PANJIT is a global IDM that offers a broad product portfolio including MOSFETs, Schottky diodes, SiC devices, bipolar junction transistors and bridges. The company aims to meet the needs of customers in various applications such as automotive, power, industrial, computing, consumer and communications. Their vision is to power the world with reliable quality, energy-efficient and efficient products, bringing a greener and smarter future to people. The company's core values include innovation, responsibility, customer-centricity, learning and growth, mutual trust and collaboration.
Our studio has 3 senior engineers who can customize ARM platform, Xcale platform, various MCU platforms and board design services for customers. We have been engaged in hardware design and software de...
[i=s]This post was last edited by jameswangsynnex on 2015-3-3 20:00[/i]In daily maintenance work, whether it is to inspect electrical circuits or various household electrical appliances, a small teste...
I personally don't have much experience to share. I used to study C8051F series microcontrollers, so I don't have any insights on these. Since it is your interest, work hard for your interest! Perseve...
RT, the system design requirements are as follows:1. CVBS video signal input (PAL/NTSC dual-standard), converted into RGB565/666/888 or CCIR601/CCIR656 digital signal through AD chip. 2. Digital video...
According to Taiwanese media, Nvidia's next-generation graphics processor Rubin may face delays in mass production at TSMC due to redesign.
"We believe Rubin is likely to be delayed," Fu...[Details]
According to Bloomberg on August 7, Beijing time, AMD CEO Lisa Su said on Wednesday that the company saw positive signs in demand for all products and had made progress in obtaining approval from t...[Details]
Amidst the sweeping wave of domestic semiconductor production, a company dubbed a "comprehensive chip hospital" by the industry has emerged: Sembcorp Nanotech.
From a Singaporean startup to an ...[Details]
South Korea is the world's largest and most advanced memory chip producer, ranking first in both memory and flash memory. In the past two years, it has been particularly ahead in HBM memory.
T...[Details]
On December 25, it was reported that NVIDIA plans to deliver a more powerful H200 AI chip to China in mid-February 2026, before the Lunar New Year holiday. The total shipment is expected to be 5,00...[Details]
On December 15th, it was reported that ASML's lithography machines exported to China are outdated, according to its CEO, by a full eight generations compared to the latest high numerical aperture l...[Details]
Nanochip successfully listed on the Hong Kong Stock Exchange.
With Hong Kong as a global hub, embarking on a new journey from a Chinese benchmark to a global preferred choice.
...[Details]
Indian fabless semiconductor startup Aheesa Digital Innovations has completed tape-out of a locally designed, RISC-V-based broadband network system-on-a-chip (SoC), named VIHAAN-I, designed for tel...[Details]
February 2nd news, according to Taiwan's *Commercial Times*, as the global AI and HPC chip race enters the 2nm era, TSMC has activated its "preparatory mode." Nvidia CEO Jensen Huang dined yesterda...[Details]
On January 28, Microsoft released its next-generation AI accelerator, Maia 200, on Monday local time. Microsoft calls it "the most powerful self-developed chip among all hyperscale cloud service pr...[Details]
January 12th news, according to a report by foreign media Wccftech today, former Intel CEO Pat Kissinger recently spoke about his former employer's latest achievements in advanced manufacturing pro...[Details]
On October 16, Samsung Electronics' Indian branch said on Tuesday that workers at the company's factory in Tamil Nadu in southern India have decided to end their strike, but did not disclose the te...[Details]
——The signing and unveiling ceremony of the "High-Performance Integrated Circuit Digitalization Joint Engineering Center" jointly built by Zheta Technology and the National Integrated Circuit Inn...[Details]
On December 6, Broadcom announced the launch of the industry's first 3.5D F2F packaging technology 3.5D XDSiP platform. 3.5D XDSiP can integrate more than 6000mm2 of silicon chips and up to 12 HBM ...[Details]
"It is estimated that by the end of 2025, there will be more than 100 billion Arm devices with AI capabilities in the world," said Dermot O'Driscoll, vice president of product solutions at Arm Infr...[Details]
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