S
= - 3 A, V
GS
= 0 V
- 0.75
27
16
12
15
T
C
= 25 °C
- 4.1
- 60
- 1.2
45
27
A
V
ns
nC
ns
b
DTM4415
Symbol
V
DS
ΔV
DS
/T
J
ΔV
GS(th)
/T
J
V
GS(th)
I
GSS
I
DSS
I
D(on)
R
DS(on)
g
fs
C
iss
C
oss
C
rss
Q
g
Q
gs
Q
gd
R
g
t
d(on)
t
r
t
d(off)
t
f
t
d(on)
t
r
t
d(off)
t
f
Test Conditions
V
GS
= 0 V, I
D
= - 250 µA
I
D
= - 250 µA
V
DS
= V
GS
, I
D
= - 250 µA
V
DS
= 0 V, V
GS
= ± 25 V
V
DS
= - 30 V, V
GS
= 0 V
V
DS
= - 30 V, V
GS
= 0 V, T
J
= 55 °C
V
DS
≥
- 10 V, V
GS
= - 10 V
V
GS
= - 10 V, I
D
= - 10 A
V
GS
= - 4.5 V, I
D
= - 8 A
V
DS
= - 10 V, I
D
= - 10 A
Min.
- 30
Typ.
Max.
Unit
V
- 34
5.3
- 1.4
- 2.5
± 100
-1
-5
- 30
0.007
0.0115
28
2550
0.0092
0.0128
mV/
°C
V
nA
µA
A
Ω
S
V
DS
= - 15 V, V
GS
= 0 V, f = 1 MHz
V
DS
= - 15 V, V
GS
= - 10 V, I
D
= - 10 A
V
DS
= - 15 V, V
GS
= - 4.5 V, I
D
= - 10 A
f = 1 MHz
V
DD
= - 15 V, R
L
= 1.5
Ω
I
D
≅
- 10 A, V
GEN
= - 10 V, R
g
= 1
Ω
0.5
455
390
57
29.5
8
22
2.2
13
12
40
9
48
4.4
25
24
70
18
80
160
60
35
86
45
pF
nC
Ω
ns
V
DD
= - 15 V, R
L
= 1.5
Ω
I
D
≅
- 10 A, V
GEN
= - 4.5 V, R
g
= 1
Ω
92
34
19
Notes:
a. Pulse test; pulse width
≤
300 µs, duty cycle
≤
2 %.
b. Guaranteed by design, not subject to production testing.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
2
TYPICAL CHARACTERISTICS
25 °C, unless otherwise noted
60
10
www.din-tek.jp
DTM4415
48
I
D
- Drain Current (A)
I
D
- Drain Current (A)
V
GS
= 10 thru 4
V
36
8
6
T
C
= 125 °C
4
T
C
= 25 °C
2
T
C
= - 55 °C
0
0
1
2
3
4
5
24
12
V
GS
= 3
V
0
0.0
0.5
1.0
1.5
V
GS
= 1
V,
2
V
2.0
2.5
V
DS
- Drain-to-Source
Voltage
(V)
V
GS
- Gate-to-Source
Voltage
(V)
Output Characteristics
0.030
4000
C
iss
R
DS(on)
- On-Resistance (Ω)
0.025
C - Capacitance (pF)
3200
Transfer Characteristics
0.020
V
GS
= 4.5
V
2400
0.015
V
GS
= 10
V
1600
C
oss
800
C
rss
0.010
0.005
0
10
20
30
40
50
60
0
0
5
10
15
20
25
I
D
- Drain Current (A)
V
DS
- Drain-to-Source
Voltage
(V)
On-Resistance vs. Drain Current
10
V
GS
- Gate-to-Source
Voltage
(V)
I
D
= 10 A
8
V
DS
= 10
V
V
DS
= 15
V
R
DS(on)
- On-Resistance
(Normalized)
1.4
1.6
I
D
= - 10 A
Capacitance
V
GS
= - 4.5
V
V
GS
= - 10
V
1.2
6
4
V
DS
= 20
V
2
1.0
0.8
0
0
12
24
36
48
60
0.6
- 50
- 25
0
25
50
75
100
125
150
Q
g
- Total Gate Charge (nC)
T
J
- Junction Temperature (°C)
Gate Charge
On-Resistance vs. Junction Temperature
3
TYPICAL CHARACTERISTICS
25 °C, unless otherwise noted
100
T
J
= 150 °C
10
T
J
= 25 °C
1
R
DS(on)
- On-Resistance (Ω)
I
S
- Source Current (A)
0.10
www.din-tek.jp
DTM4415
I
D
= 10 A
0.08
0.06
0.1
0.04
T
J
= 125 °C
0.01
0.02
T
J
= 25 °C
0.001
0.0
0.00
0.2
0.4
0.6
0.8
1.0
1.2
0
2
4
6
8
10
V
SD
- Source-to-Drain
Voltage
(V)
V
GS
- Gate-to-Source
Voltage
(V)
Source-Drain Diode Forward Voltage
0.8
I
D
= 250
µA
0.6
V
GS(th)
Variance
(V)
136
170
On-Resistance vs. Gate-to-Source Voltage
0.4
Power (W)
I
D
= 5 mA
0.2
102
68
0.0
34
- 0.2
- 0.4
- 50
0
- 25
0
25
50
75
100
125
150
0.001
0.01
0.1
Time (s)
1
10
T
J
- Temperature (°C)
Threshold Voltage
100
Limited
by
R
DS(on)
*
10
I
D
- Drain Current (A)
Single Pulse Power, Junction-to-Ambient
1 ms
10 ms
1
100 ms
1s
10 s
DC
T
A
= 25 °C
Single Pulse
0.01
0.01
0.1
1
BVDSS
10
100
0.1
V
DS
- Drain-to-Source
Voltage
(V)
*
V
GS
> minimum
V
GS
at
which
R
DS(on)
is specified
Safe Operating Area
4
MOSFET TYPICAL CHARACTERISTICS
25 °C, unless otherwise noted
17.0
www.din-tek.jp
DTM4415
13.6
I
D
- Drain Current (A)
10.2
6.8
3.4
0.0
0
25
50
75
100
125
150
T
C
- Case Temperature (°C)
Current Derating*
6.0
2.0
4.8
1.6
Power (W)
3.6
Power (W)
0
1.2
2.4
0.8
1.2
0.4
0.0
25
50
75
100
125
150
0.0
0
25
50
75
100
125
150
T
C
- Case Temperature (°C)
T
A
- Ambient Temperature (°C)
Power, Junction-to-Foot
Power Derating, Junction-to-Ambient
* The power dissipation P
D
is based on T
J(max)
= 150 °C, using junction-to-case thermal resistance, and is more useful in settling the upper
dissipation limit for cases where additional heatsinking is used. It is used to determine the current rating, when this rating falls below the package
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