SN74HC280JP4 datasheet, PDF - EEWORLD Datasheet

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SN74HC280JP4: DescriptionSN74HC280JP4; Categorylogic logic; File Size212KB，3 Pages; ManufacturerTexas Instruments; Websitehttp://www.ti.com.cn/

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SN74HC280JP4

SN74HC280JP4 Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	Texas Instruments
package instruction	DIP, DIP14,.3
Reach Compliance Code	not_compliant
JESD-30 code	R-XDIP-T14
Logic integrated circuit type	PARITY GENERATOR/CHECKER
Number of terminals	14
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
Package body material	CERAMIC
encapsulated code	DIP
Encapsulate equivalent code	DIP14,.3
Package shape	RECTANGULAR
Package form	IN-LINE
power supply	2/6 V
surface mount	NO
technology	CMOS
Temperature level	INDUSTRIAL
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL

SN74HC280JP4 Related Products

	SN74HC280JP4	SN74HC280N3	SN74HC280D3	SN74HC280FN3	SN74HC280J4	SN74HC280NP3
Description	SN74HC280JP4	SN74HC280N3	SN74HC280D3	SN74HC280FN3	SN74HC280J4	SN74HC280NP3
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible
Maker	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments
package instruction	DIP, DIP14,.3	DIP, DIP14,.3	SOP, SOP14,.25	QCCJ, LDCC20,.4SQ	DIP, DIP14,.3	DIP, DIP14,.3
Reach Compliance Code	not_compliant	not_compliant	not_compliant	not_compliant	not_compliant	_compli
JESD-30 code	R-XDIP-T14	R-PDIP-T14	R-PDSO-G14	S-PQCC-J20	R-XDIP-T14	R-PDIP-T14
Logic integrated circuit type	PARITY GENERATOR/CHECKER	PARITY GENERATOR/CHECKER	PARITY GENERATOR/CHECKER	PARITY GENERATOR/CHECKER	PARITY GENERATOR/CHECKER	PARITY GENERATOR/CHECKER
Number of terminals	14	14	14	20	14	14
Maximum operating temperature	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C
Minimum operating temperature	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C
Package body material	CERAMIC	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	CERAMIC	PLASTIC/EPOXY
encapsulated code	DIP	DIP	SOP	QCCJ	DIP	DIP
Encapsulate equivalent code	DIP14,.3	DIP14,.3	SOP14,.25	LDCC20,.4SQ	DIP14,.3	DIP14,.3
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	SQUARE	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	IN-LINE	SMALL OUTLINE	CHIP CARRIER	IN-LINE	IN-LINE
power supply	2/6 V	2/6 V	2/6 V	2/6 V	2/6 V	2/6 V
surface mount	NO	NO	YES	YES	NO	NO
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
Terminal form	THROUGH-HOLE	THROUGH-HOLE	GULL WING	J BEND	THROUGH-HOLE	THROUGH-HOLE
Terminal pitch	2.54 mm	2.54 mm	1.27 mm	1.27 mm	2.54 mm	2.54 mm
Terminal location	DUAL	DUAL	DUAL	QUAD	DUAL	DUAL

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