Multilayer Ceramic Chip Capacitors
FEATURES
• LOWER ESR - HIGH Q at HIGH FREQUENCY
• STABLE NPO CHARACTERISTICS OVER TEMPERATURE AND VOLTAGE
• EIA 0201, 0402, 0603 & 0805 CASE SIZES
• WIDE CAPACITANCE (UP TO 3,300pF) & VOLTAGE RANGE (UP TO 100VDC)
SPECIFICATIONS
Case Sizes
Capacitance Range*
Capacitance Tolerance
Operating Temperature Range
Temperature Characteristics
Rated Voltage
Q Factor*
ESR
Insulation Resistance
Dielectric Withstanding Voltage
Test Conditions (Cap. & Q)
NPO
0201
1.0pF ~ 15pF
0402
0603
0805
0.5pF ~ 470pF 0.5pF ~ 3300pF 1.0pF ~ 150pF
NMC-L Series
Cap. Values < 5pF: ±0.1pF(B), ±0.25pF(C)
Cap. Values 5pF ~ 8.2pF: ±0.25pF(C), ±0.5pF(D)
Cap. Values >10pF: ±1%(F), ±2%(G), ±5% (J)
-55°C ~ +125°C
0 ± 30PPM/°C
16Vdc, 25Vdc, 50Vdc
16Vdc, 25Vdc, 50Vdc & 100Vdc
Cap. Values <30pF: Q > 400 + 20C
Cap. Values >30pF: Q > 1000
Cap. Values < 2.2pF: <1000mΩ@900MHz ± 100MHz
Cap. Values 2.2pF ~ 470pF: <500mΩ@900MHz ± 100MHz
Cap. Values >470pF: <500mΩ@60MHz ± 10MHz
10,000 Megohms min. @ +25°C
250% of rated voltage for 1 ~ 5 seconds
*1.0 ± 0.2Vrms, 1MHz ±10% (<1000pF) or 1KHz ± 10% (>1000pF)
RoHS
Compliant
Includes all homogeneous materials
*See Part Number System for Details
See
EIA Case Size
Length (L)
Width (W)
Thickness (T)
Termination Width (P)
0201
0402
0603
0.6 ± 0.05 1.0 ± 0.05
1.6 ±0.10
0.3 ± 0.05 0.5 ± 0.05
0.8 ± 0.10
0.33 max. 0.60 max.
1.0 max.
0.10 ~ 0.20 0.15 ~ 0.30 0.12 ~ 0.55
0805
2.0 ±0.10
1.25 ± 0.10
1.3 max.
0.25 ~ 0.71
W
T
P
L
100% Sn over Ni barrier
P
PART NUMBER SYSTEM
NMC-L 0603 NPO 100 J 50 TRP F
RoHS Compliant
Series
Tape & Reel (Punched carrier)
Voltage (Vdc)
Capacitance Tolerance Code (see chart)
Capacitance Code, expressed in pF,
fi
rst 2 digits are
significant, 3rd digit is no. of zeros, “R” indicates
decimal for under 10pF
Temperature Characteristic
Size Code (see chart)
®
NIC COMPONENTS CORP.
www.niccomp.com
www.lowESR.com
www.RFpassives.com
www.SMTmagnetics.com
SPECIFICATIONS ARE SUBJECT TO CHANGE
1
Multilayer Ceramic Chip Capacitors
REEL
B
Taping Specifications
B
13 ± 0.5
C
50 min.
100 ± 1.0
100 ± 1.0
D
21 ± 1.0
T max.
8.4 +1.0/-0
(1812 case size
12.4 +2.0/-0)
REEL DIMENSIONS (mm)
Reel Diameter (A)
7” (178 ± 2.0)
10” (250 ± 2.0)
13” (330 ± 2.0)
D
7 INCH REEL QUANTITIES*
C
Size
Tape Size
Min. Qty
Per Reel
Max. Qty
Per Reel
01005
8mm
20,000
20,000
0201
8mm
20,000
20,000
0402
8mm
10,000
10,000
0603
8mm
4,000
4,000
0805
8mm
4,000
5,000
1206
8mm
4,000
5,000
1210
8mm
2,000
5,000
1812
12mm
1,000
2,000
*Quantity dependent on chip thickness. Contact NIC for reel
quantities on larger diameter reels.
T
A
CARRIER TAPE MATERIAL
Parts with a thickness of >1mm will be taped on embossed
plastic carrier. Parts with a thickness of less then 1mm
will be taped on paper carrier
EMBOSSED PLASTIC CARRIER TAPE DIMENSIONS (mm)
Tape Size
8mm
12mm
W
8.0 ± 0.2
12 ± 0.2
F
3.5 ± 0.05
5.5 ± 0.05
E
1.75 ± 0.10
P
0
4.0 ± 0.1
P
2
2.0 ± 0.5
D
1.5
+0.1-0.0
K max.
0.3
T max.
2.0
4.5
P
4.0 ± 0.1
8.0 ± 0.1
Notes:
1. Specifications are in compliance with EIA RS481-1-A
“Taping of surface Mount Components for Automatic Placement”
2. Dimensions Ao (max.) equals component width dimension plus 0.5mm
3. Dimension Bo (max.) equals component length dimension plus 0.5mm
EMBOSSED PLASTIC CARRIER TAPE
D
T
P
o
E
P
2
F
B
o
W
A
o
K
P
See notes 2 & 3 regarding dimensions
Ao and Bo
PUNCHED CARRIER TAPE DIMENSIONS (mm)
Type
A
o
B
o
W
F
E
P1
2.0 ± 0.05
8.0 ± 0.3
3.5 ± 0.05
1.75 ± 0.1
4.0 ± 0.10
01005 0.25 ± 0.04 0.45 ± 0.04
0201 0.37 ± 0.03 0.67 ± 0.05
0402 0.65 ± 0.05 1.15 ± 0.05
0603
1.1 ± 0.2
1.9 ± 0.2
0805 1.65 ± 0.2
2.4 ± 0.2
1206
2.0 ± 0.2
3.6 ± 0.2
P0
D0
T1
max.
0.27
0.45
1.1
T2
max.
0.36
0.80
1.4
Mounting
Hole
Angular
Punch
Hole
4.0 ± 0.1
1.5
+0.1/-0.0
PUNCHED CARRIER TAPE
D
t
1
P
o
E
B
o
F
W
®
t
2
A
o
Component
Pitch
P1
NIC COMPONENTS CORP.
www.niccomp.com
www.lowESR.com
www.RFpassives.com
www.SMTmagnetics.com
SPECIFICATIONS ARE SUBJECT TO CHANGE
5
Microcontroller MCU
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