Agilent HBCU-5710R 1000BASE-T Small
Form Pluggable Low Voltage (3.3 V)
Electrical Transceiver over Category 5
Unshielded Twisted Pair Cable
Data Sheet
Description
The HBCU-5710R electrical
transceiver from Agilent offers
full duplex throughput of 1000
Mb/s by transporting data over
unshielded twisted pair category
5 cable with 5-level PAM (Pulse
Amplitude Modulation) signals.
The Agilent 1000BASE-T module
takes signals from both the
twisted pair category 5 cable
and the SerDes interface. Pin
count overhead between the
MAC and the PHY is minimized,
and Gigabit Ethernet operation
is achieved with maximum space
savings.
Related Products
•
HFBR-5601: 850 nm +5 V Gigabit
Interface Converter (GBIC) for
Gigabit Ethernet
•
HFBR-53D5: 850 nm +5 V 1x9
optical transceiver for Gigabit
Ethernet
•
HFBR-5710L: 850 nm +3.3 V SFP
optical transceiver for Gigabit
Ethernet
•
HFBR-5912E: 850 nm +3.3 V SFF
optical transceiver for Gigabit
Ethernet
•
HDMP-1636A: 1.25 Gbps TRx
family of SerDes IC
•
HFBR-0534: SFP Evaluation Kit
Features
•
Designed for Industry-Standard
MSA-Compliant, Small Form
Factor Pluggable (SFP) Ports
•
Compatible with IEEE 802.3:2000
•
Custom RJ-45 connector with
integrated magnetics
•
Link lengths at 1.25 Gbd: up to 100
m per IEEE802.3
•
Low power, high performance
1.25 Gbd SerDes integrated in
module
•
Single +3.3 V power supply
operation
•
Auto-negotiation per IEEE
802.3:2000 Clause 28 (1000BASE-T)
and Clause 37 (1000BASE-X)
Applications
•
Switch to switch interface
•
Switched backplane applications
•
File server interface
Module Diagrams
Figure 1 illustrates the major
functional components of the
HBCU-5710R. The 20-pin
connection diagram of module
printed circuit board of the
module is shown in Figure 2.
Figure 3 depicts the pin
assignment of the MDI (RJ45
jack).
Figure 7 depicts the external
configuration and dimensions of
the module.
Installation
The HBCU-5710R can be
installed in or removed from any
MultiSource Agreement (MSA)
compliant Small Form Pluggable
port whether the host equipment
is operating or not. The module
is simply inserted, small end
first, under finger-pressure.
Controlled hot-plugging is
ensured by design and by 3-
stage pin sequencing at the
electrical interface to the host
board. The module housing
makes initial contact with the
host board EMI shield,
mitigating potential damage due
to Electro-Static Discharge
(ESD). The module pins
sequentially contact the (1)
Ground, (2) Power, and (3)
Signal pins of the host board
surface mount connector. This
printed circuit board card-edge
connector is depicted in Figure
2.
TX_DATA
RX_DATA
TX_DISABLE
TX_FAULT
RX_LOS
RATE_SELECT
MOD_DEF2
MOD_DEF1
MOD_DEF0
D
NC
SerDes/
DSP
B
Magnetics
C
RJ45
Adapter
A
EEPROM
Figure 1: Transceiver Functional Diagram
20
19
18
17
16
15
14
13
12
11
V
EE
T
TD-
TD+
V
EE
T
V
CC
T
V
CC
R
V
EE
R
RD+
RD-
V
EE
R
1
2
3
4
5
6
7
8
9
10
V
EE
T
TX_FAULT
TX_DISABLE
MOD-DEF(2)
MOD-DEF(1)
MOD-DEF(0)
Rate Select
LOS
V
EE
R
V
EE
R
Top of Board
Bottom of Board
(as viewed thru top of board)
Note:
TX_FAULT and Rate_Select not used.
Figure 2: 20-pin Connection Diagram of Module Printed Circuit Board
PIN 1
PIN 8
Figure 3: MDI ( RJ 45 Jack) Pin Assignment
2
Serial Identification (EEPROM)
The HBCU-5710R complies with
an industry standard
MultiSource Agreement that
defines the serial identification
protocol. This protocol uses the
2-wire serial CMOS EEPROM
protocol of the ATMEL
AT24C01A or equivalent. The
contents of the HBCU-5710R
serial ID memory are defined in
Table 3 as specified in the SFP
MSA.
Controller and Data I/O
Data I/Os are designed to accept
industry standard differential
signals. In order to reduce the
number of passive components
required on the customer’s
board, Agilent has included the
functionality of the transmitter
bias resistors and coupling
capacitors within the module.
The transceiver is compatible
with an “ac-coupled”
configuration and is internally
terminated. Figure 1 depicts
the functional diagram of the
HBCU-5710R.
Caution should be taken into
account for the proper
interconnection between the
supporting Physical Layer
integrated circuits and the
HBCU-5710R. Figure 4
illustrates the recommended
interface circuit.
Several control data signals and
timing diagrams are
implemented in the module and
are depicted in Figure 6.
Application Support
Evaluation Kit
To help you in your preliminary
transceiver evaluation, Agilent
offers a 1.25 GBd Gigabit
Ethernet evaluation board. This
board will allow testing of the
electrical parameters of
transceiver. Please contact your
local Field Sales representative
for availability and ordering
details.
Reference Designs
Reference designs for the HBCU-
5710R electrical transceiver and
the HDMP-1636A physical layer
IC are available to assist the
equipment designer. Figure 4
depicts a typical application
configuration, while Figure 5
depicts the MSA power supply
filter circuit design. Please
contact your local Field Sales
engineer for more information
regarding application tools.
3
Regulatory Compliance
See Table 1 for transceiver
Regulatory Compliance
performance. The overall
equipment design will determine
the certification level. The
transceiver performance is
offered as a figure of merit to
assist the designer.
Electrostatic Discharge (ESD)
There are two conditions in
which immunity to ESD damage
is important. Table 1 documents
our immunity to both of these
conditions. The first condition is
during handling of the
transceiver prior to insertion
into the transceiver port. To
protect the transceiver, it is
important to use normal ESD
handling precautions. These
precautions include using
grounded wrist straps, work
benches, and floor mats in ESD
controlled areas. The ESD
sensitivity of the HBCU-5710R is
compatible with typical industry
production environments. The
second condition is static
discharges to the exterior of the
host equipment chassis after
installation. To the extent that
the RJ45 connector interface is
exposed to the outside of the
Table 1: Regulatory Compliance
host equipment chassis, it may
be subject to system-level ESD
requirements. The ESD
performance of the HBCU-5710R
exceeds typical industry
standards.
Immunity
Equipment hosting the HBCU-
5710R modules will be subjected
to radio-frequency
electromagnetic fields in some
environments. The transceivers
have good immunity to such
fields due to their shielded
design.
Electromagnetic Interference (EMI)
Most equipment designs utilizing
these high-speed transceivers
from Agilent will be required to
meet the requirements of FCC in
the United States, CENELEC
EN55022 (CISPR 22A) in Europe
and VCCI in Japan.
The metal housing and shielded
design of the HBCU-5710R
minimize the EMI challenge
facing the host equipment
designer. These transceivers
provide superior EMI
performance. This greatly assists
the designer in the management
of the overall system EMI
performance.
Flammability
The HBCU-5710R electrical
transceiver housing is made of
metal and high strength, heat
resistant, chemically resistant,
and UL 94V-0 flame retardant
plastic.
Caution
There are no user serviceable
parts nor any maintenance
required for the HBCU-5710R.
Tampering with or modifying the
performance of the HBCU-5710R
will result in voided product
warranty. It may also result in
improper operation of the
HBCU-5710R circuitry, and
possible overstress of the RJ 45
connector. Device degradation
or product failure may result.
Connection of the HBCU-5710R
to a non-approved other
1000BASE-T module, operating
above the recommended
absolute maximum conditions or
operating the HBCU-5710R in a
manner inconsistent with its
design and function may result
in hazardous radiation exposure
and may be considered an act of
modifying or manufacturing an
electrical module product.
Feature
Electrostatic Discharge (ESD) to the
Electrical Pins
Electrostatic Discharge (ESD) to the RJ 45
Connector Receptacle
Test Method
MIL-STD-883C, Method 3015.4
JEDEC/ EIA JESD22-A114-A
Variation of IEC 61000-4-2
Performance
Class 2 (2000 Volts)
Typically withstand 15 kV ( Air Discharge), 8
kV ( Contact) without damage when the RJ
45 connector receptacle is contacted by a
Human Body Model probe.
System margins are dependent on customer
board and chassis design.
Electromagnetic Interference (EMI)
FCC Part 15 Class B
CENELEC EN55022 Class B
(CISPR 22A)
VCCI Class 1
Variation of IEC 61000-4-3
Immunity
Typically shows a negligible effect from a 10
V/m field swept from 80 to 1000 MHz applied
to the transceiver without a chassis enclosure.
UL File # E173874
TUV File # R 72031300 Page 2
Component Recognition
Underwriters Laboratories and Canadian Standards
Association Joint Component Recognition for
Information Technology Equipment Including
Electrical Business Equipment
4
Ordering Information
Please contact your local field
sales engineer or one of Agilent’s
franchised distributors for
ordering information. For
technical information, please
visit Agilent’s web page at
www.agilent.com or contact
Agilent Semiconductor Products
Customer Response Center at 1-
800-235-0312. For information
related to the MSA visit
www.schelto.com/SFP/index.html
V_SUPPLY
1 uH
10 uF 0.1 uF
1 uH
10 uF
0.1 uF
0.1 uF
VCC_T
HBCU-5710R
VCC_R
4.7 K
TX_DISABLE
TX_FAULT
PHY
IC
0.01 uF
0.01 uF
RD+
100
RD-
0.01 uF
RX_LOS
MOD_DEF 1
MOD_DEF 2
MOD_DEF 0
REF CLK
EEPROM
50
0.01 uF
50
100
RJ45 JACK &
MAGNETICS
CAT5
CABLE
TX[0:9]
HDMP-
1636A
RX[0:9]
TD+
TD-
PROTOCOL
IC
4.7 K 4.7 K 4.7 K 4.7 K
V_SUPPLY
Figure 4: Typical Application Configuration
V_SUPPLY
1 UH
10 UF
0.1 UF
1 UH
10 UF
Note:
Inductors must have less than 1 ohm series resistance per MSA.
Figure 5: MSA Recommended Power Supply Filter
0.1 UF
0.1 UF
5
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