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Mobile Intel
®
Pentium
®
III Processor-M
Datasheet
January 2003
Order Number: 298340-006
Introduction
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Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual
property rights is granted by this document. Except as provided in Intel’s Terms and Conditions of Sale for such products, Intel assumes no liability
whatsoever, and Intel disclaims any express or implied warranty, relating to sale and/or use of Intel products including liability or warranties relating to
fitness for a particular purpose, merchantability, or infringement of any patent, copyright or other intellectual property right. Intel products are not intended
for use in medical, life saving, or life sustaining applications.
The information provided in this report, and related materials and presentations, are intended to illustrate the effects of certain design variables as
determined by modeling, and are neither a recommendation nor endorsement of any specific system-level design practices or targets. The model results
are based on a simulated notebook configuration, and do not describe or characterize the properties of any specific, existing system design. A detailed
description of the simulated notebook configuration is available upon request.
Intel may make changes to specifications and product descriptions at any time, without notice.
Designers must not rely on the absence or characteristics of any features or instructions marked "reserved" or "undefined." Intel reserves these for future
definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them.
The Mobile Intel® Pentium® III Processor-M may contain design defects or errors known as errata which may cause the product to deviate from published
specifications. Current characterized errata are available on request.
Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order.
Copies of documents which have an ordering number and are referenced in this document, or other Intel literature, may be obtained from:
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United States and other countries.
*Other names and brands may be claimed as the property of others.
Copyright © Intel Corporation 2000-2002
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Mobile Intel
®
Pentium
®
III Processor-M Datasheet
Introduction
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Contents
1.
Introduction .................................................................................................................................... 11
1.1
1.2
1.3
1.4
2.
2.1
Overview .............................................................................................................. 12
State of the Data .................................................................................................. 12
Terminology ......................................................................................................... 13
References........................................................................................................... 13
New Features in the Mobile Pentium III Processor-M ......................................... 14
2.1.1 133-MHz PSB With AGTL Signaling....................................................... 14
2.1.2 512-K On-die Integrated L2 Cache......................................................... 14
2.1.3 Data Prefetch Logic ................................................................................ 14
2.1.4 Differential Clocking ................................................................................ 14
2.1.5 Deeper Sleep State................................................................................. 15
2.1.6 Signal Differences Between the Mobile Pentium III Processor (in
BGA2 and Micro-PGA2 Packages) and the Mobile Intel Pentium III
Processor-M............................................................................................ 15
Power Management............................................................................................. 15
2.2.1 Clock Control Architecture ...................................................................... 15
2.2.2 Normal State ........................................................................................... 15
2.2.3 Auto Halt State ........................................................................................ 16
2.2.4 Quick Start State..................................................................................... 17
2.2.5 HALT/Grant Snoop State ........................................................................ 18
2.2.6 Deep Sleep State.................................................................................... 18
2.2.7 Deeper Sleep State................................................................................. 18
2.2.8 Operating System Implications of Low-power States ............................. 19
2.2.9 Enhanced Intel SpeedStep Technology ................................................. 19
AGTL Signals ....................................................................................................... 19
Mobile Intel Pentium III Processor-M CPUID....................................................... 20
Processor System Signals ................................................................................... 21
3.1.1 Power Sequencing Requirements .......................................................... 22
3.1.2 Test Access Port (TAP) Connection ....................................................... 23
3.1.3 Catastrophic Thermal Protection ............................................................ 23
3.1.4 Unused Signals....................................................................................... 23
3.1.5 Signal State in Low-power States ........................................................... 23
3.1.5.1
System Bus Signals .............................................................. 23
3.1.5.2
CMOS and Open-drain Signals ............................................ 24
3.1.5.3
Other Signals ........................................................................ 24
Power Supply Requirements ............................................................................... 24
3.2.1 Decoupling Guidelines ............................................................................ 24
3.2.2 Voltage Planes........................................................................................ 25
3.2.3 Voltage Identification............................................................................... 25
System Bus Clock and Processor Clocking......................................................... 26
Mobile Intel Pentium III Processor-M Features.............................................................................. 14
2.2
2.3
2.4
3.
3.1
Electrical Specifications ................................................................................................................. 21
3.2
3.3
Mobile Intel
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Pentium
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III Processor-M Datasheet
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Introduction
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3.4
3.5
3.6
3.7
Enhanced Intel SpeedStep Technology ...............................................................26
Maximum Ratings.................................................................................................27
DC Specifications .................................................................................................27
AC Specifications .................................................................................................37
3.7.1 System Bus, Clock, APIC, TAP, CMOS, and Open-drain AC
Specifications ..........................................................................................37
4.
System Signal Simulations .............................................................................................................53
System Bus Clock (BCLK) and PICCLK DC Specifications and AC Signal
Quality Specifications ...........................................................................................53
4.2
AGTL AC Signal Quality Specifications................................................................55
4.3
Non-AGTL Signal Quality Specifications..............................................................56
4.3.1 PWRGOOD, VTTPWRGD Signal Quality Specifications........................57
4.3.1.1.1 VTTPWRGD Noise Parameter Specification...........57
4.3.1.2
VTTPWRGD Transition Parameter Recommendation..........58
4.3.1.2.1 Transition Region .....................................................58
4.3.1.2.2 Transition Time ........................................................58
4.3.1.2.3 Noise ........................................................................58
Mechanical Specifications ..............................................................................................................60
5.1
5.2
5.3
Socketable Micro-FCPGA Package .....................................................................60
Surface Mount Micro-FCBGA Package................................................................64
Signal Listings ......................................................................................................68
Thermal Diode ......................................................................................................76
Description............................................................................................................78
7.1.1 Quick Start Enable...................................................................................78
7.1.2 System Bus Frequency ...........................................................................78
7.1.3 APIC Enable ............................................................................................78
Clock Frequencies and Ratios .............................................................................78
Alphabetical Signal Reference .............................................................................79
Signal Summaries ................................................................................................89
Introduction..........................................................................................................91
Filter Specification ...............................................................................................91
Recommendation for Mobile Systems.................................................................92
Comments ...........................................................................................................93
4.1
5.
6.
7.
V
CC
Thermal Specifications ............................................................................................................75
6.1
7.1
Processor Initialization and Configuration ......................................................................................78
7.2
8.
8.1
8.2
A1.
A2.
A3.
A4.
Processor Interface ........................................................................................................................79
Appendix A. PLL RLC Filter Specification ...................................................................................................91
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Mobile Intel
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Pentium
®
III Processor-M Datasheet
Introduction
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Figures
Figure 1. Clock Control States .......................................................................................... 17
Figure 2. PLL RLC Filter ................................................................................................... 25
Figure 3. VTTPWRGD System-Level Connections .......................................................... 26
Figure 4. Illustration of V
CC
Static and Transient Tolerances (VID = 1.40 V) .................. 31
Figure 5. Illustration of Deep Sleep V
CC
Static and Transient Tolerances (VID Setting
= 1.40 V)............................................................................................................ 32
Figure 6. BCLK (Single Ended)/PICCLK/TCK Generic Clock Timing Waveform ............. 44
Figure 7. Differential BCLK/BCLK# Waveform (Common Mode) ..................................... 44
Figure 8. BCLK/BCLK# Waveform (Differential Mode)..................................................... 45
Figure 9. Valid Delay Timings ........................................................................................... 45
Figure 10. Setup and Hold Timings .................................................................................. 46
Figure 11. Cold/Warm Reset and Configuration Timings ................................................. 46
Figure 12. Power-on Sequence and Reset Timings ......................................................... 47
Figure 13. Power Down Sequencing and Timings (VCC Leading)................................... 48
Figure 14.Power Down Sequencing and Timings (V
CCT
Leading) .................................... 49
Figure 15.Test Timings (Boundary Scan) ......................................................................... 50
Figure 16. Test Reset Timings.......................................................................................... 50
Figure 17. Quick Start/Deep Sleep Timing (BCLK Stopping Method).............................. 51
Figure 18. Quick Start/Deep Sleep Timing (DPSLP# Assertion Method)......................... 51
Figure 19. Enhanced Intel SpeedStep Technology/Deep Sleep Timing .......................... 52
Figure 20. BCLK (Single Ended)/PICCLK Generic Clock Waveform ............................... 54
Figure 21. Maximum Acceptable Overshoot/Undershoot Waveform ............................... 55
Figure 22. VTTPWRGD Noise Specification .................................................................... 59
Figure 23. Socketable Micro-FCPGA Package – Top and Bottom Isometric Views ........ 61
Figure 24. Socketable Micro-FCPGA Package – Top and Side View .............................. 62
Figure 25. Socketable Micro-FCPGA Package – Bottom View ........................................ 63
Figure 26. Micro-FCBGA Package – Top and Bottom Isometric Views ........................... 65
Figure 27. Micro-FCBGA Package – Top and Side Views ............................................... 66
Figure 28. Micro-FCBGA Package – Bottom View ........................................................... 67
Figure 29. Pin/Ball Map – Top View.................................................................................. 68
Figure 30. PLL Filter Specifications .................................................................................. 92
Mobile Intel
®
Pentium
®
III Processor-M Datasheet
5
Test/Measurement
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