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VCUGLAAT30.000MHZ

Description
CMOS/TTL Output Clock Oscillator, 30MHz Nom, HERMETICALLY SEALED, CERAMIC, LCC-6
CategoryPassive components    oscillator   
File Size267KB,8 Pages
ManufacturerVectron International, Inc.
Websitehttp://www.vectron.com/
Environmental Compliance  
Download Datasheet Parametric View All

VCUGLAAT30.000MHZ Overview

CMOS/TTL Output Clock Oscillator, 30MHz Nom, HERMETICALLY SEALED, CERAMIC, LCC-6

VCUGLAAT30.000MHZ Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
MakerVectron International, Inc.
package instructionHERMETICALLY SEALED, CERAMIC, LCC-6
Reach Compliance Codecompliant
Maximum control voltage4.5 V
Minimum control voltage0.5 V
maximum descent time5 ns
Frequency Adjustment - MechanicalNO
Frequency offset/pull rate50 ppm
JESD-609 codee4
Manufacturer's serial numberV
Installation featuresSURFACE MOUNT
Nominal operating frequency30 MHz
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
Oscillator typeCMOS/TTL
physical size7.49mm x 5.08mm x 2.16mm
longest rise time5 ns
Nominal supply voltage5 V
surface mountYES
maximum symmetry52.5/47.5 %
Terminal surfaceGold (Au) - with Nickel (Ni) barrier
Product Data Sheet
V-Type
Voltage Controlled Crystal Oscillator (VCXO)
Features
• Output Frequencies to 77.760 MHz
• 5.0 or 3.3 volt operation
• Tri-State Output
• Jitter Performance <6 ps rms (freq >12MHz)
• VCXO with SwitchableTTL/CMOS Output
• Robust 6 contact Leadless Ceramic Chip Carrier
• 7.49 x 5.08 x 1.8 mm Surface Mount Device
• Absolute Pull Range Performance to 100 ppm
• Commercial and Industrial Temperature Range
• EIA Compatible Tape and Reel Packaging
Applications
xDSL Customer Premise Equipment (CPE)
Cable Modems
HFC Subscriber Equipmemt
ATM/SONET/SDH applications
Description
The VI V-Type Voltage Controlled Crystal
Oscillator (VCXO) is a quartz-stabilized
square-wave generator with selectable TTL or
CMOS output. The device is hermetically
sealed in a leadless ceramic chip carrier with
6 contact pads.
The V-Type’s ultra small footprint and low pro-
file make it ideally suited to applications where
space is limited or where backside assembly
is required.
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