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GS8322Z36GE-250T

Description
ZBT SRAM, 1MX36, 6.5ns, CMOS, PBGA165, 15 X 17 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165
Categorystorage    storage   
File Size2MB,40 Pages
ManufacturerGSI Technology
Websitehttp://www.gsitechnology.com/
Environmental Compliance  
Download Datasheet Parametric View All

GS8322Z36GE-250T Overview

ZBT SRAM, 1MX36, 6.5ns, CMOS, PBGA165, 15 X 17 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165

GS8322Z36GE-250T Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
MakerGSI Technology
Parts packaging codeBGA
package instruction15 X 17 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165
Contacts165
Reach Compliance Codecompliant
ECCN code3A991.B.2.B
Maximum access time6.5 ns
Other featuresFLOW-THROUGH OR PIPELINED ARCHITECTURE; ALSO OPERATES AT 3.3V SUPPLY
JESD-30 codeR-PBGA-B165
JESD-609 codee1
length17 mm
memory density37748736 bit
Memory IC TypeZBT SRAM
memory width36
Humidity sensitivity level3
Number of functions1
Number of terminals165
word count1048576 words
character code1000000
Operating modeSYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize1MX36
Package body materialPLASTIC/EPOXY
encapsulated codeLBGA
Package shapeRECTANGULAR
Package formGRID ARRAY, LOW PROFILE
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)260
Certification statusNot Qualified
Maximum seat height1.4 mm
Maximum supply voltage (Vsup)2.7 V
Minimum supply voltage (Vsup)2.3 V
Nominal supply voltage (Vsup)2.5 V
surface mountYES
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceTin/Silver/Copper (Sn/Ag/Cu)
Terminal formBALL
Terminal pitch1 mm
Terminal locationBOTTOM
Maximum time at peak reflow temperatureNOT SPECIFIED
width15 mm
GS8322Z18(B/E)/GS8322Z36(B/E)/GS8322Z72(C)
119, 165 & 209 BGA
Commercial Temp
Industrial Temp
Features
• NBT (No Bus Turn Around) functionality allows zero wait
Read-Write-Read bus utilization; fully pin-compatible with
both pipelined and flow through NtRAM™, NoBL™ and
ZBT™ SRAMs
• 2.5 V or 3.3 V +10%/–10% core power supply
• 2.5 V or 3.3 V I/O supply
• User-configurable Pipeline and Flow Through mode
• ZQ mode pin for user-selectable high/low output drive
• IEEE 1149.1 JTAG-compatible Boundary Scan
• LBO pin for Linear or Interleave Burst mode
• Pin-compatible with 2Mb, 4Mb, 8Mb, and 16Mb devices
• Byte write operation (9-bit Bytes)
• 3 chip enable signals for easy depth expansion
• ZZ Pin for automatic power-down
• JEDEC-standard 119-, 165- or 209-Bump BGA package
• Pb-Free packages available
36Mb Pipelined and Flow Through
Synchronous NBT SRAM
250 MHz–133 MHz
2.5 V or 3.3 V V
DD
2.5 V or 3.3 V I/O
Because it is a synchronous device, address, data inputs, and
read/write control inputs are captured on the rising edge of the
input clock. Burst order control (LBO) must be tied to a power
rail for proper operation. Asynchronous inputs include the
Sleep mode enable (ZZ) and Output Enable. Output Enable can
be used to override the synchronous control of the output
drivers and turn the RAM's output drivers off at any time.
Write cycles are internally self-timed and initiated by the rising
edge of the clock input. This feature eliminates complex off-
chip write pulse generation required by asynchronous SRAMs
and simplifies input signal timing.
The GS8322Z18/36/72 may be configured by the user to
operate in Pipeline or Flow Through mode. Operating as a
pipelined synchronous device, in addition to the rising-edge-
triggered registers that capture input signals, the device
incorporates a rising edge triggered output register. For read
cycles, pipelined SRAM output data is temporarily stored by
the edge-triggered output register during the access cycle and
then released to the output drivers at the next rising edge of
clock.
The GS8322Z18/36/72 is implemented with GSI's high
performance CMOS technology and is available in a JEDEC-
standard 119-bump, 165-bump or 209-bump BGA package.
Functional Description
The GS8322Z18/36/72 is a 36Mbit Synchronous Static
SRAM. GSI's NBT SRAMs, like ZBT, NtRAM, NoBL or
other pipelined read/double late write or flow through read/
single late write SRAMs, allow utilization of all available bus
bandwidth by eliminating the need to insert deselect cycles
when the device is switched from read to write cycles.
Parameter Synopsis
t
KQ(x18/x36)
t
KQ(x72)
tCycle
Curr
(x18)
Curr
(x36)
Curr
(x72)
t
KQ
tCycle
Curr
(x18)
Curr
(x36)
Curr
(x72)
-250 -225 -200
2.5 2.7 3.0
3.0 3.0 3.0
4.0 4.4 5.0
285
350
440
6.5
6.5
205
235
315
265
320
410
7.0
7.0
195
225
295
245
295
370
7.5
7.5
185
210
265
-166
3.5
3.5
6.0
220
260
320
8.0
8.0
175
200
255
-150
3.8
3.8
6.7
210
240
300
8.5
8.5
165
190
240
-133 Unit
4.0 ns
4.0 ns
7.5 ns
185
215
265
8.5
8.5
155
175
230
mA
mA
mA
ns
ns
mA
mA
mA
Pipeline
3-1-1-1
Flow
Through
2-1-1-1
Rev: 1.07a 3/2009
1/40
© 2002, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
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