FPF1038 — IntelliMAX
TM
Advanced Slew Rate Controlled Load Switch
September 2012
FPF1038
Low On-Resistance, Slew-Rate-Controlled Load Switch
Features
1.2 V to 5.5 V Input Voltage Operating Range
Typical R
ON
:
−
−
−
−
20 mΩ at V
IN
=5.5 V
21 mΩ at V
IN
=4.5 V
37 mΩ at V
IN
=1.8 V
75 mΩ at V
IN
=1.2 V
Description
The FPF1038 advanced load-management switch target
applications requiring a highly integrated solution for
disconnecting loads powered from DC power rail (<6 V)
with stringent shutdown current targets and high load
capacitances (up to 200 µF). The FPF1038 consists of
slew-rate controlled low-impedance MOSFET switch
(21 mΩ typical) and other integrated analog features.
The slew-rate controlled turn-on characteristic prevents
inrush current and the resulting excessive voltage droop
on power rails.
These devices have exceptionally low shutdown current
drain (<1 µA maximum) that facilitates compliance in
low standby power applications. The input voltage range
operates from 1.2 V to 5.5 V DC to support a wide range
of applications in consumer, optical, medical, storage,
portable, and industrial device power management.
Switch control is managed by a logic input (active HIGH)
capable of interfacing directly with low-voltage control
signal / GPIO with no external pull-up required. The
device is packaged in advanced fully “green” 1mm
x1.5 mm Wafer-Level Chip-Scale Packaging (WLCSP);
providing excellent thermal conductivity, small footprint,
and low electrical resistance for wider application usage.
Slew Rate / Inrush Control with t
R
: 2.7 ms (Typical)
3 A Maximum Continuous Current Capability
Low <1 µA Shutdown Current
ESD Protected: Above 8 kV HBM, 1.5 kV CDM
GPIO / CMOS-Compatible Enable Circuitry
Applications
HDD, Storage, and Solid-State Memory Devices
Portable Media Devices, UMPC, Tablets, MIDs
Wireless LAN Cards and Modules
SLR Digital Cameras
Portable Medical Devices
GPS and Navigation Equipment
Industrial Handheld and Enterprise Equipment
Ordering Information
Part Number
FPF1038UCX
Top
Mark
QE
Switch R
ON
(Typical)
at 4.5 V
IN
21 mΩ
Input
Buffer
CMOS
Output
Discharge
NA
ON Pin
Activity
Active
HIGH
t
R
2.7 ms
Package
6-Bump, WLCSP, 1.0 mm
x 1.5 mm, 0.5 mm Pitch
© 2010 Fairchild Semiconductor Corporation
FPF1038 • Rev. 1.0.5
www.fairchildsemi.com
FPF1038 — Advance Load Management Switch Management Switch Advance Load Management Switch
Physical Dimensions
0.03 C
2X
E
A
B
F
(Ø0.350)
SOLDER MASK
OPENING
(Ø0.250)
Cu Pad
A1
(1.00)
BALL A1
INDEX AREA
D
0.03 C
2X
(0.50)
TOP VIEW
RECOMMENDED LAND PATTERN
(NSMD PAD TYPE)
0.06 C
0.05 C
0.625
0.539
E
0.332±0.018
0.250±0.025
C
SEATING PLANE
D
SIDE VIEWS
NOTES:
A. NO JEDEC REGISTRATION APPLIES.
0.005
0.50
Ø0.315 +/- .025
6X
C A B
B. DIMENSIONS ARE IN MILLIMETERS.
C. DIMENSIONS AND TOLERANCE
PER ASMEY14.5M, 1994.
D. DATUM C IS DEFINED BY THE SPHERICAL
CROWNS OF THE BALLS.
E. PACKAGE NOMINAL HEIGHT IS 582 MICRONS
±43 MICRONS (539-625 MICRONS).
F. FOR DIMENSIONS D, E, X, AND Y SEE
PRODUCT DATASHEET.
G. DRAWING FILNAME: MKT-UC006AFrev2.
C
1.00
0.50
B
A
1 2
(Y) ±0.018
F
(X) ±0.018
BOTTOM VIEW
Figure 30.
6 Ball, 1.0 x 1.5 mm Wafer-Level Chip-Scale Packaging (WLCSP)
Nominal Values
Bump
Pitch
0.5 mm
Overall Package
Height
0.582 mm
Silicon
Thickness
0.332 mm
Solder Bump
Height
0.250 mm
Solder Bump
Diameter
0.315 mm
Product-Specific Dimensions
Product
FPF1038UCX
D
1.5 mm ±0.03
E
1.0 mm ±0.03
X
0.240 mm
Y
0.240 mm
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or
obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically the
warranty therein, which covers Fairchild products.
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:
http://www.fairchildsemi.com/packaging/.
© 2010 Fairchild Semiconductor Corporation
FPF1038 • Rev. 1.0.5
www.fairchildsemi.com
11
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