|
FSYC055D3 |
FSYC055R3 |
FSYC055D1 |
FSYC055R4 |
| Description |
Power Field-Effect Transistor, 70A I(D), 60V, 0.012ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET |
Power Field-Effect Transistor, 70A I(D), 60V, 0.019ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET |
Power Field-Effect Transistor, 70A I(D), 60V, 0.019ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET |
Power Field-Effect Transistor, 70A I(D), 60V, 0.019ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET |
| Is it Rohs certified? |
incompatible |
incompatible |
incompatible |
incompatible |
| package instruction |
CHIP CARRIER, R-CBCC-N3 |
CHIP CARRIER, R-CBCC-N3 |
CHIP CARRIER, R-CBCC-N3 |
CHIP CARRIER, R-CBCC-N3 |
| Reach Compliance Code |
unknown |
unknown |
unknown |
unknown |
| ECCN code |
EAR99 |
EAR99 |
EAR99 |
EAR99 |
| Other features |
RADIATION HARDENED |
RADIATION HARDENED |
RADIATION HARDENED |
RADIATION HARDENED |
| Shell connection |
DRAIN |
DRAIN |
DRAIN |
DRAIN |
| Configuration |
SINGLE WITH BUILT-IN DIODE |
SINGLE WITH BUILT-IN DIODE |
SINGLE WITH BUILT-IN DIODE |
SINGLE WITH BUILT-IN DIODE |
| Minimum drain-source breakdown voltage |
60 V |
60 V |
60 V |
60 V |
| Maximum drain current (Abs) (ID) |
70 A |
70 A |
70 A |
70 A |
| Maximum drain current (ID) |
70 A |
70 A |
70 A |
70 A |
| Maximum drain-source on-resistance |
0.012 Ω |
0.019 Ω |
0.019 Ω |
0.019 Ω |
| FET technology |
METAL-OXIDE SEMICONDUCTOR |
METAL-OXIDE SEMICONDUCTOR |
METAL-OXIDE SEMICONDUCTOR |
METAL-OXIDE SEMICONDUCTOR |
| JESD-30 code |
R-CBCC-N3 |
R-CBCC-N3 |
R-CBCC-N3 |
R-CBCC-N3 |
| JESD-609 code |
e0 |
e0 |
e0 |
e0 |
| Number of components |
1 |
1 |
1 |
1 |
| Number of terminals |
3 |
3 |
3 |
3 |
| Operating mode |
ENHANCEMENT MODE |
ENHANCEMENT MODE |
ENHANCEMENT MODE |
ENHANCEMENT MODE |
| Maximum operating temperature |
150 °C |
150 °C |
150 °C |
150 °C |
| Package body material |
CERAMIC, METAL-SEALED COFIRED |
CERAMIC, METAL-SEALED COFIRED |
CERAMIC, METAL-SEALED COFIRED |
CERAMIC, METAL-SEALED COFIRED |
| Package shape |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
| Package form |
CHIP CARRIER |
CHIP CARRIER |
CHIP CARRIER |
CHIP CARRIER |
| Polarity/channel type |
N-CHANNEL |
N-CHANNEL |
N-CHANNEL |
N-CHANNEL |
| Maximum power dissipation(Abs) |
162 W |
162 W |
162 W |
162 W |
| Maximum pulsed drain current (IDM) |
200 A |
200 A |
200 A |
200 A |
| Certification status |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
| surface mount |
YES |
YES |
YES |
YES |
| Terminal surface |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
| Terminal form |
NO LEAD |
NO LEAD |
NO LEAD |
NO LEAD |
| Terminal location |
BOTTOM |
BOTTOM |
BOTTOM |
BOTTOM |
| transistor applications |
SWITCHING |
SWITCHING |
SWITCHING |
SWITCHING |
| Transistor component materials |
SILICON |
SILICON |
SILICON |
SILICON |
| Maker |
Harris |
Harris |
- |
Harris |