Peripheral Driver, 2 Driver, BIPolar, CDIP8,
| Parameter Name | Attribute value |
| Is it lead-free? | Contains lead |
| Is it Rohs certified? | incompatible |
| Maker | Fairchild |
| package instruction | DIP, DIP8,.3 |
| Reach Compliance Code | compliant |
| Number of drives | 2 |
| JESD-30 code | R-XDIP-T8 |
| Humidity sensitivity level | 2A |
| Number of terminals | 8 |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| Package body material | CERAMIC |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP8,.3 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| Peak Reflow Temperature (Celsius) | 250 |
| power supply | 5 V |
| Certification status | Not Qualified |
| Nominal supply voltage | 5 V |
| surface mount | NO |
| technology | BIPOLAR |
| Temperature level | COMMERCIAL |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| Maximum time at peak reflow temperature | 30 |
| 5962-01-092-3208 | 5962-01-216-6951 | 75474RCQM | 75474RCQR | 75474TC | |
|---|---|---|---|---|---|
| Description | Peripheral Driver, 2 Driver, BIPolar, CDIP8, | Peripheral Driver, 2 Driver, BIPolar, CDIP8, | Peripheral Driver, 2 Driver, TTL, CDIP8, | Peripheral Driver, 2 Driver, TTL, CDIP8, | Peripheral Driver, 2 Driver, TTL, PDIP8, |
| Is it lead-free? | Contains lead | Contains lead | Contains lead | Contains lead | Contains lead |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible |
| package instruction | DIP, DIP8,.3 | DIP, DIP8,.3 | DIP, DIP8,.3 | DIP, DIP8,.3 | DIP, DIP8,.3 |
| Reach Compliance Code | compliant | compli | compliant | compliant | compliant |
| Number of drives | 2 | 2 | 2 | 2 | 2 |
| JESD-30 code | R-XDIP-T8 | R-XDIP-T8 | R-XDIP-T8 | R-XDIP-T8 | R-PDIP-T8 |
| Humidity sensitivity level | 2A | 2A | 2A | 2A | 2A |
| Number of terminals | 8 | 8 | 8 | 8 | 8 |
| Maximum operating temperature | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| Package body material | CERAMIC | CERAMIC | CERAMIC | CERAMIC | PLASTIC/EPOXY |
| encapsulated code | DIP | DIP | DIP | DIP | DIP |
| Encapsulate equivalent code | DIP8,.3 | DIP8,.3 | DIP8,.3 | DIP8,.3 | DIP8,.3 |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE |
| Peak Reflow Temperature (Celsius) | 250 | 250 | 250 | 250 | 250 |
| power supply | 5 V | 5 V | 5 V | 5 V | 5 V |
| Nominal supply voltage | 5 V | 5 V | 5 V | 5 V | 5 V |
| surface mount | NO | NO | NO | NO | NO |
| technology | BIPOLAR | BIPOLAR | TTL | TTL | TTL |
| Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| Terminal form | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
| Terminal pitch | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
| Terminal location | DUAL | DUAL | DUAL | DUAL | DUAL |
| Maximum time at peak reflow temperature | 30 | 30 | 30 | 30 | 30 |
| Certification status | Not Qualified | Not Qualified | Not Qualified | - | Not Qualified |
| Objectid | - | - | 1436051790 | 1436051796 | 1436051820 |
| ECCN code | - | - | EAR99 | EAR99 | EAR99 |
| JESD-609 code | - | - | e0 | e0 | e0 |
| Terminal surface | - | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
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