Notes for CMOS Devices
1.
Precaution against ESD for semiconductors
Strong electric field, when exposed to a MOS device, can cause
destruction of the gate oxide and ultimately degrade the device operation.
Steps must be taken to stop generation of static electricity as much as
possible, and quickly dissipate it once, when it has occurred.
Environmental control must be adequate. When it is dry, humidifier should
be used. It is recommended to avoid using insulators that easily build static
electricity. Semiconductor devices must be stored and transported in an
anti-static container, static shielding bag or conductive material. All test
and measurement tools including work bench and floor should be
grounded. The operator should be grounded using wrist strap.
Semiconductor devices must not be touched with bare hands. Similar
precautions need to be taken for PW boards with semiconductor devices
on it.
2.
Handling of unused input pins for CMOS
No connection for CMOS device inputs can be cause of malfunction. If no
connection is provided to the input pins, it is possible that an internal input
level may be generated due to noise, etc., hence causing malfunction.
CMOS devices behave differently than Bipolar or NMOS devices. Input
levels of CMOS devices must be fixed high or low by using a pull-up or pull-
down circuitry. Each unused pin should be connected to VDD or GND with
a resistor, if it is considered to have a possibility of being an output pin. All
handling related to the unused pins must be judged device by device and
related specifications governing the devices.
3.
Status before initialization of MOS devices
Power-on does not necessarily define initial status of MOS device.
Production process of MOS does not define the initial operation status of
the device. Immediately after the power source is turned ON, the devices
with reset function have not yet been initialized. Hence, power-on does not
guarantee out-pin levels, I/O settings or contents of registers. Device is not
initialized until the reset signal is received. Reset operation must be
executed immediately after power-on for devices having reset function.
User’s Manual U18743EE1V2UM00
3
Legal Notes
• The information in this document is current as of June 2008. The information
is subject to change without notice. For actual design-in, refer to the latest
publications of NEC Electronics data sheets or data books, etc., for the most
up-to-date specifications of NEC Electronics products. Not all products and/
or types are available in every country. Please check with an NEC sales
representative for availability and additional information.
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• Descriptions of circuits, software and other related information in this
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operation and application examples. The incorporation of these circuits,
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"Specific":
Aircraft, aerospace equipment, submersible repeaters,
nuclear reactor control systems, life support systems and
medical equipment for life support, etc.
4
User’s Manual U18743EE1V2UM00
The quality grade of NEC Electronics products is “Standard” unless
otherwise expressly specified in NEC Electronics data sheets or data books,
etc. If customers wish to use NEC Electronics products in applications not
intended by NEC Electronics, they must contact NEC Electronics sales
representative in advance to determine NEC Electronics 's willingness to
support a given application.
Note
1.
"NEC Electronics" as used in this statement means NEC Electronics
Corporation and also includes its majority-owned subsidiaries.
2.
"NEC Electronics products" means any product developed or
manufactured by or for NEC Electronics (as defined above).
3.
SuperFlash® is a registered trademark of Silicon Storage Technology, Inc.
in several countries including the United States and Japan. This product
uses SuperFlash® technology licensed from Silicon Storage Technology,
Inc.
Caution
This document is a draft (a momentary snapshot) of a document under work.
Future versions of this document will not hold a history list of changes towards
this draft document.
User’s Manual U18743EE1V2UM00
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