LGER433M(F11)
SAW Resonator
1. SCOPE
This specification shall cover the characteristics of 1-port SAW resonator with
used for remote-control security.
2. ELECTRICAL SPECIFICATION
DC Voltage VDC
AC Voltage Vpp
Operation temperature
Storage temperature
RF Power Dissipation
Electronic Characteristics
Item
Center Frequency
Insertion Loss
Quality Factor Unload Q
50Ω Loaded Q
Temperature Turnover Temperature
Stability
Turnover Frequency
Freq.temp.Coefficient
Frequency Aging
DC. Insulation Resistance
Motional Resistance R1
10V
10V50Hz/60Hz
-20℃ to +85℃
-45℃ to +85℃
0dBm
Unites
MHz
dB
Minimum
433.845
Typical
433.920
1.5
12,800
2,000
Maximum
433.995
2.5
℃
KHz
ppm/℃2
ppm/yr
MΩ
Ω
μH
pF
pF
pF
1.7
1.0
39
fo±2.7
0.037
<±10
18
86
1.5
2.0
1.9
26
RF Equivalent
Motional Inductance L1
RLC Model
Motional Capacitance C1
Pin 1 to Pin 2 Staic Capacitance
Transducer Static Capacitance
2.3
3. TEST CIRCUIT
http://www.luguang.cn
mail:lge@luguang.cn
1
LGER433M(F11)
SAW Resonator
4. DIMENSION
5. ENVIRONMENTAL CHARACTERISTICS
5-1 High temperature exposure
Subject the device to +85℃ for 16 hours. Then release the filter into
room conditions for 24 hours prior to the measurement. It shall fulfill
specifications in table 1.
5-2 Low temperature exposure
Subject the device to -20℃ for 16 hours. Then release the device into
room conditions for 24 hours prior to the measurement. It shall fulfill
specifications in table 1.
the
the
the
the
http://www.luguang.cn
mail:lge@luguang.cn
LGER433M(F11)
SAW Resonator
5-3 Temperature cycling
Subject the device to a low temperature of -40℃for 30 minutes. Following
by a high temperature of +80℃ for 30 Minutes. Then release the device
into the room conditions for 24 hours prior to the measurement. It shall meet
the specifications in table 1.
5-4 Resistance to solder heat
Dip the device terminals no closer than 1.5mm into the solder bath at 260℃
±10℃
for 10±1 sec. Then release the device into the room conditions for
4 hours. The device shall meet the specifications in table 1.
5-5 Solderability
Subject the device terminals into the solder bath at 245℃
±5℃
for 5s,
More than 95% area of the terminals must be covered with new solder. It
shall meet the specifications in table 1.
5-6 Mechanical shock
Drop the device randomly onto the concrete floor from the height of 1m 3
times. the device shall fulfill the specifications in table 1.
5-7 Vibration
Subject the device to the vibration for 1 hour each in x,y and z axes with the
amplitude of 1.5 mm at 10 to 55 Hz. The device shall fulfill the
specifications in table 1.
5-8 Lead fatigue
5-8-1 Pulling test
Weight along with the direction of lead without an shock 1kg. The
device shall satisfy all the initial Characteristics.
5-8-2 Bending test
Lead shall be subject to withstand against 90℃ bending with 450g
weight in the direction of thickness. This operation shall be done toward
both direction. The device shall show no evidence of damage and shall
satisfy all the initial electrical characteristics.
6. REMARK
6.1 Static voltage
Static voltage between signal load & ground may cause deterioration
&destruction of the component. Please avoid static voltage.
6.2 Ultrasonic cleaning
Ultrasonic vibration may cause deterioration & destruction of the
component. Please avoid ultrasonic cleaning
6.3 Soldering
Only leads of component may be soldered. Please avoid soldering another
part of component.
http://www.luguang.cn
mail:lge@luguang.cn
Domestic Chip Exchange
京公网安备 11010802033920号
EEWORLD
