MC14097BCL datasheet, PDF - EEWORLD Datasheet

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MC14097BCL: DescriptionIC,ANALOG MUX,SINGLE,8-CHANNEL,CMOS,DIP,24PIN,CERAMIC; CategoryAnalog mixed-signal IC The signal circuit; File Size532KB，10 Pages; ManufacturerNXP; Websitehttps://www.nxp.com

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MC14097BCL Overview

IC,ANALOG MUX,SINGLE,8-CHANNEL,CMOS,DIP,24PIN,CERAMIC

MC14097BCL Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	NXP
package instruction	DIP, DIP24,.6
Reach Compliance Code	unknown
Analog Integrated Circuits - Other Types	DIFFERENTIAL MULTIPLEXER
JESD-30 code	R-XDIP-T24
JESD-609 code	e0
Number of channels	8
Number of functions	1
Number of terminals	24
Maximum on-state resistance (Ron)	600 Ω
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
Package body material	CERAMIC
encapsulated code	DIP
Encapsulate equivalent code	DIP24,.6
Package shape	RECTANGULAR
Package form	IN-LINE
power supply	5/15 V
Certification status	Not Qualified
Maximum signal current	0.025 A
Maximum supply current (Isup)	0.6 mA
surface mount	NO
Maximum connection time	1300 ns
technology	CMOS
Temperature level	MILITARY
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL

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MC14097BCL Related Products

	MC14097BCL	MC14067BCL	MC14067BCP	MC14067BCPS
Description	IC,ANALOG MUX,SINGLE,8-CHANNEL,CMOS,DIP,24PIN,CERAMIC	IC,ANALOG MUX,SINGLE,16-CHANNEL,CMOS,DIP,24PIN,CERAMIC	IC,ANALOG MUX,SINGLE,16-CHANNEL,CMOS,DIP,24PIN,PLASTIC	IC,ANALOG MUX,SINGLE,16-CHANNEL,CMOS,DIP,24PIN,PLASTIC
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible
package instruction	DIP, DIP24,.6	DIP, DIP24,.6	DIP, DIP24,.6	DIP, DIP24,.6
Reach Compliance Code	unknown	unknown	unknown	unknown
Analog Integrated Circuits - Other Types	DIFFERENTIAL MULTIPLEXER	SINGLE-ENDED MULTIPLEXER	SINGLE-ENDED MULTIPLEXER	SINGLE-ENDED MULTIPLEXER
JESD-30 code	R-XDIP-T24	R-XDIP-T24	R-PDIP-T24	R-PDIP-T24
JESD-609 code	e0	e0	e0	e0
Number of channels	8	16	16	16
Number of functions	1	1	1	1
Number of terminals	24	24	24	24
Maximum operating temperature	125 °C	125 °C	125 °C	85 °C
Minimum operating temperature	-55 °C	-55 °C	-55 °C	-40 °C
Package body material	CERAMIC	CERAMIC	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	DIP	DIP	DIP	DIP
Encapsulate equivalent code	DIP24,.6	DIP24,.6	DIP24,.6	DIP24,.6
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	IN-LINE	IN-LINE	IN-LINE
power supply	5/15 V	5/15 V	5/15 V	5/15 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified
surface mount	NO	NO	NO	NO
technology	CMOS	CMOS	CMOS	CMOS
Temperature level	MILITARY	MILITARY	MILITARY	INDUSTRIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE
Terminal pitch	2.54 mm	2.54 mm	2.54 mm	2.54 mm
Terminal location	DUAL	DUAL	DUAL	DUAL
Maker	NXP	-	NXP	NXP
Maximum on-state resistance (Ron)	600 Ω	1300 Ω	1300 Ω	-
Maximum signal current	0.025 A	0.025 A	0.025 A	-
Maximum supply current (Isup)	0.6 mA	0.6 mA	0.6 mA	-
Maximum connection time	1300 ns	600 ns	600 ns	-

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