DHG30I600PA
preliminary
Sonic Fast Recovery Diode
V
RRM
I
FAV
t
rr
=
=
=
600 V
30 A
40 ns
High Performance Fast Recovery Diode
Low Loss and Soft Recovery
Single Diode
Part number
DHG30I600PA
Backside: cathode
3
1
Features / Advantages:
●
Planar passivated chips
●
Very low leakage current
●
Very short recovery time
●
Improved thermal behaviour
●
Very low Irm-values
●
Very soft recovery behaviour
●
Avalanche voltage rated for reliable
operation
●
Soft reverse recovery for low EMI/RFI
●
Low Irm reduces:
- Power dissipation within the diode
- Turn-on loss in the commutating switch
Applications:
●
Antiparallel diode for high frequency
switching devices
●
Antisaturation diode
●
Snubber diode
●
Free wheeling diode
●
Rectifiers in switch mode power
supplies (SMPS)
●
Uninterruptible power supplies (UPS)
Package:
TO-220
●
Industry standard outline
●
RoHS compliant
●
Epoxy meets UL 94V-0
Terms Conditions of usage:
The data contained in this product data sheet is exclusively intended for technically trained staff. The user will have to evaluate the suitability of the product for the intended application and
the completeness of the product data with respect to his application. The specifications of our components may not be considered as an assurance of component characteristics. The
information in the valid application- and assembly notes must be considered. Should you require product information in excess of the data given in this product data sheet or which concerns
the specific application of your product, please contact your local sales office.
Due to technical requirements our product may contain dangerous substances. For information on the types in question please contact your local sales office.
Should you intend to use the product in aviation, in health or life endangering or life support applications, please notify. For any such application we urgently recommend
- to perform joint risk and quality assessments;
- the conclusion of quality agreements;
- to establish joint measures of an ongoing product survey, and that we may make delivery dependent on the realization of any such measures.
IXYS reserves the right to change limits, conditions and dimensions.
Data according to IEC 60747and per semiconductor unless otherwise specified
20131126a
© 2013 IXYS all rights reserved
DHG30I600PA
preliminary
Fast Diode
Symbol
V
RSM
V
RRM
I
R
V
F
Definition
max. repetitive reverse blocking voltage
reverse current, drain current
Ratings
Conditions
T
VJ
= 25°C
T
VJ
= 25°C
T
VJ
= 25°C
T
VJ
= 125°C
T
VJ
= 25°C
T
VJ
= 125 °C
T
VJ
= 150 °C
d = 0.5
T
VJ
= 150 °C
1.17
32
0.50
T
C
= 25°C
t = 10 ms; (50 Hz), sine; V
R
= 0 V
V
R
= 400 V f = 1 MHz
I
F
=
30 A; V
R
= 300 V
T
VJ
= 45°C
T
VJ
= 25°C
T
VJ
= 25 °C
T
VJ
= 125 °C
T
VJ
= 25 °C
T
VJ
= 125 °C
-di
F
/dt = 600 A/µs
16
13
17
40
60
180
200
V
mΩ
K/W
W
A
pF
A
A
ns
ns
min.
typ.
max. Unit
600
V
600
50
2
2.27
3.14
2.24
3.23
30
V
µA
mA
V
V
V
V
A
max. non-repetitive reverse blocking voltage
V
R
= 600 V
V
R
= 600 V
I
F
=
I
F
=
I
F
=
I
F
=
30 A
60 A
30 A
60 A
forward voltage drop
I
FAV
V
F0
r
F
R
thJC
R
thCH
P
tot
I
FSM
C
J
I
RM
t
rr
average forward current
T
C
= 85 °C
rectangular
threshold voltage
slope resistance
for power loss calculation only
thermal resistance junction to case
thermal resistance case to heatsink
total power dissipation
max. forward surge current
junction capacitance
max. reverse recovery current
0.7 K/W
reverse recovery time
IXYS reserves the right to change limits, conditions and dimensions.
Data according to IEC 60747and per semiconductor unless otherwise specified
20131126a
© 2013 IXYS all rights reserved
DHG30I600PA
preliminary
Package
Symbol
I
RMS
T
VJ
T
op
T
stg
Weight
M
D
F
C
mounting torque
mounting force with clip
TO-220
Definition
RMS current
virtual junction temperature
operation temperature
storage temperature
Ratings
Conditions
per terminal
min.
-55
-55
-55
typ.
max.
35
150
125
150
Unit
A
°C
°C
°C
g
Nm
N
2
0.4
20
0.6
60
Product Marking
Part description
D
H
G
30
I
600
PA
=
=
=
=
=
=
=
Diode
Sonic Fast Recovery Diode
extreme fast
Current Rating [A]
Single Diode
Reverse Voltage [V]
TO-220AC (2)
Part Number
Logo
Assembly Line
Lot #
Date Code
XXXXXX
Zyyww
abcdef
Ordering
Standard
Ordering Number
DHG30I600PA
Marking on Product
DHG30I600PA
Delivery Mode
Tube
Quantity
50
Code No.
504019
Similar Part
DHG30I600HA
DHG30IM600PC
Package
TO-247AD (2)
TO-263AB (D2Pak) (2)
Voltage class
600
600
Equivalent Circuits for Simulation
I
V
0
R
0
threshold voltage
slope resistance *
Fast
Diode
* on die level
T
VJ
= 150 °C
V
0 max
R
0 max
1.17
29
V
mΩ
IXYS reserves the right to change limits, conditions and dimensions.
Data according to IEC 60747and per semiconductor unless otherwise specified
20131126a
© 2013 IXYS all rights reserved
DHG30I600PA
preliminary
Outlines TO-220
= supplier option
A
Dim.
A
A1
A2
b
b2
C
D
E
e
H1
L
L1
ØP
Q
Q
E
A1
Millimeter
Min.
Max.
4.32
1.14
2.29
0.64
1.15
0.35
14.73
9.91
5.08
5.85
12.70
2.79
3.54
2.54
4.82
1.39
2.79
1.01
1.65
0.56
16.00
10.66
BSC
6.85
13.97
5.84
4.08
3.18
Inches
Min.
Max.
0.170
0.045
0.090
0.025
0.045
0.014
0.580
0.390
0.200
0.230
0.500
0.110
0.139
0.100
0.190
0.055
0.110
0.040
0.065
0.022
0.630
0.420
BSC
0.270
0.550
0.230
0.161
0.125
ØP
4
1
3
2x b2
L1
2x b
e
L
D
H1
C
A2
3
1
IXYS reserves the right to change limits, conditions and dimensions.
Data according to IEC 60747and per semiconductor unless otherwise specified
20131126a
© 2013 IXYS all rights reserved
DHG30I600PA
preliminary
Fast Diode
60
50
40
1.0
30
25
60 A
T
VJ
= 125°C
V
R
= 300 V
60 A
30 A
15 A
0.8
20
I
F
30
Q
rr
0.6
[μC]
0.4
20 T
VJ
= 125°C
T
VJ
= 25°C
10
0
0.0
30 A
15 A
I
RM
15
[A]
[A]
10
T
VJ
= 125°C
V
R
= 300 V
5
0
200
0.2
0.5
1.0
1.5
2.0
2.5
3.0
0.0
200
400
600
800
1000
400
600
800
1000
V
F
[V]
Fig. 1 Typ. Forward current
versus V
F
200
di
F
/dt [A/μs]
Fig. 2 Typ. reverse recov. charge
Q
rr
versus di/dt
di
F
/dt [A/μs]
Fig. 3 Typ. peak reverse current
I
RM
versus di/dt
60 A
T
VJ
= 125°C
V
R
= 300 V
160
t
rr
120
30 A
[ns]
80
15 A
40
0
200
400
600
800
1000
di
F
/dt [A/μs]
Fig. 4 Dynamic parameters
Q
rr
, I
RM
versus T
VJ
1
Fig. 5 Typ. recovery time
t
rr
versus di/dt
Fig. 6 Typ. recovery energy
E
rec
versus di/dt
Z
thJC
[K/W
R
i
0.158
0.118
0.155
0.269
0.1
0.001
0.01
0.1
1
t
i
0.0005
0.004
0.02
0.15
10
t
P
[s]
Fig. 7 Typ. transient thermal impedance junction to case
IXYS reserves the right to change limits, conditions and dimensions.
Data according to IEC 60747and per semiconductor unless otherwise specified
20131126a
© 2013 IXYS all rights reserved
京公网安备 11010802033920号
EEWORLD
