Bus Driver,
| Parameter Name | Attribute value |
| Maker | e2v technologies |
| package instruction | , |
| Reach Compliance Code | compliant |
| JESD-609 code | e0 |
| Logic integrated circuit type | BUS DRIVER |
| Certification status | Qualified |
| Terminal surface | TIN LEAD |

| M38510/32401BXA | M38510/32401B2A | M38510/32402BRA | M38510/32403BRA | M38510/32402B2C | M38510/32401BRA | M38510/32403BSA | M38510/32402BSA | M38510/32403B2A | M38510/32401BSA | |
|---|---|---|---|---|---|---|---|---|---|---|
| Description | Bus Driver, | Bus Driver, LS Series, 2-Func, 4-Bit, True Output, TTL, CQCC20, CERAMIC, LCC-20 | Bus Driver, LS Series, 2-Func, 4-Bit, True Output, TTL, CDIP20, CERAMIC, DIP-20 | Bus Driver, LS Series, 2-Func, 4-Bit, True Output, TTL, CDIP20, CERAMIC, DIP-20 | Bus Driver, LS Series, 2-Func, 4-Bit, True Output, TTL, CQCC20, CERAMIC, LCC-20 | Bus Driver, LS Series, 2-Func, 4-Bit, True Output, TTL, CDIP20, CERAMIC, DIP-20 | Bus Driver, LS Series, 2-Func, 4-Bit, True Output, TTL, CDFP20, CERAMIC, FP-20 | Bus Driver, LS Series, 2-Func, 4-Bit, True Output, TTL, CDFP20, CERAMIC, FP-20 | Bus Driver, LS Series, 2-Func, 4-Bit, True Output, TTL, CQCC20, CERAMIC, LCC-20 | Bus Driver, LS Series, 2-Func, 4-Bit, True Output, TTL, CDFP20, CERAMIC, FP-20 |
| package instruction | , | CERAMIC, LCC-20 | CERAMIC, DIP-20 | DIP, DIP20,.3 | QCCN, LCC20,.35SQ | DIP, DIP20,.3 | DFP, FL20,.3 | DFP, FL20,.3 | QCCN, LCC20,.35SQ | DFP, FL20,.3 |
| Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | compliant | compliant | compliant | compliant | compliant |
| Logic integrated circuit type | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER |
| Certification status | Qualified | Qualified | Qualified | Qualified | Qualified | Qualified | Qualified | Qualified | Qualified | Qualified |
| Maker | e2v technologies | e2v technologies | e2v technologies | - | - | e2v technologies | e2v technologies | e2v technologies | e2v technologies | e2v technologies |
| JESD-609 code | e0 | e0 | e0 | e0 | - | e0 | e0 | e0 | e0 | e0 |
| Terminal surface | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD | - | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD |
| Parts packaging code | - | QLCC | DIP | DIP | QLCC | DIP | DFP | DFP | QLCC | DFP |
| Contacts | - | 20 | 20 | 20 | 20 | 20 | 20 | 20 | 20 | 20 |
| Control type | - | ENABLE LOW | ENABLE LOW/HIGH | ENABLE LOW | ENABLE LOW/HIGH | ENABLE LOW | ENABLE LOW | ENABLE LOW/HIGH | ENABLE LOW | ENABLE LOW |
| series | - | LS | LS | LS | LS | LS | LS | LS | LS | LS |
| JESD-30 code | - | S-CQCC-N20 | R-GDIP-T20 | R-GDIP-T20 | S-CQCC-N20 | R-GDIP-T20 | R-GDFP-F20 | R-GDFP-F20 | S-CQCC-N20 | R-GDFP-F20 |
| MaximumI(ol) | - | 0.018 A | 0.018 A | 0.018 A | 0.018 A | 0.018 A | 0.018 A | 0.018 A | 0.018 A | 0.018 A |
| Number of digits | - | 4 | 4 | 4 | 4 | 4 | 4 | 4 | 4 | 4 |
| Number of functions | - | 2 | 2 | 2 | 2 | 2 | 2 | 2 | 2 | 2 |
| Number of ports | - | 2 | 2 | 2 | 2 | 2 | 2 | 2 | 2 | 2 |
| Number of terminals | - | 20 | 20 | 20 | 20 | 20 | 20 | 20 | 20 | 20 |
| Maximum operating temperature | - | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| Minimum operating temperature | - | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C |
| Output characteristics | - | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| Output polarity | - | TRUE | TRUE | TRUE | TRUE | TRUE | TRUE | TRUE | TRUE | TRUE |
| Package body material | - | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED |
| encapsulated code | - | QCCN | DIP | DIP | QCCN | DIP | DFP | DFP | QCCN | DFP |
| Encapsulate equivalent code | - | LCC20,.35SQ | DIP20,.3 | DIP20,.3 | LCC20,.35SQ | DIP20,.3 | FL20,.3 | FL20,.3 | LCC20,.35SQ | FL20,.3 |
| Package shape | - | SQUARE | RECTANGULAR | RECTANGULAR | SQUARE | RECTANGULAR | RECTANGULAR | RECTANGULAR | SQUARE | RECTANGULAR |
| Package form | - | CHIP CARRIER | IN-LINE | IN-LINE | CHIP CARRIER | IN-LINE | FLATPACK | FLATPACK | CHIP CARRIER | FLATPACK |
| power supply | - | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| Maximum supply current (ICC) | - | 50 mA | 54 mA | 54 mA | 54 mA | 50 mA | 54 mA | 54 mA | 54 mA | 50 mA |
| Prop。Delay @ Nom-Sup | - | 23 ns | 23 ns | 23 ns | 23 ns | 23 ns | 23 ns | 23 ns | 23 ns | 23 ns |
| propagation delay (tpd) | - | 23 ns | 23 ns | 23 ns | 23 ns | 23 ns | 23 ns | 23 ns | 23 ns | 23 ns |
| Filter level | - | 38535Q/M;38534H;883B | 38535Q/M;38534H;883B | MIL-PRF-38535 | 38535Q/M;38534H;883B | 38535Q/M;38534H;883B | MIL-PRF-38535 | 38535Q/M;38534H;883B | MIL-PRF-38535 | 38535Q/M;38534H;883B |
| Maximum supply voltage (Vsup) | - | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| Minimum supply voltage (Vsup) | - | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| Nominal supply voltage (Vsup) | - | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| surface mount | - | YES | NO | NO | YES | NO | YES | YES | YES | YES |
| technology | - | TTL | TTL | TTL | TTL | TTL | TTL | TTL | TTL | TTL |
| Temperature level | - | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY |
| Terminal form | - | NO LEAD | THROUGH-HOLE | THROUGH-HOLE | NO LEAD | THROUGH-HOLE | FLAT | FLAT | NO LEAD | FLAT |
| Terminal pitch | - | 1.27 mm | 2.54 mm | 2.54 mm | 1.27 mm | 2.54 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm |
| Terminal location | - | QUAD | DUAL | DUAL | QUAD | DUAL | DUAL | DUAL | QUAD | DUAL |