Multilayer Ceramic Capacitor
HC1 – Chip / Size 1206
Preleminary data sheet
(parameters may be changed if necessary)
HC1 / 1206 / 16V
B37578K9******
1206 High Cap Class 1 Capacitor
Todays electronic devices need more and more capacitors of small dimensions but high cap values of
class 1 characteristic (based on non-ferroelectric materials)
EPCOS HC1 capacitors provide high cap values in small chip sizes due to their special ceramic
material with a very high dielectric constant (ε) which is more than 5 times higher than the
ε
of the
conventional C0G – material.
The electrical behaviour of these capacitors are very close to that of the C0G-material, except for the
Temperature coefficient of capacitance (TCC) which is higher but does not exceed ± 4% between –
25°C and +85°C.
Features
•
•
•
•
•
•
•
•
•
High capacitance values
Characteristic of class 1 dielectric
Reduced chip thickness
No ageing effects
No voltage dependence
No piezoelectric effect
Nearly linear temperature coefficient of capacitance (TCC)
Low dielectric absorption
Suitable for Pb-free soldering processes
Applications
•
•
•
•
•
•
•
•
Mobile phones
Portable handheld products (e.g. PDA)
Notebook
Bluetooth applications
Remote keyless entry systems
ADSL – applications
USB Hub controllers
Set top boxes
ISSUE DATE
4.4.2002
ISSUE
b
PUBLISHER
EPCOS AG
PAGE
1/7
Multilayer Ceramic Capacitor
HC1 – Chip / Size 1206
Preleminary data sheet
(parameters may be changed if necessary)
HC1 / 1206 / 16V
B37578K9******
Order Code System
B37578
Type and Size:
K 9 103 J 0 62
HC1 / 1206
Class 1 Capacitor
Metallization Type:
K = Ag/Ni/Sn
Rated Voltage:
9 = 16V
Rated Capacitance:
103 = 10 x 10
3
pF
153 = 15 x 10
3
pF
473 = 47 x 10
3
pF
Capacitance Tolerance:
J = ±5%
K = ±10%
Internal Code
Part Dimensions
l
Packaging code:
72 = blister tape, 330mm reel
62 = blister tape, 180mm reel
b
l = 3,20 ± 0,20
b = 1,60 ± 0,15
s = 0,80 ± 0,10
k = 0,50 ± 0,25
All Dimensions in [mm].
s
k
ISSUE DATE
4.4.2002
ISSUE
b
PUBLISHER
EPCOS AG
PAGE
2/7
Multilayer Ceramic Capacitor
HC1 – Chip / Size 1206
Preleminary data sheet
(parameters may be changed if necessary)
HC1 / 1206 / 16V
B37578K9******
Electrical Data
Capacitance Test Conditions
Test frequency:
Test voltage:
Dissipation factor tan
δ
(limit value):
Insulation Resistance:
Capacitance Change vs. Temperature
Operating Temperature Range:
Ageing
voltage dependence
Available capacitance values:
1.0 kHz ± 0,2 kHz
1.0 V ± 0.2 V
< 1.0 x 10
-3
> 10
5
MΩ (at 25°C)
∆C/C
25
< ± 4% between –25°C and +85°C
-25°C ... +85°C
none
none
10nF ...68 nF (Serie E12)
Specifications and Test Methods
Item
Dielectric Strength
Specification
Test Method
No defects or abnormalties 250% of the rated voltage is applied between the
terminatios for 1 to 5 seconds, provided the
charge/discharge current is less than 50mA.
∆C/C
< 2%
tan
δ <
3*10
IR
4
-3
Dry heat test
> 10 MΩ
100% of the rate voltage is applied for
1000h +48/-0h at the maximum operating
temperatue ±3°C. The charge/discharge curent is
less than 50mA.
Solderabilitiy
Soldering coditions:
Reflow soldering conditions according to CECC 00802.
Testa ccording IEC 68-2-58:
Wettability Test: 215°C ± 3°C / 3 sec ± 0,3sec (wetting of soldering area > 95%)
Leaching Test: 260°C ± 5°C / 10sec ± 1sec (no leaching of contacts)
ISSUE DATE
4.4.2002
ISSUE
b
PUBLISHER
EPCOS AG
PAGE
3/7
Multilayer Ceramic Capacitor
HC1 – Chip / Size 1206
Preleminary data sheet
(parameters may be changed if necessary)
Temperature characteristics at terminals during infrared-reflow soldering:
HC1 / 1206 / 16V
B37578K9******
Reliability
Failure rate < 1 fit (failures in time)
ISSUE DATE
4.4.2002
ISSUE
b
PUBLISHER
EPCOS AG
PAGE
4/7
Multilayer Ceramic Capacitor
HC1 – Chip / Size 1206
Preleminary data sheet
(parameters may be changed if necessary)
HC1 / 1206 / 16V
B37578K9******
Taping
Taping according to IEC 60286-3
Dimensions and tolerances
Definition
Compartment width
Compartment length
Compartment height
Sprocket hole diameter
Compartment hole diameter
Sprocket hole pitch
Distance center hole to
center compartment
Pitch of the component
compartments
Tape width
Distance edge to center of
hole
Distance center hole to
center compartment
Distance compartment to
edge
Overall thickness
Thickness tape
1)
Symbol
A
0
B
0
K
0
D
0
D
1
P
0
P
2
P
1
W
E
Dim.
1.9
3.5
1.8
1.5
1.0
4.0
2.0
4.0
8.0
1.75
Tolerance
± 0.2
± 0.2
max.
+0.1 /-0
min.
± 0.1
1)
± 0.05
± 0.1
± 0.3
± 0.1
F
G
T
2
T
3.5
0.75
2.5
0.3
± 0.05
min.
max.
max.
≤
± 0.2 mm over any 10 pitches
ISSUE DATE
4.4.2002
ISSUE
b
PUBLISHER
EPCOS AG
PAGE
5/7
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