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4 Pad Metal Package Quartz Crystal, 4.8 mm x 12.5 mm
Product Features:
SMD Package
Compatible with Leadfree Processing
Grounded package for low EMI
HC49USM4 Series
Applications:
Fibre Channel
Server & Storage
Sonet /SDH
802.11 / Wifi
T1/E1, T3/E3
System Clock
4.83
Max.
12.5 Max.
1.3
Frequency
3.2 MHz to 100.000 MHz
ESR (Equivalent Series Resistance)
3.2 MHz – 3.49 MHz
3.5 MHz – 3.99 MHz
4.0 MHz – 4.99 MHz
5.0 MHz – 5.99 MHz
6.0 MHz – 6.99 MHz
7.0 MHz – 8.9 MHz
9.0 MHz – 12.9 MHz
13 MHz – 19.9 MHz
20 MHz – 36 MHz
rd
27 MHz – 100 MHz (3 O.T.)
Shunt Capacitance (C0)
Frequency Tolerance @ 25°
C
Frequency Stability over
Temperature
Crystal Cut
Load Capacitance
Drive Level
Aging
Temperature
Operating
Storage
0° C to +70° C Standard (see Part Number Guide for more
options)
-40° C to +85° C Standard
300
Ω
Max.
200
Ω
Max.
150
Ω
Max.
120
Ω
Max.
100
Ω
Max.
80
Ω
Max.
60
Ω
Max.
40
Ω
Max.
30
Ω
Max.
100
Ω
Max.
7 pF Max.
±30
ppm Standard (see Part Number Guide for more options)
±50
ppm Standard (see Part Number Guide for more options)
AT Cut Standard
18 pF Standard (see Part Number Guide for more options)
1 mW Max.
±5
ppm Max. / Year Standard
Dimension Units: mm
Internal connection
USM8 / USM9
Recommended pad
layout
Internal connection
USM4 / USM6
1.2 +/-0.1
H Max.
Part Number
Guide
9.0 +/-0.1
Part Number Guide
Package
Tolerance
(ppm) at Room
Temperature
B = ±50 ppm
F = ±30 ppm
G = ±25 ppm
H = ±20 ppm
I = ±15 ppm
J = ±10 ppm*
Sample Part Number:
Stability
(ppm) over Operating
Temperature
B = ±50 ppm
F = ±30 ppm
G = ±25 ppm
H = ±20 ppm
I = ±15 ppm**
J = ±10 ppm**
HC49USM4 - FB1F18 - 20.000
Operating
Temperature Range
0 = 0°C to +50°C
1 = 0°C to +70°C
2 = -10°C to +60°C
3 = -20°C to +70°C
5 = -40°C to +85°C
9 = -10°C to +50°C
Mode
(overtone)
F = Fundamental
3 = 3
rd
overtone
Load Capacitance
(pF)
Frequency
HC49USM4 -
(5.2 mm H)
HC49USM6 -
(4.5 mm H)
HC49USM8 -
(5.2 mm H)
18 pF Standard
Or Specify.
- 20.000 MHz
HC49USM9 -
(4.5 mm H)
* Not available at all frequencies. ** Not available for all temperature ranges.
ILSI
America
Phone: 775-851-8880 • Fax: 775-851-8882• e-mail: e-mail@ilsiamerica.com • www.ilsiamerica.com
04/09_A
Specifications subject to change without notice
Page 1
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4 Pad Metal Package Quartz Crystal, 4.8 mm x 12.5 mm
Pb Free Solder Reflow Profile:
HC49USM4 Series
Typical Circuit:
*Units are backward compatible with 240C reflow processes
Package Information:
MSL = N/A
Termination = e1 (Sn / Cu / Ag over Ni over Kovar base metal).
Tape and Reel Information:
Quantity per
Reel
A
B
C
D
E
F
1000
24 +/-.3
12 +/-.2
11.5 +/-.2
25 +/-1.5
80 / 100
330
Environmental Specifications
Thermal Shock
Moisture Resistance
Mechanical Shock
Mechanical Vibration
Resistance to Soldering Heat
Hazardous Substance
Solderability
Terminal Strength
Gross Leak
Fine Leak
Solvent Resistance
MIL-STD-883, Method 1011, Condition A
MIL-STD-883, Method 1004
MIL-STD-883, Method 2002, Condition B
MIL-STD-883, Method 2007, Condition A
J-STD-020C, Table 5-2 Pb-free devices (except 2 cycles max)
Pb-Free / RoHS / Green Compliant
JESD22-B102-D Method 2 (Preconditioning E)
MIL-STD-883, Method 2004, Test Condition D
MIL-STD-883, Method 1014, Condition C
MIL-STD-883, Method 1014, Condition A2, R1=2x10-8 atm cc/s
MIL-STD-202, Method 215
Marking
Line 1: ILSI, Frequency, Date Code
ILSI
America
Phone: 775-851-8880 • Fax: 775-851-8882• e-mail: e-mail@ilsiamerica.com • www.ilsiamerica.com
04/09_A
Specifications subject to change without notice
Page 2
Microchip MCU
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