IXDD509 / IXDE509
9 Ampere Low-Side Ultrafast MOSFET Drivers
with Enable for fast, controlled shutdown
Features
• Built using the advantages and compatibility
of CMOS and IXYS HDMOS
TM
processes
• Latch-Up Protected up to 9 Amps
• High 9A peak output current
• Wide operating range: 4.5V to 30V
•
-55°C
to +125°C Extended operating
temperature
• Ability to disable output under faults
• High capacitive load drive capability:
1800pF in <15ns
• Matched rise and fall times
• Low propagation delay time
• Low output impedance
• Low supply current
General Description
The IXDD509 and IXDE509 are high speed high current gate
drivers specifically designed to drive the largest IXYS
MOSFETs & IGBTs to their minimum switching time and
maximum parctical frequency limits. The IXDD509 and
IXDE509 can source and sink 9 Amps of Peak Current
while producing voltage rise and fall times of less than
30ns. The inputs of the Drivers are compatible with TTL or
CMOS and are virtually immune to latch up over the entire
operating range. Patented* design innovations eliminate
cross conduction and current "shoot-through". Improved
speed and drive capabilities are further enhanced by
matched rise and fall times.
The IXDD509 and IXDE509 incorporate a unique ability to
disable the output under fault conditions. When a logical
low is forced into the Enable input, both final output stage
MOSFETs, (NMOS and PMOS) are turned off. As a result,
the output of the IXDD509 or IXDE509 enters a tristate high
impedance mode and with additional circuitry, achieves a
Soft Turn-Off of the MOSFET/IGBT when a short circuit is
detected. This helps prevent damage that could occur to
the MOSFET/IGBT if it were to be switched off abruptly due
to a dv/dt over-voltage transient.
The IXDD509 and IXDE509 are available in the 8-Pin P-DIP
(PI) package, the 8-Pin SOIC (SIA) package, and the 6-
Lead DFN (D1) package, (which occupies less than 65% of
the board area of the 8-Pin SOIC).
*United States Patent 6,917,227
Applications
•
•
•
•
•
•
•
•
•
•
•
Driving MOSFETs and IGBTs
Limiting di/dt under short circuit
Motor controls
Line drivers
Pulse generators
Local power ON/OFF switch
Switch mode power supplies (SMPS)
DC to DC converters
Pulse transformer driver
Class D switching amplifiers
Power charge pumps
Ordering Information
Part Number
IXDD509PI
IXDD509SIA
IXDD509SIAT/R
IXDD509D1
IXDD509D1T/R
IXDE509PI
IXDE509SIA
IXDE509SIAT/R
IXDE509D1
IXDE509D1T/R
Description
9A Low Side Gate Driver I.C.
9A Low Side Gate Driver I.C.
9A Low Side Gate Driver I.C.
9A Low Side Gate Driver I.C.
9A Low Side Gate Driver I.C.
9A Low Side Gate Driver I.C.
9A Low Side Gate Driver I.C.
9A Low Side Gate Driver I.C.
9A Low Side Gate Driver I.C.
9A Low Side Gate Driver I.C.
Package
Type
8-Pin PDIP
8-Pin SOIC
8-Pin SOIC
6-Lead DFN
6-Lead DFN
8-Pin PDIP
8-Pin SOIC
8-Pin SOIC
6-Lead DFN
6-Lead DFN
Packing Style
Tube
Tube
13” Tape and Reel
2” x 2” Waffle Pack
13” Tape and Reel
Tube
Tube
13” Tape and Reel
2” x 2” Waffle Pack
13” Tape and Reel
Pack
Qty
50
94
2500
56
2500
50
94
2500
56
2500
Configuration
Non-Inverting
with Enable
Inverting
with Enable
NOTE:
All parts are lead-free and RoHS Compliant
Copyright © 2007 IXYS CORPORATION All rights reserved
DS99679A(10/07)
First Release
IXDD509 / IXDE509
Figure 1 - IXDD509 9A Non-Inverting Gate Driver Functional Block Diagram
Vcc
Vcc
200 K
P
IN
ANTI-CROSS
CONDUCTION
CIRCUIT
*
*
OUT
N
E
N
GND
GND
Figure 2 - IXDE509 Inverting 9A Gate Driver Functional Block Diagram
Vcc
Vcc
200 K
P
IN
ANTI-CROSS
CONDUCTION
CIRCUIT
*
OUT
N
E
N
GND
GND
*
United States Patent 6,917,227
Copyright © 2007 IXYS CORPORATION All rights reserved
2
IXDD509 / IXDE509
Absolute Maximum Ratings
(1)
Parameter
Supply Voltage
All Other Pins (unless specified
otherwise)
Junction Temperature
Storage Temperature
Lead Temperature (10 Sec)
Value
35 V
-0.3 V to V
CC
+ 0.3V
150
°
C
-65
°
C to 150
°
C
300
°
C
Operating Ratings
(2)
Parameter
Value
Operating Supply Voltage
4.5V to 30V
Operating Temperature Range
-55
°
C to 125
°
C
Package Thermal Resistance
*
θ
J-A
(typ) 125
°
C/W
8-PinPDIP
(PI)
8-Pin SOIC
(SIA)
θ
J-A
(typ) 200
°
C/W
6-Lead DFN
(D1)
θ
J-A
(typ) 125-200
°
C/W
θ
J-C
(max) 2.0
°
C/W
6-Lead DFN
(D1)
6-Lead DFN
(D1)
θ
J-S
(typ)
6.3 °
C/W
Electrical Characteristics @ T
A
= 25
o
C
(3)
Unless otherwise noted, 4.5V
≤
V
CC
≤
30V .
All voltage measurements with respect to GND. IXD_509 configured as described in
Test Conditions.
(4)
Symbol
V
IH
, V
ENH
V
IL
, V
ENL
V
IN
V
EN
I
IN
V
OH
V
OL
R
OH
R
OL
I
PEAK
I
DC
t
R
t
F
t
ONDLY
t
OFFDLY
t
ENOH
t
DOLD
V
CC
I
CC
Parameter
High input & EN voltage
Low input & EN voltage
Input voltage range
Enable voltage range
Input current
High output voltage
Low output voltage
High state output
resistance
Low state output
resistance
Peak output current
Continuous output current
Rise time
Fall time
On-time propagation
delay
Off-time propagation
delay
Enable to output high
delay time
Disable to output high
impedance delay time
Power supply voltage
Power supply current
Test Conditions
4.5V
≤
V
CC
≤
18V
4.5V
≤
V
CC
≤
18V
Min
2.4
Typ
Max
0.8
Units
V
V
V
V
µA
V
V
Ω
Ω
A
-5
-.3
0V
≤
V
IN
≤
V
CC
-10
V
CC
- 0.025
V
CC
+ 0.3
V
CC
+ 0.3
10
0.025
V
CC
= 18V
V
CC
= 18V
V
CC
= 15V
Limited by package power
dissipation
C
LOAD
=10,000pF V
CC
=18V
C
LOAD
=10,000pF V
CC
=18V
C
LOAD
=10,000pF V
CC
=18V
C
LOAD
=10,000pF V
CC
=18V
V
CC
=18V
V
CC
=18V
4.5
V
CC
= 18V, V
IN
= 0V
V
IN
= 3.5V
V
IN
= V
CC
0.6
0.4
9
1
0.8
2
25
23
18
19
25
60
18
1
45
40
35
30
50
80
30
75
3
75
A
ns
ns
ns
ns
ns
ns
V
µA
mA
mA
IXYS reserves the right to change limits, test conditions, and dimensions.
3
IXDD509 / IXDE509
Electrical Characteristics @ temperatures over -55
o
C to 125
o
C
(3)
Unless otherwise noted, 4.5V
≤
V
CC
≤
30V , Tj < 150
o
C
All voltage measurements with respect to GND. IXD_502 configured as described in
Test Conditions.
All specifications are for one channel.
(4)
Symbol
V
IH
V
IL
V
IN
I
IN
V
OH
V
OL
R
OH
R
OL
I
DC
t
R
t
F
t
ONDLY
t
OFFDLY
t
ENOH
t
DOLD
V
CC
I
CC
Parameter
High input voltage
Low input voltage
Input voltage range
Input current
High output voltage
Low output voltage
High state output
resistance
Low state output
resistance
Continuous output
current
Rise time
Fall time
On-time propagation
delay
Off-time propagation
delay
Enable to output high
delay time
Disable to output high
impedance delay time
Power supply voltage
Power supply current
Test Conditions
4.5V
≤
V
CC
≤
18V
4.5V
≤
V
CC
≤
18V
Min
2.4
Typ
Max
0.8
Units
V
V
V
µA
V
V
Ω
Ω
A
ns
ns
ns
ns
ns
ns
V
µA
mA
mA
-5
0V
≤
V
IN
≤
V
CC
-10
V
CC
- 0.025
V
CC
+ 0.3
10
0.025
V
CC
= 18V
V
CC
= 18V
2
1.5
1
C
LOAD
=10,000pF V
CC
=18V
C
LOAD
=10,000pF V
CC
=18V
C
LOAD
=10,000pF V
CC
=18V
C
LOAD
=10,000pF V
CC
=18V
V
CC
= 18V
V
CC
= 18V
4.5
V
CC
= 18V, V
IN
= 0V
V
IN
= 3.5V
V
IN
= V
CC
18
60
60
55
40
60
100
30
0.13
3
0.13
Notes:
1. Operating the device beyond the parameters listed as “Absolute Maximum Ratings” may cause permanent
damage to the device. Exposure to absolute maximum rated conditions for extended periods may affect device
reliability.
2. The device is not intended to be operated outside of the Operating Ratings.
3. Electrical Characteristics provided are associated with the stated Test Conditions.
4. Typical values are presented in order to communicate how the device is expected to perform, but not necessarily
to highlight any specific performance limits within which the device is guaranteed to function.
The following notes are meant to define the conditions for the
θ
J-A
,
θ
J-C
and
θ
J-S
values:
1) The
θ
J-A
(typ) is defined as junction to ambient. The
θ
J-A
of the standard single die 8-Lead PDIP and 8-Lead SOIC are dominated by the
resistance of the package, and the IXD_5XX are typical. The values for these packages are natural convection values with vertical boards
and the values would be lower with forced convection. For the 6-Lead DFN package, the
θ
J-A
value supposes the DFN package is
soldered on a PCB. The
θ
J-A
(typ) is 200
°
C/W with no special provisions on the PCB, but because the center pad provides a low
thermal resistance to the die, it is easy to reduce the
θ
J-A
by adding connected copper pads or traces on the PCB. These can reduce
the
θ
J-A
(typ) to 125
°
C/W easily, and potentially even lower. The
θ
J-A
for DFN on PCB without heatsink or thermal management will
vary significantly with size, construction, layout, materials, etc. This typical range tells the user what he is likely to get if he does no
thermal management.
2)
θ
J-C
(max) is defined as juction to case, where case is the large pad on the back of the DFN package. The
θ
J-C
values are generally not
published for the PDIP and SOIC packages. The
θ
J-C
for the DFN packages are important to show the low thermal resistance from junction to
the die attach pad on the back of the DFN, -- and a guardband has been added to be safe.
3) The
θ
J-S
(typ) is defined as junction to heatsink, where the DFN package is soldered to a thermal substrate that is mounted on a heatsink.
The value must be typical because there are a variety of thermal substrates. This value was calculated based on easily available IMS in the
U.S. or Europe, and not a premium Japanese IMS. A 4 mil dialectric with a thermal conductivity of 2.2W/mC was assumed. The result was
given as typical, and indicates what a user would expect on a typical IMS substrate, and shows the potential low thermal resistance for the
DFN package.
Copyright © 2007 IXYS CORPORATION All rights reserved
*
4
IXDD509 / IXDE509
Pin Description
PIN
1,8
2
3
6,7
SYMBOL
V
CC
IN
EN
OUT
FUNCTION
Supply Voltage
Input
Enable
Output
DESCRIPTION
Power supply input voltage. These pins provide power to
the entire device. The range for this voltage is from 4.5V to
30V.
Input signal-TTL or CMOS compatible.
The device ENABLE pin. This pin, when driven low,
disables the chip, forcing a high impedance state at the
output. EN can be pulled high by a resistor.
Driver Output. For application purposes, these pins are
connected, through a resistor, to Gate of a MOSFET/IGBT.
The device ground pins. Internally connected to all circuitry,
these pins provide ground reference for the entire chip and
should be connected to a low noise analog ground plane for
optimum performance.
4,8
GND
Ground
CAUTION: Follow proper ESD procedures when handling and assembling this component.
PIN CONFIGURATIONS
8 PIN DIP (PI)
8 PIN SOIC (SIA)
VCC
IN
EN
GND
1
2
3
4
I
X
D
E
5
0
9
8
7
6
5
VCC
OUT
OUT
GND
VCC
IN
EN
GND
1
2
3
4
8 PIN DIP (PI)
8 PIN SOIC (SIA)
I
X
D
D
5
0
9
8
7
6
5
VCC
OUT
OUT
GND
6 LEAD DFN (D1)
(Bottom View)
I
X
D
E
5
0
9
6 LEAD DFN (D1)
(Bottom View)
I
X
D
D
5
0
9
VCC
OUT
GND
6
5
4
1 IN
2 EN
3 GND
VCC
OUT
GND
6
5
4
1 IN
2 EN
3 GND
NOTE:
Solder tabs on bottoms of DFN packages are grounded
Figure 3 - Characteristics Test Diagram
V
OUT
Vcc
0V
1
8
IXDD / IXDE
V
IN
5V
0V
IXDD
Vcc
IXDE
Agilent 1147A
Current Probe
Vcc
10uf
0.01uf
2
7
6
5
0V
V
IN
3
4
C
LOAD
IXYS reserves the right to change limits, test conditions, and dimensions.
5
Microcontroller MCU
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