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ZVP4424ASTOB

Description
200mA, 240V, P-CHANNEL, Si, SMALL SIGNAL, MOSFET, TO-92 COMPATIBLE, E-LINE PACKAGE-3
CategoryDiscrete semiconductor    The transistor   
File Size145KB,3 Pages
ManufacturerDiodes Incorporated
Environmental Compliance
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ZVP4424ASTOB Overview

200mA, 240V, P-CHANNEL, Si, SMALL SIGNAL, MOSFET, TO-92 COMPATIBLE, E-LINE PACKAGE-3

ZVP4424ASTOB Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
MakerDiodes Incorporated
Parts packaging codeTO-92
package instructionIN-LINE, R-PSIP-W3
Contacts3
Reach Compliance Codeunknown
ECCN codeEAR99
ConfigurationSINGLE
Minimum drain-source breakdown voltage240 V
Maximum drain current (ID)0.2 A
Maximum drain-source on-resistance15 Ω
FET technologyMETAL-OXIDE SEMICONDUCTOR
JESD-30 codeR-PSIP-W3
JESD-609 codee3
Humidity sensitivity level1
Number of components1
Number of terminals3
Operating modeENHANCEMENT MODE
Maximum operating temperature200 °C
Package body materialPLASTIC/EPOXY
Package shapeRECTANGULAR
Package formIN-LINE
Peak Reflow Temperature (Celsius)260
Polarity/channel typeP-CHANNEL
Certification statusNot Qualified
surface mountNO
Terminal surfaceMATTE TIN
Terminal formWIRE
Terminal locationSINGLE
Maximum time at peak reflow temperature40
transistor applicationsSWITCHING
Transistor component materialsSILICON

ZVP4424ASTOB Preview

P-CHANNEL ENHANCEMENT
MODE VERTICAL DMOS FET
ISSUE 2 – SEPTEMBER 94
FEATURES
* 240 Volt V
DS
* R
DS(on)
=9Ω
* Low threshold
APPLICATIONS
* Electronic Hook Switch
ZVP4424A
D
G
S
ABSOLUTE MAXIMUM RATINGS.
PARAMETER
Drain-Source Voltage
Continuous Drain Current at T
amb
=25°C
Pulsed Drain Current
Gate Source Voltage
Power Dissipation at T
amb
=25°C
Operating and Storage Temperature Range
SYMBOL
V
DS
I
D
I
DM
V
GS
P
tot
T
j
:T
stg
-240
-200
-1
±
40
E-Line
TO92 Compatible
VALUE
UNIT
V
mA
A
V
mW
°C
750
-55 to +150
ELECTRICAL CHARACTERISTICS (at T
amb
= 25°C unless otherwise stated).
PARAMETER
Drain-Source Breakdown
Voltage
Gate-Source Threshold
Voltage
Gate-Body Leakage
Zero Gate Voltage Drain
Current
On-State Drain Current
Static Drain-Source
On-State Resistance
Forward
Transconductance (1) (2)
Input Capacitance (2)
Common Source Output
Capacitance (2)
Reverse Transfer
Capacitance (2)
Turn-On Delay Time (2)(3)
Rise Time (2)(3)
Turn-Off Delay Time (2)(3)
Fall Time (2)(3)
SYMBOL MIN.
BV
DSS
V
GS(th)
I
GSS
I
DSS
I
D(on)
R
DS(on)
g
fs
C
iss
C
oss
C
rss
t
d(on)
t
r
t
d(off)
t
f
125
100
18
5
8
8
26
20
200
25
15
15
15
40
30
-0.75
-1.0
7.1
8.8
9
11
-240
-0.7
-1.4
-2.0
100
-10
-100
TYP
MAX. UNIT
V
V
nA
µ
A
µ
A
CONDITIONS.
I
D
=-1mA, V
GS
=0V
ID=-1mA, V
DS
= V
GS
V
GS
=
±
40V, V
DS
=0V
V
DS
=-240 V, V
GS
=0
V
DS
=-190V, V
GS
=0V, T=125°C
V
DS
=-10 V, V
GS
=-10V
V
GS
=-10V,I
D
=-200mA
V
GS
=-3.5V,I
D
=-100mA
V
DS
=-10V,I
D
=-0.2A
A
mS
pF
pF
pF
ns
ns
ns
ns
V
DS
=-25V, V
GS
=0V, f=1MHz
V
DD
≈−
50V, I
D
=-0.25A,
V
GEN
=-10V
(1) Measured under pulsed conditions. Width=300
µ
s. Duty cycle
2% (2) Sample test.
(3) Switching times measured with 50
source impedance and <5ns rise time on a pulse generator
3-436
ZVP4424A
TYPICAL CHARACTERISTICS
-1.2
300µs Pulsed Test
V
GS
=-10V
-5V
-4V
-1.2
I
D
- Drain Current (Amps)
I
D
- Drain Current (Amps)
-1.0
-0.8
-0.6
-0.4
-0.2
0
0
-2
-4
-6
-8
-1.0
-0.8
-0.6
-0.4
-0.2
0
V
DS
=-10V
300µs Pulsed Test
-3V
-2.5V
-2V
-10
0
-2
-4
-6
-8
-10
V
DS
- Drain Source
Voltage (Volts)
V
GS
- Gate Source
Voltage (Volts)
Saturation Characteristics
400
400
Transfer Characteristics
g
fs
-Transconductance (mS)
g
fs
-Transconductance (mS)
300
300
200
300µs Pulsed Test
V
DS
=-10V
100
200
300µs Pulsed Test
V
DS
=-10V
100
0
0
-0.2
-0.4
-0.6
-0.8
-1.0
0
0
-2
-4
-6
I
D
- Drain Current (Amps)
V
GS
-Gate Source Voltage (Volts)
Transconductance v drain current
RDS(on)-Drain Source On Resistance
(Ω)
Transconductance v gate-source voltage
100
V
GS
=-2V
-2.5V
2.4
Normalised R
DS(on)
and V
GS(th)
2.2
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
-50
-25
0
25
50
75
V
GS=
-10V
I
D
=0.2A
-3V
-10V
10
Re
rce
ou
-S
ain
Dr
Gate T
h
Voltag reshold
e V
GS(T
H
)
R
D
ce
tan
sis
n)
S(o
300µs Pulsed Test
V
GS=
V
DS
I
D=
-1mA
1
-0.01
-0.1
-1
-10
100
125
150
I
D-
Drain Current (Amps)
Junction Temperature (°C)
On-resistance vs Drain Current
Normalised R
DS(on)
and V
GS(th)
vs Temperature
3-437
ZVP4424A
TYPICAL CHARACTERISTICS
Note:V
GS=
0V
300
250
200
150
100
50
0
-0.01
-1
C
rss
-10
-100
C
iss
0
-2
-4
-6
-8
-10
-12
-14
Note:I
D=-
0.25A
-16
0
1
2
3
4
5
V
DS
= -20V
-50V
-100V
C
oss
V
DS
-Drain Source Voltage (Volts)
V
GS
-Gate Source Voltage (Volts)
C-Capacitance (pF)
Q-Gate Charge (nC)
Capacitance v drain-source voltage
Gate charge v gate-source voltage
0.8
D=1 (D.C.)
Thermal Resistance (°C/W)
P
tot
-Power Dissipation (mW)
150
0.6
100
D=0.5
0.4
50
D=0.2
D=0.1
D=0.05
Single Pulse
0.2
0
0.0001
0
0.1
1
10
100
0.001
0.01
0
50
100
150
Pulse Width (seconds)
T
amb
- Ambient Temperature (°C)
Maximum transient thermal impedance
Derating Curve
3-438

ZVP4424ASTOB Related Products

ZVP4424ASTOB ZVP4424ASTZ
Description 200mA, 240V, P-CHANNEL, Si, SMALL SIGNAL, MOSFET, TO-92 COMPATIBLE, E-LINE PACKAGE-3 Small Signal Field-Effect Transistor, 0.2A I(D), 240V, 1-Element, P-Channel, Silicon, Metal-oxide Semiconductor FET, TO-92 COMPATIBLE, E-LINE PACKAGE-3
Is it Rohs certified? conform to conform to
Maker Diodes Incorporated Diodes Incorporated
Parts packaging code TO-92 TO-92
package instruction IN-LINE, R-PSIP-W3 TO-92 COMPATIBLE, E-LINE PACKAGE-3
Contacts 3 3
Reach Compliance Code unknown not_compliant
ECCN code EAR99 EAR99
Configuration SINGLE SINGLE
Minimum drain-source breakdown voltage 240 V 240 V
Maximum drain current (ID) 0.2 A 0.2 A
Maximum drain-source on-resistance 15 Ω 15 Ω
FET technology METAL-OXIDE SEMICONDUCTOR METAL-OXIDE SEMICONDUCTOR
JESD-30 code R-PSIP-W3 R-PSIP-W3
JESD-609 code e3 e3
Number of components 1 1
Number of terminals 3 3
Operating mode ENHANCEMENT MODE ENHANCEMENT MODE
Package body material PLASTIC/EPOXY PLASTIC/EPOXY
Package shape RECTANGULAR RECTANGULAR
Package form IN-LINE IN-LINE
Peak Reflow Temperature (Celsius) 260 260
Polarity/channel type P-CHANNEL P-CHANNEL
Certification status Not Qualified Not Qualified
surface mount NO NO
Terminal surface MATTE TIN Matte Tin (Sn)
Terminal form WIRE WIRE
Terminal location SINGLE SINGLE
Maximum time at peak reflow temperature 40 40
transistor applications SWITCHING SWITCHING
Transistor component materials SILICON SILICON

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