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DL973B-TP

Description
Zener Diode, 33V V(Z), 5%, 0.5W, Silicon, Unidirectional, MINIMELF-2
CategoryDiscrete semiconductor    diode   
File Size214KB,3 Pages
ManufacturerMicro Commercial Components (MCC)
Environmental Compliance  
Download Datasheet Parametric View All

DL973B-TP Overview

Zener Diode, 33V V(Z), 5%, 0.5W, Silicon, Unidirectional, MINIMELF-2

DL973B-TP Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
MakerMicro Commercial Components (MCC)
Parts packaging codeMELF
package instructionMINIMELF-2
Contacts2
Reach Compliance Codeunknown
ECCN codeEAR99
Shell connectionISOLATED
ConfigurationSINGLE
Diode component materialsSILICON
Diode typeZENER DIODE
JESD-30 codeO-LELF-R2
JESD-609 codee3
Humidity sensitivity level1
Number of components1
Number of terminals2
Maximum operating temperature200 °C
Package body materialGLASS
Package shapeROUND
Package formLONG FORM
Peak Reflow Temperature (Celsius)260
polarityUNIDIRECTIONAL
Maximum power dissipation0.5 W
Certification statusNot Qualified
Nominal reference voltage33 V
surface mountYES
technologyZENER
Terminal surfaceMatte Tin (Sn)
Terminal formWRAP AROUND
Terminal locationEND
Maximum time at peak reflow temperature10
Maximum voltage tolerance5%
Working test current3.8 mA
MCC
TM
Micro Commercial Components
  omponents
20736 Marilla
Street Chatsworth

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$ %    !"#
DL957B
THRU
DL982B
0.5W Silicon Planar
Zener Diodes
MINIMELF
Features
Zener Voltage 6.8V to 75
Silicon Planar Power Zener Diodes
V
Z
– tolerance ± 5%
Moisture Sensitivity Level 1
Mechanical Data
Operating Temperature: -65°C to +175°C
Glass Package
Cathode Mark
Marking
:
Cathode band denotes polarity
C
Maximum Ratings
Symbol
Zener Current
Power Dissipation
@ T
A
=25
Junction Temperature
Storage Temperature
Range
P
tot
T
J
T
STG
Value
See Table 1
500
200
-65 to 200
DIM
A
B
C
INCHES
MIN
.134
.008
.055
DIMENSIONS
MM
MIN
3.40
.20
1.40
Units
A
B
mW
Electrical Characteristics @ 25 C Unless Otherwise Specified
Thermal resistance
Forward Voltage
@ I
F
=200mA
Symbol
R
JA
V
F
Maximum
300
1.5
Unit
o
C/W
V
MAX
.142
.016
.059
MAX
3.60
.40
1.50
NOTE
NOTE:
Valid provided that a distance of 8mm from case are kept at
ambient temperature
SUGGESTED SOLDER
PAD LAYOUT
0.105
0.075”
0.030”
Revision:
A
www.mccsemi.com
1 of 3
2011/01/01

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