Bulletin I0490J rev. A 03/07
SC220.....5. Series
SCHOTTKY DIE 220 x 220 mils
40 (157)
Wafer flat alligned with
side b of the die
a
c
0.35 ± 0.01
(14 ± 0.4)
D
b
d
C
A
NOTES:
Ø
Ø 125 (492)
1. ALL DIMENSIONS ARE SHOWN IN
MILLIMETERS (MILS).
2. CONTROLLING DIMENSION: (MILS).
3. LETTER DESIGNATION:
A = Anode (Top Metal)
C = Cathode (Back Metal)
D = Reject Ink Dot (only on non-conforming dies)
NOT TO SCALE
4. SAWING:
Recommended Blade
SEMITEC S1025 QS00 Blade
Sawing Street
0.05 +0, - 0.005
(2 +0, - 0.2)
5. DIMENSIONS AND TOLERANCES
Device
#
SC220
R
015x5x
SC220
S
020x5x
SC220
S
030x5x
SC220
S
045x5x
SC220
S
060x5x
SC220
H
045x5x
SC220
H
100x5x
SC220
H
150x5x
T
J
Max.
(°C)
125
150
150
150
150
175
175
175
V
R
(V)
15
20
30
45
60
45
100
150
A
B
C
D
diameter
5.59 ± 0.01
(220 ± 0.4)
5.59 ± 0.01
5.44 ± 0.01
5.44 ± 0.01
(220 ± 0.4)
(214 ± 0.4)
(214 ± 0.4)
n.a. contact factory
5.59 ± 0.01
(220 ± 0.4)
5.59 ± 0.01
(220 ± 0.4)
5.44 ± 0.01
(214 ± 0.4)
5.44 ± 0.01
(214 ± 0.4)
5.44 ± 0.01
(214 ± 0.4)
5.44 ± 0.01
(214 ± 0.4)
0.5 ± 0.1
20 ± 4
5.59 ± 0.01
(220 ± 0.4)
5.59 ± 0.01
(220 ± 0.4)
0.5 ± 0.1
20 ± 4
0.5 ± 0.1
20 ± 44
n.a. contact factory
5.59 ± 0.01
(220 ± 0.4)
5.59 ± 0.01
(220 ± 0.4)
5.59 ± 0.01
(220 ± 0.4)
5.59 ± 0.01
(220 ± 0.4)
5.44 ± 0.01
(214 ± 0.4)
5.44 ± 0.01
(214 ± 0.4)
5.44 ± 0.01
(214 ± 0.4)
5.44 ± 0.01
(214 ± 0.4)
0.5 ± 0.1
20 ± 4
0.5 ± 0.1
20 ± 4
n.a. contact factory
1
SC220.....5.
Bulletin I0490J rev. A 03/07
Electrical Characteristics
Device
#
SC220
R
015x5x
SC220
S
020x5x
SC220
S
030x5x
SC220
S
045x5x
SC220
S
060x5x
SC220
H
045x5x
SC220
H
100x5x
SC220
H
150x5x
T
J
Max.
(°C)
125
150
150
150
150
175
175
175
V
R
(V)
15
20
30
45
60
45
100
150
60
26
600
450
Typ. I
R
@ 25°C
(μA)
9000
Typ. I
R
@ 125°C Max. V
F
@ I
F
@ 25°C
(mA)
2500
(V)
0.37 @ 55A
Package
Style
D-61 genIII
package
n.a. contact factory
300
210
0.49 @ 55A
0.54 @ 55A
D-61 genIII
package
D-61 genIII
package
n.a. contact factory
35
20
0.61 @ 55A
0.81 @ 55A
D-61 genIII
package
D-61 genIII
package
n.a. contact factory
Mechanical Data
Device
#
SC220xxxx
A
5x
SC220xxxx
S
5x
Bondable
Solderable
--
Ti 2 kÅ
Metal Thickness
Front Metal
Al (1% Si) 30 kÅ
Ni 1 kÅ
--
Ag 35 kÅ
Cr 1 kÅ
Cr 1 kÅ
Metal Thickness
Back Metal
Ni 2 kÅ
Ni 2 kÅ
Ag 3 kÅ
Ag 3 kÅ
Recommended Storage Environment: Store in original container, in dessicated nitrogen, with no contamination.
Shelf life for parts stored in above condition is 2 years.
If the storage is done in normal atmosphere shelf life is reduced to six months.
Packaging
Device
#
SC220xxxxx5
B
SC220xxxxx5
R
SC220xxxxx5
P
SC220xxxxx5
F
Description
Minimum Order Quantity
Die in Sale Package
273
8000
273
273
Inked Probed Unsawn Wafer (Wafer in Box)
Probed Die in Tape & Reel
Probed Die in Waffle Pack
Inked Probed Sawn Wafer on Film
2
www.irf.com
SC220.....5.
Bulletin I0490J rev. A 03/07
Ordering Information Table
Device Code
SC
1
1
2
3
4
5
6
7
-
-
-
-
-
-
-
Schottky Die
Die Size Code
220
2
S
3
100
4
A
5
5
6
B
7
H = 830 Process
Process (see Electrical Characteristics Table)
Voltage code: Code = V
RRM
Chip surface metallization (see Mechanical Data Table)
Wafer Diameter in inches
Packaging (see Packaging Table)
R = OR'ing Process
S = Standard Process
Wafer on Film
www.irf.com
3
SC220.....5.
Bulletin I0490J rev. A 03/07
Wafer in Box
ROUND CONTAINER
TYVEK DISK
FOAM DISK
Die in Waffle Pack
CHIP TRAY POCKET
4
www.irf.com
SC220.....5.
Bulletin I0490J rev. A 03/07
Tape and Reel
REEL FRAME
BARE DIE CARRIER TAPE
Data and specifications subject to change without notice.
This product has been designed and qualified for Industrial Level.
Qualification Standards can be found on IR's Web site.
IR WORLD HEADQUARTERS:
233 Kansas St., El Segundo, California 90245, USA Tel: (310) 252-7105
TAC Fax: (310) 252-7309
Visit us at www.irf.com for sales contact information. 03/07
www.irf.com
5
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