REVISION AI
DO NOT
SCALE FROM
THIS PRINT
HTMS-1XX-XX-X-D-SM-X-XX
No OF POSITIONS
-02 THRU -40
(PER ROW)
(No OF POS x .050 [1.27]) +.002/-.010
[+.05/-.25]
LEAD STYLE
SEE TABLE 1
01
79
SEE NOTE 4
.196 4.98
REF
.100 2.54
REF
PLATING SPECIFICATION
-G: 10µ" GOLD IN CONTACT AREA,
3µ" GOLD ON TAIL
-T: MATTE TIN CONTACT AND TAIL
-S: 30µ" SELECTIVE GOLD IN CONTACT AREA,
MATTE TIN ON TAIL
-F: 3µ" FLASH SELECTIVE GOLD ON CONTACT AREA,
MATTE TIN ON TAIL
( LEAD STYLE -01, -51 & -52 ONLY)
-L: 10µ" LIGHT SELECTIVE GOLD ON CONTACT AREA,
MATTE TIN ON TAIL
BODY SPECIFICATION
-D: DOUBLE (USE HTMS-50-D)
OPTION
-XXX: POLARIZING SPECIFICATION
(INDICATES POS TO BE OMITTED)
-A: ALIGNMENT PIN
STAKED (6 POS MIN)
OR MOLDED (5 POS MIN)
(SEE SHT 2, FIG 2)
(SAMTEC'S DISCRETION)
-LC: LOCKING CLIP
(SEE SHT 2, FIG 4)
(5 POS MIN)
(USE LC-05-X)
-TR: TAPE AND REEL
OPTION
-P: PICK & PLACE PAD
(USE PPP-22)
(SEE SHT 2, FIG 3)
(5 POS MIN)
02
80
HTMS-50-D
OPTION
-SM: SURFACE MOUNT
.050 1.27 REF
2 MAX SWAY
(EITHER DIRECTION)
T-1M6-XX-X-2
.018 0.46 SQ REF
2 MAX SWAY
(EITHER DIRECTION)
2 MAX SWAY
(EITHER DIRECTION)
.050 1.27 (TYP)
(SEE NOTE 6)
CONTACT
AREA
C
"B"
90°
- 2°
(TYP)
+4°
.100 2.54
REF
C
C
AI
.004 [.10]
.050 1.27
(MEASURE AT
BEND RADIUS)
.2960 7.518 REF
FIG 1
HTMS-1XX-XX-X-D-SM SHOWN
NOTES:
1.
REPRESENTS A CRITICAL DIMENSION.
2. MAXIMUM CUT FLASH: .010[.25].
3. MINIMUM PUSHOUT FORCE: 2 LBS
4. MAXIMUM PIN ROTATION IN BODY: 2°.
5. MAXIMUM ALLOWABLE BOW: .005[.13] INCH/INCH
AFTER ASSEMBLY.
6. SHEAR TAILS TO DIMENSION SHOWN.
7. MAXIMUM BURR ALLOWANCE: .003[.08]
8. TUBE POSITIONS -05 THRU -40 ONLY FOR THIS LEAD STYLE,
UNLESS OTHERWISE NOTED, LAYER PACKAGE POSITIONS -02 THRU -04.
9. TUBE POSITIONS -07 THRU -40 ONLY FOR THIS LEAD STYLE,
UNLESS OTHERWISE NOTED, LAYER PACKAGE POSITIONS -02 THRU -06.
C
UNLESS OTHERWISE SPECIFIED,
DIMENSIONS ARE IN INCHES.
TOLERANCES ARE:
DECIMALS
PROPRIETARY NOTE
THIS DOCUMENT CONTAINS INFORMATION
CONFIDENTIAL AND PROPRIETARY TO
SAMTEC, INC. AND SHALL NOT BE REPRODUCED
OR TRANSFERRED TO OTHER DOCUMENTS OR
DISCLOSED TO OTHERS OR USED FOR ANY
PURPOSE OTHER THAN THAT WHICH IT WAS
OBTAINED WITHOUT THE EXPRESSED WRITTEN
CONSENT OF SAMTEC, INC.
.XX: .01 [.3]
2
.XXX: .005 [.13]
.XXXX: .0020 [.051]
ANGLES
520 PARK EAST BLVD, NEW ALBANY, IN 47150
PHONE: 812-944-6733
FAX: 812-948-5047
e-Mail info@SAMTEC.com
code 55322
DESCRIPTION:
DWG. NO.
MATERIAL:
DO NOT SCALE DRAWING
SHEET SCALE: 2:1
INSULATOR: BLACK, LCP, UL 94 VO
TERMINAL: PHOS BRONZE
"NEW" ASSEMBLY DRAWING
F:\DWG\MISC\MKTG\HTMS-1XX-XX-X-D-SM-X-XX-MKT.SLDDRW
BY:
DEAN P
HTMS-1XX-XX-X-D-SM-X-XX
12/12/2000
SHEET
1
OF
2
REVISION AI
.040 1.02
REF
.090 2.29
.090 2.29
REF
.040 1.02
REF
.0430 1.092
REF
(No OF POS - 2) x .050[1.27]
SM-A8
2 MAX SWAY
(EITHER DIRECTION)
.0430 1.092 REF
(No OF POS -2) x .0500[1.270]
REF
STAKED ALIGNMENT PIN
(6 POSITIONS MINIMUM)
FIG 2
-A OPTION: ALIGNMENT PIN
(DIFFERENT AS SHOWN, OTHERWISE SAME AS FIG 1)
MOLDED ALIGNMENT PIN
(5 POSITIONS MINIMUM)
"N"
.375 9.53 REF
"Q"
.390 9.91 REF
PPP-22
.105 2.67
.230 5.84
REF
(No OF POS - 2) x .050[1.27]
.055 1.40 REF
FIG 4
-LC OPTION: STAKED LOCKING CLIP
(5 POSITIONS MINIMUM)
(DIFFERENT AS SHOWN, OTHERWISE SAME AS FIG 1)
C
L
PROPRIETARY NOTE
THIS DOCUMENT CONTAINS INFORMATION
CONFIDENTIAL AND PROPRIETARY TO
SAMTEC, INC. AND SHALL NOT BE REPRODUCED
OR TRANSFERRED TO OTHER DOCUMENTS OR
DISCLOSED TO OTHERS OR USED FOR ANY
PURPOSE OTHER THAN THAT WHICH IT WAS
OBTAINED WITHOUT THE EXPRESSED WRITTEN
CONSENT OF SAMTEC, INC.
.056 1.42 REF
LC-05-X
FIG 3
-P: PICK & PLACE
"N" = USE MEASURED DIM
"Q" = {("N" - .375 [.375]) / 2} .020 [.51]
520 PARK EAST BLVD, NEW ALBANY, IN 47150
PHONE: 812-944-6733
FAX: 812-948-5047
e-Mail info@SAMTEC.com
code 55322
DESCRIPTION:
DWG. NO.
DO NOT SCALE DRAWING
SHEET SCALE: 2:1
"NEW" ASSEMBLY DRAWING
F:\DWG\MISC\MKTG\HTMS-1XX-XX-X-D-SM-X-XX-MKT.SLDDRW
BY:
DEAN P
HTMS-1XX-XX-X-D-SM-X-XX
12/12/2000
SHEET
2
OF
2
Microcontroller MCU
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