DM54S572J datasheet, PDF - EEWORLD Datasheet

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DM54S572J: Description1KX4 OTPROM, 75ns, CDIP18, CERAMIC, DIP-18; Categorystorage storage; File Size117KB，4 Pages; ManufacturerTexas Instruments; Websitehttp://www.ti.com.cn/

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DM54S572J Overview

1KX4 OTPROM, 75ns, CDIP18, CERAMIC, DIP-18

DM54S572J Parametric

Parameter Name	Attribute value
Is it lead-free?	Contains lead
Is it Rohs certified?	incompatible
Maker	Texas Instruments
Parts packaging code	DIP
package instruction	DIP, DIP18,.3
Contacts	18
Reach Compliance Code	unknown
ECCN code	EAR99
Maximum access time	75 ns
JESD-30 code	R-GDIP-T18
JESD-609 code	e0
memory density	4096 bit
Memory IC Type	OTP ROM
memory width	4
Number of functions	1
Number of terminals	18
word count	1024 words
character code	1000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
organize	1KX4
Output characteristics	OPEN-COLLECTOR
Package body material	CERAMIC, GLASS-SEALED
encapsulated code	DIP
Encapsulate equivalent code	DIP18,.3
Package shape	RECTANGULAR
Package form	IN-LINE
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
Certification status	Not Qualified
Maximum seat height	5.08 mm
Maximum slew rate	0.14 mA
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	BIPOLAR
Temperature level	MILITARY
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED
width	7.62 mm

DM54S572J Related Products

	DM54S572J	DM54S572AJ	DM74S572J	DM74S572AVX	DM74S572VX	DM74S572V	DM74S572N
Description	1KX4 OTPROM, 75ns, CDIP18, CERAMIC, DIP-18	1KX4 OTPROM, 60ns, CDIP18, CERAMIC, DIP-18	IC 1K X 4 OTPROM, 60 ns, CDIP18, CERAMIC, DIP-18, Programmable ROM	1KX4 OTPROM, 45ns, PQCC20, PLASTIC, LCC-20	IC 1K X 4 OTPROM, 60 ns, PQCC20, PLASTIC, LCC-20, Programmable ROM	1KX4 OTPROM, 60ns, PQCC20, PLASTIC, LCC-20	1KX4 OTPROM, 60ns, PDIP18, PLASTIC, DIP-18
Maker	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments
Parts packaging code	DIP	DIP	DIP	QLCC	QLCC	QLCC	DIP
package instruction	DIP, DIP18,.3	DIP, DIP18,.3	DIP, DIP18,.3	QCCJ,	QCCJ,	QCCJ, LDCC20,.4SQ	DIP, DIP18,.3
Contacts	18	18	18	20	20	20	18
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknown
ECCN code	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99
Maximum access time	75 ns	60 ns	60 ns	45 ns	60 ns	60 ns	60 ns
JESD-30 code	R-GDIP-T18	R-GDIP-T18	R-GDIP-T18	S-PQCC-J20	S-PQCC-J20	S-PQCC-J20	R-PDIP-T18
memory density	4096 bit	4096 bit	4096 bit	4096 bit	4096 bit	4096 bit	4096 bit
Memory IC Type	OTP ROM	OTP ROM	OTP ROM	OTP ROM	OTP ROM	OTP ROM	OTP ROM
memory width	4	4	4	4	4	4	4
Number of functions	1	1	1	1	1	1	1
Number of terminals	18	18	18	20	20	20	18
word count	1024 words	1024 words	1024 words	1024 words	1024 words	1024 words	1024 words
character code	1000	1000	1000	1000	1000	1000	1000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	125 °C	125 °C	70 °C	70 °C	70 °C	70 °C	70 °C
organize	1KX4	1KX4	1KX4	1KX4	1KX4	1KX4	1KX4
Output characteristics	OPEN-COLLECTOR	OPEN-COLLECTOR	OPEN-COLLECTOR	OPEN-COLLECTOR	OPEN-COLLECTOR	OPEN-COLLECTOR	OPEN-COLLECTOR
Package body material	CERAMIC, GLASS-SEALED	CERAMIC, GLASS-SEALED	CERAMIC, GLASS-SEALED	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	DIP	DIP	DIP	QCCJ	QCCJ	QCCJ	DIP
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	SQUARE	SQUARE	SQUARE	RECTANGULAR
Package form	IN-LINE	IN-LINE	IN-LINE	CHIP CARRIER	CHIP CARRIER	CHIP CARRIER	IN-LINE
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	5.08 mm	5.08 mm	5.08 mm	4.57 mm	4.57 mm	4.57 mm	5.08 mm
Maximum supply voltage (Vsup)	5.5 V	5.5 V	5.25 V	5.25 V	5.25 V	5.25 V	5.25 V
Minimum supply voltage (Vsup)	4.5 V	4.5 V	4.75 V	4.75 V	4.75 V	4.75 V	4.75 V
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V	5 V	5 V	5 V
surface mount	NO	NO	NO	YES	YES	YES	NO
technology	BIPOLAR	BIPOLAR	BIPOLAR	BIPOLAR	BIPOLAR	BIPOLAR	BIPOLAR
Temperature level	MILITARY	MILITARY	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
Terminal form	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	J BEND	J BEND	J BEND	THROUGH-HOLE
Terminal pitch	2.54 mm	2.54 mm	2.54 mm	1.27 mm	1.27 mm	1.27 mm	2.54 mm
Terminal location	DUAL	DUAL	DUAL	QUAD	QUAD	QUAD	DUAL
width	7.62 mm	7.62 mm	7.62 mm	8.89 mm	8.89 mm	8.89 mm	7.62 mm
Is it lead-free?	Contains lead	Contains lead	Contains lead	-	-	Contains lead	Contains lead
Is it Rohs certified?	incompatible	incompatible	incompatible	-	-	incompatible	incompatible
JESD-609 code	e0	e0	e0	-	-	e0	e0
Encapsulate equivalent code	DIP18,.3	DIP18,.3	DIP18,.3	-	-	LDCC20,.4SQ	DIP18,.3
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	-	-	NOT SPECIFIED	NOT SPECIFIED
Maximum slew rate	0.14 mA	0.14 mA	0.14 mA	-	-	0.14 mA	0.14 mA
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	-	-	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	-	-	NOT SPECIFIED	NOT SPECIFIED
length	-	-	-	8.89 mm	8.89 mm	8.89 mm	21.755 mm

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