IC,VOLT FOLLOWER,SINGLE,HYBRID,DIP,8PIN,CERAMIC
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | Texas Instruments |
| package instruction | DIP, DIP8,.9 |
| Reach Compliance Code | unknown |
| Amplifier type | BUFFER |
| Nominal bandwidth (3dB) | 100 MHz |
| Maximum bias current (IIB) at 25C | 0.005 µA |
| Maximum input offset voltage | 25000 µV |
| JESD-30 code | R-XDIP-T8 |
| JESD-609 code | e0 |
| Nominal Negative Supply Voltage (Vsup) | -15 V |
| Number of functions | 1 |
| Number of terminals | 8 |
| Maximum operating temperature | 85 °C |
| Minimum operating temperature | -25 °C |
| Package body material | CERAMIC |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP8,.9 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| power supply | +-15 V |
| minimum slew rate | 1000 V/us |
| Maximum slew rate | 24 mA |
| Nominal supply voltage (Vsup) | 15 V |
| surface mount | NO |
| technology | HYBRID |
| Temperature level | OTHER |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| LH0033CJ/A+ | LH0033AG | LH0033ACG | LH0033ACG/A+ | |
|---|---|---|---|---|
| Description | IC,VOLT FOLLOWER,SINGLE,HYBRID,DIP,8PIN,CERAMIC | BUFFER AMPLIFIER, MBCY12, METAL CAN, TO-8, 12 PIN | BUFFER AMPLIFIER, MBCY12, METAL CAN, TO-8, 12 PIN | IC,VOLT FOLLOWER,SINGLE,HYBRID,QUAD,12PIN,METAL |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible |
| Maker | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments |
| package instruction | DIP, DIP8,.9 | TO-8, QUAD12,.4SQ | TO-8, QUAD12,.4SQ | QIP, QUAD12,.4SQ |
| Reach Compliance Code | unknown | unknown | unknown | unknown |
| Amplifier type | BUFFER | BUFFER | BUFFER | BUFFER |
| Nominal bandwidth (3dB) | 100 MHz | 100 MHz | 100 MHz | 100 MHz |
| Maximum bias current (IIB) at 25C | 0.005 µA | 0.0015 µA | 0.0025 µA | 0.0025 µA |
| Maximum input offset voltage | 25000 µV | 10000 µV | 20000 µV | 20000 µV |
| JESD-30 code | R-XDIP-T8 | O-MBCY-W12 | O-MBCY-W12 | S-MQIP-T12 |
| JESD-609 code | e0 | e0 | e0 | e0 |
| Nominal Negative Supply Voltage (Vsup) | -15 V | -15 V | -15 V | -15 V |
| Number of functions | 1 | 1 | 1 | 1 |
| Number of terminals | 8 | 12 | 12 | 12 |
| Maximum operating temperature | 85 °C | 125 °C | 85 °C | 85 °C |
| Minimum operating temperature | -25 °C | -55 °C | -25 °C | -25 °C |
| Package body material | CERAMIC | METAL | METAL | METAL |
| encapsulated code | DIP | TO-8 | TO-8 | QIP |
| Encapsulate equivalent code | DIP8,.9 | QUAD12,.4SQ | QUAD12,.4SQ | QUAD12,.4SQ |
| Package shape | RECTANGULAR | ROUND | ROUND | SQUARE |
| Package form | IN-LINE | CYLINDRICAL | CYLINDRICAL | IN-LINE |
| power supply | +-15 V | +-15 V | +-15 V | +-15 V |
| minimum slew rate | 1000 V/us | 1000 V/us | 1000 V/us | 1000 V/us |
| Maximum slew rate | 24 mA | 22 mA | 24 mA | 24 mA |
| Nominal supply voltage (Vsup) | 15 V | 15 V | 15 V | 15 V |
| surface mount | NO | NO | NO | NO |
| technology | HYBRID | BIPOLAR | BIPOLAR | HYBRID |
| Temperature level | OTHER | MILITARY | OTHER | OTHER |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE | WIRE | WIRE | THROUGH-HOLE |
| Terminal pitch | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
| Terminal location | DUAL | BOTTOM | BOTTOM | QUAD |