TCR2EN series
TOSHIBA CMOS Linear Integrated Circuit Silicon Monolithic
TCR2EN series
200 mA CMOS Low Drop-Out Regulator in ultra small package
The TCR2EN series are CMOS general-purpose single-output
voltage regulators with an on/off control input, featuring low dropout
voltage, low quiescent bias current and fast load transient response.
These voltage regulators are available in fixed output voltages
between 1.0 V and 3.6 V and capable of driving up to 200 mA. They
feature overcurrent protection and an Auto-discharge function.
The TCR2EN series is offered in the ultra small plastic mold
package SDFN4 ( 0.8 mm x 0.8 mm x 0.38 mm). It has a low
dropout voltage of 160 mV ( 2.5 V output, I
OUT
= 150 mA) with low
output noise voltage of 35
μδV
rms
(2.5 V output) and a load transient
response of only
⊿V
OUT
=
±55
mV ( I
OUT
= 1 mA⇔150 mA, C
OUT
=1.0
μF).
As small ceramic input and output capacitors can be used with the
TCR2EN series, these devices are ideal for portable applications
that require high-density board assembly such as cellular phones.
BOTTOM VIEW ILLUSTRATION
SDFN4
Weight : 0.6 mg ( typ.)
Features
•
Low Drop-Out voltage
V
IN
-V
OUT
= 160 mV (typ.) at 2.5 V-output, I
OUT
= 150 mA
V
IN
-V
OUT
= 210 mV (typ.) at 1.8 V-output, I
OUT
= 150 mA
V
IN
-V
OUT
= 360 mV (typ.) at 1.2 V-output, I
OUT
= 150 mA
V
IN
-V
OUT
= 490 mV (typ.) at 1.0 V-output, I
OUT
= 150 mA
•
Low output noise voltage
V
NO
= 35
μV
rms
(typ.) at 2.5 V-output, I
OUT
= 10 mA, 10 Hz < f < 100 kHz
V
NO
= 30
μV
rms
(typ.) at 1.8 V-output, I
OUT
= 10 mA, 10 Hz < f < 100 kHz
V
NO
= 23
μV
rms
(typ.) at 1.2 V-output, I
OUT
= 10 mA, 10 Hz < f < 100 kHz
V
NO
= 18
μV
rms
(typ.) at 1.0 V-output, I
OUT
= 10 mA, 10 Hz < f < 100 kHz
•
•
•
•
•
•
•
•
•
•
Fast load transient response (⊿V
OUT
=
±55
mV (typ.) at I
OUT
= 1
⇔
150 mA, C
OUT
=1.0
μF
)
Low quiescent bias current ( I
B
= 35
μA
(typ.) at I
OUT
= 0 mA )
High ripple rejection ( R.R = 73 dB (typ.) at 2.5V-output, I
OUT
= 10 mA, f =1kHz )
Wide range Output Voltage line up ( V
OUT
= 1.0 to 3.6 V )
High V
OUT
accuracy
±1.0%
Overcurrent protection
Auto-discharge
Pull down connection between CONTROL and GND
Ceramic capacitors can be used ( C
IN
= 0.1μF, C
OUT
=1.0
μF
)
Ultra Small package SDFN4 (0.8 mm x 0.8 mm x 0.38 mm )
( 1.8V
<
V
OUT
)
=
1
2012-05-23
TCR2EN series
Absolute Maximum Ratings (Ta
=
25°C)
Characteristics
Input voltage
Control voltage
Output voltage
Output current
Power dissipation
Operation temperature range
Junction temperature
Storage temperature range
Symbol
V
IN
V
CT
V
OUT
I
OUT
P
D
T
opr
T
j
T
stg
Rating
5.5
-0.3 to 5.5
-0.3 to V
IN
+ 0.3
200
300
−40
to 85
150
−55
to 150
(Note1)
Unit
V
V
V
mA
mW
°C
°C
°C
Note:
Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly
even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute
maximum ratings and the operating ranges.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
(“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test
report and estimated failure rate, etc).
Rating at mounting on a board
Glass epoxy(FR4) board dimension: 40mm x 40mm x 1.8mm, both sides of board
Metal pattern ratio: a surface approximately 50%, the reverse side approximately 50%
Through hole hall: diameter 0.5mm x 24
Note1:
Pin Assignment
(top view)
V
IN
4
CONTROL
3
*
1
V
OUT
2
GND
*Center electrode should be connected to GND or Open
2
2012-05-23
TCR2EN series
Application Note
1.
Recommended Application Circuit
CONTROL
GND
V
IN
0.1
μF
1.0
μF
V
OUT
CONTROL
voltage
HIGH
LOW
OPEN
Output
voltage
ON
OFF
OFF
The figure above shows the recommended configuration for using a Low-Dropout regulator. Insert a capacitor
at V
OUT
and V
IN
pins for stable input/output operation. (Ceramic capacitors can be used).
2.
Power Dissipation
Power dissipation is measured on the board condition shown below.
[The Board Condition]
Board material: Glass epoxy(FR4)
Board dimension: 40mm x 40mm (both sides of board)，t=1.8mm
Metal pattern ratio: a surface approximately 50%, the reverse side approximately 50%
Through hole: diameter 0.5mm x 24
400
Power dissipation PD (mW)
300
200
100
0
−40
0
40
80
120
Ambient temperature Ta
(℃)
5
2012-05-23
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