IC,TIMER,CMOS,LDCC,28PIN,PLASTIC
| Parameter Name | Attribute value |
| Maker | Renesas Electronics Corporation |
| package instruction | QCCJ, LDCC28,.5SQ |
| Reach Compliance Code | compliant |
| JESD-30 code | S-PQCC-J28 |
| Number of terminals | 28 |
| Maximum operating temperature | 85 °C |
| Minimum operating temperature | -40 °C |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | QCCJ |
| Encapsulate equivalent code | LDCC28,.5SQ |
| Package shape | SQUARE |
| Package form | CHIP CARRIER |
| power supply | 5 V |
| Certification status | Not Qualified |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | INDUSTRIAL |
| Terminal form | J BEND |
| Terminal pitch | 1.27 mm |
| Terminal location | QUAD |
| IS8255A-96 | IS8255A-5 | |
|---|---|---|
| Description | IC,TIMER,CMOS,LDCC,28PIN,PLASTIC | IC,TIMER,CMOS,LDCC,28PIN,PLASTIC |
| Maker | Renesas Electronics Corporation | Renesas Electronics Corporation |
| package instruction | QCCJ, LDCC28,.5SQ | QCCJ, LDCC28,.5SQ |
| Reach Compliance Code | compliant | compliant |
| JESD-30 code | S-PQCC-J28 | S-PQCC-J28 |
| Number of terminals | 28 | 28 |
| Maximum operating temperature | 85 °C | 85 °C |
| Minimum operating temperature | -40 °C | -40 °C |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | QCCJ | QCCJ |
| Encapsulate equivalent code | LDCC28,.5SQ | LDCC28,.5SQ |
| Package shape | SQUARE | SQUARE |
| Package form | CHIP CARRIER | CHIP CARRIER |
| power supply | 5 V | 5 V |
| Certification status | Not Qualified | Not Qualified |
| Nominal supply voltage (Vsup) | 5 V | 5 V |
| surface mount | YES | YES |
| technology | CMOS | CMOS |
| Temperature level | INDUSTRIAL | INDUSTRIAL |
| Terminal form | J BEND | J BEND |
| Terminal pitch | 1.27 mm | 1.27 mm |
| Terminal location | QUAD | QUAD |