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SN74ALS09N

Description
AND Gate, TTL, PDIP14
Categorylogic    logic   
File Size62KB,2 Pages
ManufacturerMotorola ( NXP )
Websitehttps://www.nxp.com
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SN74ALS09N Overview

AND Gate, TTL, PDIP14

SN74ALS09N Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerMotorola ( NXP )
package instructionDIP, DIP14,.3
Reach Compliance Codeunknown
JESD-30 codeR-PDIP-T14
JESD-609 codee0
Logic integrated circuit typeAND GATE
Number of terminals14
Maximum operating temperature70 °C
Minimum operating temperature
Output characteristicsOPEN-COLLECTOR
Package body materialPLASTIC/EPOXY
encapsulated codeDIP
Encapsulate equivalent codeDIP14,.3
Package shapeRECTANGULAR
Package formIN-LINE
power supply5 V
Certification statusNot Qualified
Schmitt triggerNO
Nominal supply voltage (Vsup)5 V
surface mountNO
technologyTTL
Temperature levelCOMMERCIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL
This Material Copyrighted By Its Respective Manufacturer

SN74ALS09N Related Products

SN74ALS09N SN54ALS09J
Description AND Gate, TTL, PDIP14 AND Gate, TTL, CDIP14
Is it Rohs certified? incompatible incompatible
Maker Motorola ( NXP ) Motorola ( NXP )
package instruction DIP, DIP14,.3 DIP, DIP14,.3
Reach Compliance Code unknown unknown
JESD-30 code R-PDIP-T14 R-XDIP-T14
JESD-609 code e0 e0
Logic integrated circuit type AND GATE AND GATE
Number of terminals 14 14
Maximum operating temperature 70 °C 125 °C
Output characteristics OPEN-COLLECTOR OPEN-COLLECTOR
Package body material PLASTIC/EPOXY CERAMIC
encapsulated code DIP DIP
Encapsulate equivalent code DIP14,.3 DIP14,.3
Package shape RECTANGULAR RECTANGULAR
Package form IN-LINE IN-LINE
power supply 5 V 5 V
Certification status Not Qualified Not Qualified
Schmitt trigger NO NO
Nominal supply voltage (Vsup) 5 V 5 V
surface mount NO NO
technology TTL TTL
Temperature level COMMERCIAL MILITARY
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form THROUGH-HOLE THROUGH-HOLE
Terminal pitch 2.54 mm 2.54 mm
Terminal location DUAL DUAL
Summary of basic embedded development steps
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