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WMS512K8-55FM

Description
Standard SRAM, 512KX8, 55ns, CMOS, CDFP36, CERAMIC, DFP-36
Categorystorage    storage   
File Size1MB,11 Pages
ManufacturerMicrosemi
Websitehttps://www.microsemi.com
Download Datasheet Parametric View All

WMS512K8-55FM Overview

Standard SRAM, 512KX8, 55ns, CMOS, CDFP36, CERAMIC, DFP-36

WMS512K8-55FM Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerMicrosemi
Parts packaging codeDFP
package instructionDFP, FL36,.5
Contacts36
Reach Compliance Codeunknown
ECCN code3A001.A.2.C
Maximum access time55 ns
I/O typeCOMMON
JESD-30 codeR-CDFP-F36
JESD-609 codee4
length23.37 mm
memory density4194304 bit
Memory IC TypeSTANDARD SRAM
memory width8
Number of functions1
Number of ports1
Number of terminals36
word count524288 words
character code512000
Operating modeASYNCHRONOUS
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
organize512KX8
Output characteristics3-STATE
ExportableYES
Package body materialCERAMIC, METAL-SEALED COFIRED
encapsulated codeDFP
Encapsulate equivalent codeFL36,.5
Package shapeRECTANGULAR
Package formFLATPACK
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)NOT SPECIFIED
Certification statusNot Qualified
reverse pinoutNO
Maximum seat height2.72 mm
Maximum standby current0.00045 A
Minimum standby current4.5 V
Maximum slew rate0.16 mA
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountYES
technologyCMOS
Temperature levelMILITARY
Terminal surfaceGold (Au)
Terminal formFLAT
Terminal pitch1.27 mm
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED
width12.95 mm
WMS512K8-XXX
512Kx8 MONOLITHIC SRAM, SMD 5962-95613
FEATURES

Access Times 15, 17, 20, 25, 35, 45, 55ns

MIL-STD-883 Compliant Devices Available

Revolutionary, Center Power/Ground Pinout JEDEC
Approved
• 36 lead Ceramic SOJ (Package 100)
• 36 lead Ceramic Flat Pack (Package 226)

Evolutionary, Corner Power/Ground Pinout JEDEC
Approved
• 32 pin Ceramic DIP (Package 300)
• 32 lead Ceramic SOJ (Package 101)
• 32 lead Ceramic Thinpack™ Flat Pack (Package 321)
• 32 pin, Rectangular Ceramic Leadless Chip Carrier
(Package 601)
• Commercial, Industrial and Military Temperature Range
• 5V Power Supply
• Low Power CMOS
• Low Power Data Retention for Battery Back-up Operation
• TTL Compatible Inputs and Outputs
*This product is subject to change without notice.
REVOLUTIONARY PINOUT
36 FLAT PACK
36 CSOJ
TOP VIEW
A0
A1
A2
A3
A4
CS#
I/O0
I/O1
V
CC
V
SS
I/O2
I/O3
WE#
A5
A6
A7
A8
A9
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
36
35
34
33
32
31
30
29
28
27
26
25
24
23
22
21
20
19
EVOLUTIONARY PINOUT
32 DIP
32 CSOJ (DE)
32 FLAT PACK (FF)
TOP VIEW
A12
32 CLCC
TOP VIEW
A14
A16
A18
A15
NC
A18
A17
A16
A15
OE#
I/O7
I/O6
V
SS
V
CC
I/O5
I/O4
A14
A13
A12
A11
A10
NC
A18
A16
A14
A12
A7
A6
A5
A4
A3
A2
A1
A0
I/O0
I/O1
I/O2
V
SS
I/O1
I/O2
I/O3
I/O4
I/O5
PIN DESCRIPTION
A0-18
I/O 0-7
CS#
OE#
WE#
V
CC
GND
Address Inputs
Data Input/Output
Chip Select
Output Enable
Write Enable
+5.0V Power
Ground
Microsemi Corporation reserves the right to change products or specifications without notice.
April 2012
Rev. 13
© 2012 Microsemi Corporation. All rights reserved.
1
Microsemi Corporation • (602) 437-1520 • www.microsemi.com/pmgp
www.whiteedc.com
I/O6
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
V
CC
A15
A17
WE#
A13
A8
A9
A11
OE#
A10
CS#
I/O7
I/O6
I/O5
I/O4
I/O3
4 3 2 1 32 31 30
A7
A6
A5
A4
A3
A2
A1
A0
I/O
0
5
29
6
28
7
27
8
26
9
25
10
24
11
23
12
22
13
21
14 15 16 17 18 19 20
V
SS
WE#
A13
A8
A9
A11
OE#
A10
CS#
I/O7
A17
V
CC
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