DBL0.3J~DBL0.3M
Surface Mount Diode
Features
●
●
●
●
●
●
Low profile space
Ideal for automated placement
Glass passivated chip junctions
Low leakage current
High forward surge capability
260℃/10 seconds at terminals
1.0
±
0.2
2.8
±
0.1
0.10-0.30
0.6
±
0.25
3.7
±
0.2
1.9± 0.1
Cathode Band
Top View
SOD-123FL
High temperature soldering：
Component in accordance to
●
Mechanical Date
●
Case:
JEDEC SOD-123FL molded plastic
body over glass passivated chip
Terminals:
Solder plated, solderable per
J-STD-002B and JESD22-B102D
Polarity:
Laser band denotes cathode end
g
g
Weight:
0.017gram
Dimensions in millimeters
●
●
●
Maximum Ratings & Thermal Characteristics
(T
A
= 25 °C unless otherwise noted)
Items
Maximum repetitive peak reverse voltage
Maximum RMS voltage
Maximum DC blocking voltage
Maximum average forward rectified current
Peak forward surge current 8.3 ms single half
sine-wave superimposed on rated load
Thermal resistance from junction to ambient
(1)
Operating junction and storage temperature range
Symbol
V
RRM
V
RMS
V
DC
I
F(AV)
I
FSM
R
θJA
T
J
, T
STG
DBL0.3J
600
420
600
1.4± 0.15
RoHS 2002/95/1 and WEEE 2002/96/EC
DBL0.3K
800
560
800
0.3
15
220
–55 to +150
DBL0.3M
1000
700
1000
UNIT
V
V
V
A
A
℃/
W
℃
Note 1: Mounted on P.C.B. with 0.036 x 0.06” (0.9 x 1.5mm) copper pad areas.
Electrical Characteristics
Items
Instantaneous forward voltage
Reverse current
(T
A
= 25 °C unless otherwise noted)
Test conditions
I
F
=0.3A
V
R
=V
DC
(2)
Symbol
V
F
I
R
Min
-
-
Type
0.95
-
Max
1.10
2
50
UNIT
V
μA
T
A
=25℃
T
A
=100℃
Note2: Pulse test:300μs pulse width,1% duty cycle.
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Embedded System
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