DSF0.5A-DSF0.5K
Surface Mount Superfast Rectifiers
Features
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Low profile space
Ideal for automated placement
Glass passivated chip junctions
Low forward voltage drop
Low leakage current
High forward surge capability
High temperature soldering：
260℃/10 seconds at terminals
Component in accordance to
RoHS 2002/95/1 and WEEE 2002/96/EC
Case:
JEDEC SOD-123FL molded plastic
body over glass passivated chip
Terminals:
Solder plated, solderable per
J-STD-002B and JESD22-B102D
Polarity:
Laser band denotes cathode end
Weight:
0.017gram
SOD-123FL
Cathode Band
Top View
2.8
±
0.1
1.4± 0.15
0.10-0.30
0.6
±
0.25
3.7
±
0.2
Mechanical Date
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Dimensions in millimeters
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Maximum Ratings & Thermal Characteristics & Electrical Characteristics
(T
A
= 25 °C unless otherwise noted)
DSF- Symbol
Maximum repetitive peak reverse voltage
Maximum RMS voltage
Maximum DC blocking voltage
Maximum average forward rectified current
Peak forward surge current 8.3 ms single half sine-
wave superimposed on rated load
Maximum instantaneous forward voltage at 0.5A
Maximum DC reverse current
at Rated DC blocking voltage
T
A
= 25
℃
T
A
= 100℃
V
RRM
V
RMS
V
DC
I
F(AV)
I
FSM
V
F
I
R
t
rr
R
θJA
T
J
, T
STG
0.5A
50
35
50
0.5B
100
70
100
0.5C
150
105
150
0.5
15
0.95
5.0
100
35
150
0.5D
200
140
200
0.5F
300
210
300
1.0
±
0.2
1.9± 0.1
0.5G
400
280
400
UNIT
V
V
V
A
A
1.25
V
μA
nS
℃/W
℃
Maximum reverse recovery time
at I
F
= 0.5 A , I
R
= 1.0 A , I
rr
= 0.25 A
Typical thermal resistance
Operating junction and storage temperature range
–55 to +150
Note1: Mounted on FR-4 P.C.B. With 0.9x1.5 mm copper pad areas (≈35
μm
thick)
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mail:lge@luguang.cn
Embedded System
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