FIFO, 8KX9, 25ns, Asynchronous, CMOS, PDIP28
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | Cypress Semiconductor |
| Reach Compliance Code | compliant |
| ECCN code | EAR99 |
| Maximum access time | 25 ns |
| Maximum clock frequency (fCLK) | 28.5 MHz |
| JESD-30 code | R-PDIP-T28 |
| JESD-609 code | e0 |
| memory density | 73728 bit |
| Memory IC Type | OTHER FIFO |
| memory width | 9 |
| Number of terminals | 28 |
| word count | 8192 words |
| character code | 8000 |
| Operating mode | ASYNCHRONOUS |
| Maximum operating temperature | 85 °C |
| Minimum operating temperature | -40 °C |
| organize | 8KX9 |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP28,.3 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| power supply | 5 V |
| Certification status | Not Qualified |
| Maximum standby current | 0.002 A |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | NO |
| technology | CMOS |
| Temperature level | INDUSTRIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| CY7C460A-25PTI | CY7C460A-10PTI | CY7C460A-10PI | CY7C460A-15PI | CY7C460A-15PTI | CY7C460A-25PI | |
|---|---|---|---|---|---|---|
| Description | FIFO, 8KX9, 25ns, Asynchronous, CMOS, PDIP28 | FIFO, 8KX9, 10ns, Asynchronous, CMOS, PDIP28 | FIFO, 8KX9, 10ns, Asynchronous, CMOS, PDIP28 | FIFO, 8KX9, 15ns, Asynchronous, CMOS, PDIP28 | FIFO, 8KX9, 15ns, Asynchronous, CMOS, PDIP28 | FIFO, 8KX9, 25ns, Asynchronous, CMOS, PDIP28 |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
| Maker | Cypress Semiconductor | Cypress Semiconductor | Cypress Semiconductor | Cypress Semiconductor | Cypress Semiconductor | Cypress Semiconductor |
| Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | compliant |
| ECCN code | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| Maximum access time | 25 ns | 10 ns | 10 ns | 15 ns | 15 ns | 25 ns |
| Maximum clock frequency (fCLK) | 28.5 MHz | 50 MHz | 50 MHz | 40 MHz | 40 MHz | 28.5 MHz |
| JESD-30 code | R-PDIP-T28 | R-PDIP-T28 | R-PDIP-T28 | R-PDIP-T28 | R-PDIP-T28 | R-PDIP-T28 |
| JESD-609 code | e0 | e0 | e0 | e0 | e0 | e0 |
| memory density | 73728 bit | 73728 bit | 73728 bit | 73728 bit | 73728 bit | 73728 bit |
| Memory IC Type | OTHER FIFO | OTHER FIFO | OTHER FIFO | OTHER FIFO | OTHER FIFO | OTHER FIFO |
| memory width | 9 | 9 | 9 | 9 | 9 | 9 |
| Number of terminals | 28 | 28 | 28 | 28 | 28 | 28 |
| word count | 8192 words | 8192 words | 8192 words | 8192 words | 8192 words | 8192 words |
| character code | 8000 | 8000 | 8000 | 8000 | 8000 | 8000 |
| Operating mode | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| Maximum operating temperature | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
| Minimum operating temperature | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| organize | 8KX9 | 8KX9 | 8KX9 | 8KX9 | 8KX9 | 8KX9 |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | DIP | DIP | DIP | DIP | DIP | DIP |
| Encapsulate equivalent code | DIP28,.3 | DIP28,.3 | DIP28,.6 | DIP28,.6 | DIP28,.3 | DIP28,.6 |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE |
| power supply | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Maximum standby current | 0.002 A | 0.002 A | 0.002 A | 0.002 A | 0.002 A | 0.002 A |
| Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| surface mount | NO | NO | NO | NO | NO | NO |
| technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| Temperature level | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
| Terminal pitch | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
| Terminal location | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
京公网安备 11010802033920号
EEWORLD
