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IS66WVH8M8BLL-100B1LI

Description
Pseudo Static RAM, 8MX8, CMOS, PBGA24, 6 X 8 MM, 1.20 MM HEIGHT, LEAD FREE, MO-207, TFBGA-24
Categorystorage    storage   
File Size2MB,65 Pages
ManufacturerIntegrated Silicon Solution ( ISSI )
Environmental Compliance
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IS66WVH8M8BLL-100B1LI Overview

Pseudo Static RAM, 8MX8, CMOS, PBGA24, 6 X 8 MM, 1.20 MM HEIGHT, LEAD FREE, MO-207, TFBGA-24

IS66WVH8M8BLL-100B1LI Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
MakerIntegrated Silicon Solution ( ISSI )
package instructionTFBGA-24
Reach Compliance Codecompliant
Factory Lead Time10 weeks
JESD-30 codeR-PBGA-B24
length8 mm
memory density67108864 bit
Memory IC TypePSEUDO STATIC RAM
memory width8
Number of functions1
Number of terminals24
word count8388608 words
character code8000000
Operating modeSYNCHRONOUS
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
organize8MX8
Package body materialPLASTIC/EPOXY
encapsulated codeTBGA
Package shapeRECTANGULAR
Package formGRID ARRAY, THIN PROFILE
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)NOT SPECIFIED
Maximum seat height1.2 mm
Maximum supply voltage (Vsup)3.6 V
Minimum supply voltage (Vsup)2.7 V
Nominal supply voltage (Vsup)3 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal formBALL
Terminal pitch1 mm
Terminal locationBOTTOM
Maximum time at peak reflow temperatureNOT SPECIFIED
width6 mm
IS66WVH8M8ALL/BLL
IS67WVH8M8ALL/BLL
8M x 8 HyperRAM™
AUGUST
2016
Overview
The IS66/67WVH8M8ALL/BLL are integrated memory device containing 64Mbit Pseudo Static Random
Access Memory using a self-refresh DRAM array organized as 8M words by 8 bits. The device supports a
HyperBus interface, Very Low Signal Count (Address, Command and data through 8 DQ pins),
Hidden
Refresh Operation, and Automotive Temperature Operation, designed specially for Mobile and
Automotive applications.
Distinctive Characteristics
HyperBus
TM
Low Signal Count Interface
3.0V I/O, 11 bus signals
– Single ended clock (CK)
High Performance
Up to 333MB/s
Double-Data Rate (DDR) - two data transfers per clock
166-MHz clock rate (333 MB/s) at 1.8V V
CC
100-MHz clock rate (200 MB/s) at 3.0V V
CC
Sequential burst transactions
Configurable Burst Characteristics
– Wrapped burst lengths:
– 16 bytes (8 clocks)
– 32 bytes (16 clocks)
– 64 bytes (32 clocks)
– 128 bytes (64 clocks)
– Linear burst
– Hybrid option - one wrapped burst followed by linear burst
– Wrapped or linear burst type selected in each transaction
– Configurable output drive strength
1.8V I/O, 12 bus signals
– Differential clock (CK, CK#)
Chip Select (CS#)
8-bit data bus (DQ[7:0])
Read-Write Data Strobe (RWDS)
Bidirectional Data Strobe / Mask
Output at the start of all transactions to indicate refresh latency
Output during read transactions as Read Data Strobe
Input during write transactions as Write Data Mask
RESET#
CS#
CK
CK#
V
CC
V
CC
Q
DQ[7:0]
RWDS
Package and Die Options
– 25-ball FBGA footprint
– 24-ball FBGA footprint
V
SS
V
SS
Q
Copyright © 2016 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its products at any time without notice. ISSI
assumes no liability arising out of the application or use of any information, products or services described herein. Customers are advised to obtain the latest version of this device
specification before relying on any published information and before placing orders for products.
Integrated Silicon Solution, Inc. does not recommend the use of any of its products in life support applications where the failure or malfunction of the product can reasonably be
expected to cause failure of the life support system or to significantly affect its safety or effectiveness. Products are not authorized for use in such applications unless Integrated
Silicon Solution, Inc. receives written assurance to its satisfaction, that:
a.) the risk of injury or damage has been minimized;
b.) the user assume all such risks; and
c.) potential liability of Integrated Silicon Solution, Inc is adequately protected under the circumstances
Integrated Silicon Solution, Inc.- www.issi.com
Rev.A
06/28/2016
1

IS66WVH8M8BLL-100B1LI Related Products

IS66WVH8M8BLL-100B1LI IS66WVH8M8ALL-166B1LI
Description Pseudo Static RAM, 8MX8, CMOS, PBGA24, 6 X 8 MM, 1.20 MM HEIGHT, LEAD FREE, MO-207, TFBGA-24 Pseudo Static RAM, 8MX8, CMOS, PBGA24, 6 X 8 MM, 1.20 MM HEIGHT, LEAD FREE, MO-207, TFBGA-24
Is it Rohs certified? conform to conform to
Maker Integrated Silicon Solution ( ISSI ) Integrated Silicon Solution ( ISSI )
package instruction TFBGA-24 TFBGA-24
Reach Compliance Code compliant compliant
Factory Lead Time 10 weeks 10 weeks
JESD-30 code R-PBGA-B24 R-PBGA-B24
length 8 mm 8 mm
memory density 67108864 bit 67108864 bit
Memory IC Type PSEUDO STATIC RAM PSEUDO STATIC RAM
memory width 8 8
Number of functions 1 1
Number of terminals 24 24
word count 8388608 words 8388608 words
character code 8000000 8000000
Operating mode SYNCHRONOUS SYNCHRONOUS
Maximum operating temperature 85 °C 85 °C
Minimum operating temperature -40 °C -40 °C
organize 8MX8 8MX8
Package body material PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code TBGA TBGA
Package shape RECTANGULAR RECTANGULAR
Package form GRID ARRAY, THIN PROFILE GRID ARRAY, THIN PROFILE
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Celsius) NOT SPECIFIED NOT SPECIFIED
Maximum seat height 1.2 mm 1.2 mm
Maximum supply voltage (Vsup) 3.6 V 1.95 V
Minimum supply voltage (Vsup) 2.7 V 1.7 V
Nominal supply voltage (Vsup) 3 V 1.8 V
surface mount YES YES
technology CMOS CMOS
Temperature level INDUSTRIAL INDUSTRIAL
Terminal form BALL BALL
Terminal pitch 1 mm 1 mm
Terminal location BOTTOM BOTTOM
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED
width 6 mm 6 mm
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