DMA56604
Silicon PNP epitaxial planar type
For digital circuits
Features
Low collector-emitter saturation voltage V
CE(sat)
Halogen-free / RoHS compliant
(EU RoHS / UL-94 V-0 / MSL: Level 1 compliant)
Unit: mm
Marking Symbol: J6
Basic Part Number
Dual DRA2114Y (Individual)
Packaging
DMA566040R Embossed type (Thermo-compression sealing): 3 000 pcs / reel (standard)
Absolute Maximum Ratings
T
a
= 25°C
Parameter
Tr1
Tr2
Collector-base voltage (Emitter open)
Collector-emitter voltage (Base open)
Collector current
Total power dissipation
Overall
Junction temperature
Operating ambient temperature
Storage temperature
Symbol
V
CBO
V
CEO
I
C
P
T
T
j
T
opr
T
stg
Rating
–50
–50
–100
150
150
–40 to +85
–55 to +150
Unit
V
V
mA
mW
°C
°C
°C
1: Emitter (Tr1)
2: Emitter (Tr2)
3: Base (Tr2)
Panasonic
JEITA
Code
(C1)
6
4: Collector (Tr2)
5: Base (Tr1)
6: Collector (Tr1)
SMini6-F3-B
SC-113DB
SOT-363
(B1)
5
R
1
(C2)
4
Tr2
R
2
Tr1
R
2
R
1
1
(E1)
2
(E2)
3
(B2)
Resistance value
R
1
R
2
Typ
Max
10
47
kΩ
kΩ
Unit
V
V
Electrical Characteristics
T
a
= 25°C±3°C
Parameter
Collector-base voltage (Emitter open)
Collector-emitter voltage (Base open)
Collector-base cutoff current (Emitter open)
Collector-emitter cutoff current (Base open)
Emitter-base cutoff current (Collector open)
Forward current transfer ratio
h
FE
ratio
*1
Collector-emitter saturation voltage
Input voltage (ON)
Input voltage (OFF)
Input resistance
Resistance ratio
Symbol
V
CBO
V
CEO
I
CBO
I
CEO
I
EBO
h
FE
(Small/Large)
Conditions
I
C
= –10 µA, I
E
= 0
I
C
= –2 mA, I
B
= 0
V
CB
= –50 V, I
E
= 0
V
CE
= –50 V, I
B
= 0
V
EB
= –6 V, I
C
= 0
V
CE
= –10 V, I
C
= –5 mA
V
CE
= –10 V, I
C
= –5 mA
I
C
= –10 mA, I
B
= – 0.5 mA
V
CE
= – 0.2 V, I
C
= –5 mA
V
CE
= –5 V, I
C
= –100 µA
Min
–50
–50
– 0.1
– 0.5
– 0.2
80
0.50
0.99
– 0.25
–1.7
– 0.5
–30%
0.17
10
0.21
+30%
0.25
µA
µA
mA
V
V
V
kΩ
h
FE
V
CE(sat)
V
I(on)
V
I(off)
R
1
R
1
/ R
2
Note) 1. Measuring methods are based on JAPANESE INDUSTRIAL STANDARD JIS C 7030 measuring methods for transistors.
2. *1: Ratio between 2 elements
Publication date: September 2013
Ver. EED
1
DMA56604
DMA56604_PT-Ta
DMA56604_IC-VCE
P
T
T
a
I
C
V
CE
−120
T
a
=
25°C
−100
300
DMA56604_hFE-IC
h
FE
I
C
200
V
CE
= −10
V
T
a
=
85°C
25°C
−40°C
Total power dissipation P
T
(mW)
150
−500 µA
−80
−60
−40
−20
−400 µA
−300 µA
−200 µA
Forward current transfer ratio h
FE
I
B
= −600 µA
250
200
150
100
50
0
−
0.1
100
50
Collector current I
C
(mA)
−100 µA
0
0
40
80
120
160
200
0
0
−2
−4
−6
−8
−10
−12
−1
−10
−100
Ambient temperature T
a
(
°C
)
DMA56604_VCEsat-IC
Collector-emitter voltage V
CE
(V)
DMA56604_I
O
-V
IN
Collector current I
C
(mA)
DMA56604_VIN-IO
V
CE(sat)
I
C
I
O
V
IN
V
IN
I
O
Collector-emitter saturation voltage V
CE(sat)
(V)
−10
I
C
/ I
B
= 20
−10
V
O
= −5
V
T
a
=
85°C
−100
V
O
= −
0.2 V
Output current I
O
(mA)
Input voltage V
IN
(V)
−1
−1
25°C
−10
−40°C
T
a
=
85°C
25°C
−10
−1
T
a
= −40°C
25°C
−1
85°C
−
0.1
−40°C
−10
−2
−
0.01
−
0.1
−1
−10
−100
−10
−3
0
−
0.5
−1.0
−1.5
−2.0
−
0.1
−
0.1
−1
−10
−100
Collector current I
C
(mA)
Input voltage V
IN
(V)
Output current I
O
(mA)
Ver. EED
2
DMA56604
SMini6-F3-B
Unit: mm
Land Pattern (Reference) (Unit: mm)
Ver. EED
3
Request for your special attention and precautions in using the technical information and
semiconductors described in this book
(1)
If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and
regulations of the exporting country, especially, those with regard to security export control, must be observed.
(2) The technical information described in this book is intended only to show the main characteristics and application circuit examples
of the products. No license is granted in and to any intellectual property right or other right owned by Panasonic Corporation or any
other company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any
other company which may arise as a result of the use of technical information described in this book.
(3) The products described in this book are intended to be used for general applications (such as office equipment, communications
equipment, measuring instruments and household appliances), or for specific applications as expressly stated in this book.
Consult our sales staff in advance for information on the following applications:
–
Special applications (such as for airplanes, aerospace, automotive equipment, traffic signaling equipment, combustion equipment,
life support systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of
the products may directly jeopardize life or harm the human body.
It is to be understood that our company shall not be held responsible for any damage incurred as a result of or in connection with
your using the products described in this book for any special application, unless our company agrees to your using the products in
this book for any special application.
(4) The products and product specifications described in this book are subject to change without notice for modification and/or im-
provement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product
Standards in advance to make sure that the latest specifications satisfy your requirements.
(5) When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions
(operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute
maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any
defect which may arise later in your equipment.
Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure
mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire
or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products.
(6) Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS,
thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. When using products for which
damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages.
(7) This book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of our company.
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