4000/14000/40000 SERIES, DUAL 4-BIT DRIVER, TRUE OUTPUT, UUC24, DIE-24
| Parameter Name | Attribute value |
| Maker | Texas Instruments |
| Parts packaging code | DIE |
| package instruction | DIE, |
| Contacts | 24 |
| Reach Compliance Code | unknown |
| series | 4000/14000/40000 |
| JESD-30 code | R-XUUC-N24 |
| Logic integrated circuit type | BUS DRIVER |
| Number of digits | 4 |
| Number of functions | 2 |
| Number of ports | 2 |
| Number of terminals | 24 |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -55 °C |
| Output characteristics | 3-STATE |
| Output polarity | TRUE |
| Package body material | UNSPECIFIED |
| encapsulated code | DIE |
| Package shape | RECTANGULAR |
| Package form | UNCASED CHIP |
| propagation delay (tpd) | 210 ns |
| Certification status | Not Qualified |
| Maximum supply voltage (Vsup) | 18 V |
| Minimum supply voltage (Vsup) | 3 V |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | MILITARY |
| Terminal form | NO LEAD |
| Terminal location | UPPER |
| CD4508BH | CD4508BF | CD4508BD | |
|---|---|---|---|
| Description | 4000/14000/40000 SERIES, DUAL 4-BIT DRIVER, TRUE OUTPUT, UUC24, DIE-24 | 4000/14000/40000 SERIES, DUAL 4-BIT DRIVER, TRUE OUTPUT, CDIP24, CERAMIC, DIP-24 | 4000/14000/40000 SERIES, DUAL 4-BIT DRIVER, TRUE OUTPUT, CDIP24, CERAMIC, DIP-24 |
| Maker | Texas Instruments | Texas Instruments | Texas Instruments |
| Parts packaging code | DIE | DIP | DIP |
| package instruction | DIE, | DIP, DIP24,.6 | DIP, DIP24,.6 |
| Contacts | 24 | 24 | 24 |
| Reach Compliance Code | unknown | not_compliant | unknown |
| series | 4000/14000/40000 | 4000/14000/40000 | 4000/14000/40000 |
| JESD-30 code | R-XUUC-N24 | R-GDIP-T24 | R-CDIP-T24 |
| Logic integrated circuit type | BUS DRIVER | BUS DRIVER | BUS DRIVER |
| Number of digits | 4 | 4 | 4 |
| Number of functions | 2 | 2 | 2 |
| Number of ports | 2 | 2 | 2 |
| Number of terminals | 24 | 24 | 24 |
| Maximum operating temperature | 125 °C | 125 °C | 125 °C |
| Minimum operating temperature | -55 °C | -55 °C | -55 °C |
| Output characteristics | 3-STATE | 3-STATE | 3-STATE |
| Output polarity | TRUE | TRUE | TRUE |
| Package body material | UNSPECIFIED | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED |
| encapsulated code | DIE | DIP | DIP |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | UNCASED CHIP | IN-LINE | IN-LINE |
| propagation delay (tpd) | 210 ns | 210 ns | 210 ns |
| Certification status | Not Qualified | Not Qualified | Not Qualified |
| Maximum supply voltage (Vsup) | 18 V | 18 V | 18 V |
| Minimum supply voltage (Vsup) | 3 V | 3 V | 3 V |
| Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V |
| surface mount | YES | NO | NO |
| technology | CMOS | CMOS | CMOS |
| Temperature level | MILITARY | MILITARY | MILITARY |
| Terminal form | NO LEAD | THROUGH-HOLE | THROUGH-HOLE |
| Terminal location | UPPER | DUAL | DUAL |
| Load capacitance (CL) | - | 50 pF | 50 pF |
| Encapsulate equivalent code | - | DIP24,.6 | DIP24,.6 |
| power supply | - | 5/15 V | 5/15 V |
| Prop。Delay @ Nom-Sup | - | 260 ns | 260 ns |
| Maximum seat height | - | 4.91 mm | 4.45 mm |
| Terminal pitch | - | 2.54 mm | 2.54 mm |
| width | - | 15.24 mm | 7.62 mm |