Power Supply Management Circuit, Fixed, 1 Channel, CDIP8, CERDIP-8
| Parameter Name | Attribute value |
| Is it lead-free? | Contains lead |
| Is it Rohs certified? | incompatible |
| Maker | Maxim |
| Parts packaging code | DIP |
| package instruction | CERDIP-8 |
| Contacts | 8 |
| Reach Compliance Code | not_compliant |
| ECCN code | EAR99 |
| Adjustable threshold | NO |
| Analog Integrated Circuits - Other Types | POWER SUPPLY MANAGEMENT CIRCUIT |
| JESD-30 code | R-GDIP-T8 |
| JESD-609 code | e0 |
| Number of channels | 1 |
| Number of functions | 1 |
| Number of terminals | 8 |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -55 °C |
| Package body material | CERAMIC, GLASS-SEALED |
| encapsulated code | DIP |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
| Certification status | Not Qualified |
| Maximum seat height | 5.08 mm |
| surface mount | NO |
| Temperature level | MILITARY |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| width | 7.62 mm |
| MAX790MJA | MAX790C/D | MAX790CPA | MAX790EPA | MAX791CWE | |
|---|---|---|---|---|---|
| Description | Power Supply Management Circuit, Fixed, 1 Channel, CDIP8, CERDIP-8 | Power Supply Management Circuit, Fixed, 1 Channel, DIE | Power Supply Management Circuit, Fixed, 1 Channel, PDIP8, PLASTIC, DIP-8 | Power Supply Management Circuit, Fixed, 1 Channel, PDIP8, PLASTIC, DIP-8 | Power Supply Management Circuit, Fixed, 1 Channel, PDSO16, 0.300 INCH, SOIC-16 |
| Is it lead-free? | Contains lead | Contains lead | Contains lead | Contains lead | Contains lead |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible |
| Maker | Maxim | Maxim | Maxim | Maxim | Maxim |
| Parts packaging code | DIP | DIE | DIP | DIP | SOIC |
| package instruction | CERDIP-8 | DIE, | PLASTIC, DIP-8 | PLASTIC, DIP-8 | SOP, |
| Contacts | 8 | 8 | 8 | 8 | 16 |
| Reach Compliance Code | not_compliant | compliant | not_compliant | not_compliant | compliant |
| ECCN code | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| Adjustable threshold | NO | NO | NO | NO | NO |
| Analog Integrated Circuits - Other Types | POWER SUPPLY MANAGEMENT CIRCUIT | POWER SUPPLY MANAGEMENT CIRCUIT | POWER SUPPLY MANAGEMENT CIRCUIT | POWER SUPPLY MANAGEMENT CIRCUIT | POWER SUPPLY MANAGEMENT CIRCUIT |
| JESD-30 code | R-GDIP-T8 | R-XUUC-N8 | R-PDIP-T8 | R-PDIP-T8 | R-PDSO-G16 |
| JESD-609 code | e0 | e0 | e0 | e0 | e0 |
| Number of channels | 1 | 1 | 1 | 1 | 1 |
| Number of functions | 1 | 1 | 1 | 1 | 1 |
| Number of terminals | 8 | 8 | 8 | 8 | 16 |
| Maximum operating temperature | 125 °C | 70 °C | 70 °C | 85 °C | 70 °C |
| Package body material | CERAMIC, GLASS-SEALED | UNSPECIFIED | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | DIP | DIE | DIP | DIP | SOP |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | IN-LINE | UNCASED CHIP | IN-LINE | IN-LINE | SMALL OUTLINE |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | 240 |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| surface mount | NO | YES | NO | NO | YES |
| Temperature level | MILITARY | COMMERCIAL | COMMERCIAL | INDUSTRIAL | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) | TIN LEAD | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | TIN LEAD |
| Terminal form | THROUGH-HOLE | NO LEAD | THROUGH-HOLE | THROUGH-HOLE | GULL WING |
| Terminal location | DUAL | UPPER | DUAL | DUAL | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| Maximum seat height | 5.08 mm | - | 4.572 mm | 4.572 mm | 2.642 mm |
| Terminal pitch | 2.54 mm | - | 2.54 mm | 2.54 mm | 1.27 mm |
| width | 7.62 mm | - | 7.62 mm | 7.62 mm | 7.6745 mm |
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