MODEL BMB SERIES
Surface Mount
Multi-Layer
Chip Beads
Sizes: 0603 to 1812
OUTSTANDING FEATURES
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Monolithic structures for high reliability
Choice of various sizes and materials for a wide range of application
Designed to offer high impedance for volume
Compatible with vapor phase and infrared reflow soldering
Wide frequency range — 1 MHz to 500 MHz
OUTLINE DIMENSIONS (Inch/mm)
APPLICATIONS
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•
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Instrumentation
Mobile communication equipment
Notebook computers
Video and audio equipment
Video games
Medical equipment
C
Ferrite
B
Terminal
Electrode
A
6
ENVIRONMENTAL
• Operating temperature
• Storage temperature
• Resistance to solder heat
Specifications subject to change without notice.
–25°C to +85°C
–40°C to +85°C
260°C for 10 sec.
D
Inch/mm
Model
BMB 0603
(1608)
BMB 0805
(2012)
BMB 1206
(3216)
BMB 1210
(3225)
BMB 1806
(4516)
BMB 1812
(4532)
A Dim.
.063±.006
1.6±0.15
.079±.008
2±0.2
.126±.008
3.2±0.2
.126±.008
3.2±0.2
.18±.008
4.5±0.2
.18±.008
4.5±0.2
B Dim.
.031±.006
0.8±0.15
.049±.008
1.25±0.2
.063±.008
1.6±0.2
.098±.008
2.5±0.2
.063±.008
1.6±0.2
.126±.008
3.2±0.2
C Dim.
.031±.006
0.8±0.15
.035±.008
0.9±0.2
.043±.008
1.1±0.2
.051±.008
1.3±0.2
.063±.008
1.6±0.2
.051±.008
1.3±0.2
D Dim.
0.012±.006
0.3±0.15
0.020±.008
0.5±0.2
0.020±.008
0.5±0.2
.012±.003
0.3±0.2
.012±.003
0.3±0.2
.012±.003
0.3±0.2
6-13
Model BMB Series
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EEWORLD
