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U8797JF

Description
Microcontroller, 16-Bit, OTPROM, 8096 CPU, 12MHz, NMOS, PDIP64, SHRINK, PLASTIC, DIP-64
CategoryThe embedded processor and controller    Microcontrollers and processors   
File Size862KB,19 Pages
ManufacturerIntel
Websitehttp://www.intel.com/
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U8797JF Overview

Microcontroller, 16-Bit, OTPROM, 8096 CPU, 12MHz, NMOS, PDIP64, SHRINK, PLASTIC, DIP-64

U8797JF Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerIntel
Parts packaging codeDIP
package instructionSDIP, SDIP64,.75
Contacts64
Reach Compliance Codecompliant
Has ADCYES
Other features16-BIT EPROM BUS FOR PROGRAM MEMORY; 256 X 8 XRAM FOR CODE
Address bus width16
bit size16
boundary scanNO
CPU series8096
maximum clock frequency12 MHz
DAC channelNO
DMA channelNO
External data bus width16
FormatFIXED POINT
Integrated cacheNO
JESD-30 codeR-PDIP-T64
JESD-609 codee0
length58 mm
low power modeYES
Number of DMA channels
Number of external interrupt devices1
Number of I/O lines40
Number of serial I/Os1
Number of terminals64
Number of timers2
On-chip data RAM width8
On-chip program ROM width8
Maximum operating temperature70 °C
Minimum operating temperature
PWM channelYES
Package body materialPLASTIC/EPOXY
encapsulated codeSDIP
Encapsulate equivalent codeSDIP64,.75
Package shapeRECTANGULAR
Package formIN-LINE, SHRINK PITCH
Peak Reflow Temperature (Celsius)NOT SPECIFIED
power supply5 V
Certification statusNot Qualified
RAM (bytes)488
RAM (number of words)232
rom(word)16000
ROM programmabilityOTPROM
Maximum seat height5.65 mm
speed12 MHz
Maximum slew rate300 mA
Maximum supply voltage5.5 V
Minimum supply voltage4.5 V
Nominal supply voltage5 V
surface mountNO
technologyNMOS
Temperature levelCOMMERCIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formTHROUGH-HOLE
Terminal pitch1.778 mm
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED
width19.05 mm
uPs/uCs/peripheral integrated circuit typeMICROCONTROLLER

U8797JF Related Products

U8797JF U8097JF N8397JF
Description Microcontroller, 16-Bit, OTPROM, 8096 CPU, 12MHz, NMOS, PDIP64, SHRINK, PLASTIC, DIP-64 Microcontroller, 16-Bit, 8096 CPU, 12MHz, NMOS, PDIP64, SHRINK, PLASTIC, DIP-64 Microcontroller, 16-Bit, MROM, 8096 CPU, 12MHz, NMOS, PQCC68, PLASTIC, LCC-68
Is it Rohs certified? incompatible incompatible incompatible
Maker Intel Intel Intel
Parts packaging code DIP DIP LCC
package instruction SDIP, SDIP64,.75 SDIP, SDIP64,.75 QCCJ, LDCC68,1.0SQ
Contacts 64 64 68
Reach Compliance Code compliant compliant compliant
Has ADC YES YES YES
Other features 16-BIT EPROM BUS FOR PROGRAM MEMORY; 256 X 8 XRAM FOR CODE 256 X 8 XRAM FOR CODE 256 X 8 XRAM FOR CODE
Address bus width 16 16 16
bit size 16 16 16
boundary scan NO NO NO
CPU series 8096 8096 8096
maximum clock frequency 12 MHz 12 MHz 12 MHz
DAC channel NO NO NO
DMA channel NO NO NO
External data bus width 16 16 16
Format FIXED POINT FIXED POINT FIXED POINT
Integrated cache NO NO NO
JESD-30 code R-PDIP-T64 R-PDIP-T64 S-PQCC-J68
JESD-609 code e0 e0 e0
length 58 mm 58 mm 24.2 mm
low power mode YES YES YES
Number of external interrupt devices 1 1 2
Number of I/O lines 40 40 40
Number of serial I/Os 1 1 1
Number of terminals 64 64 68
Number of timers 2 2 2
On-chip data RAM width 8 8 8
On-chip program ROM width 8 - 8
Maximum operating temperature 70 °C 70 °C 70 °C
PWM channel YES YES YES
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code SDIP SDIP QCCJ
Encapsulate equivalent code SDIP64,.75 SDIP64,.75 LDCC68,1.0SQ
Package shape RECTANGULAR RECTANGULAR SQUARE
Package form IN-LINE, SHRINK PITCH IN-LINE, SHRINK PITCH CHIP CARRIER
Peak Reflow Temperature (Celsius) NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
power supply 5 V 5 V 5 V
Certification status Not Qualified Not Qualified Not Qualified
RAM (bytes) 488 488 488
RAM (number of words) 232 232 232
rom(word) 16000 - 16384
Maximum seat height 5.65 mm 5.65 mm 4.83 mm
speed 12 MHz 12 MHz 12 MHz
Maximum slew rate 300 mA 300 mA 300 mA
Maximum supply voltage 5.5 V 5.5 V 5.5 V
Minimum supply voltage 4.5 V 4.5 V 4.5 V
Nominal supply voltage 5 V 5 V 5 V
surface mount NO NO YES
technology NMOS NMOS NMOS
Temperature level COMMERCIAL COMMERCIAL COMMERCIAL
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form THROUGH-HOLE THROUGH-HOLE J BEND
Terminal pitch 1.778 mm 1.778 mm 1.27 mm
Terminal location DUAL DUAL QUAD
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
width 19.05 mm 19.05 mm 24.2 mm
uPs/uCs/peripheral integrated circuit type MICROCONTROLLER MICROCONTROLLER MICROCONTROLLER
ROM programmability OTPROM - MROM

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