|
CLVC1G17MDCKREPG4 |
SN74LVC1G17MDBVREP |
SN74LVC1G17MDCKREP |
| Description |
Enhanced Product Single Schmitt-Trigger Buffer 5-SC70 -55 to 125 |
Enhanced Product Single Schmitt-Trigger Buffer 5-SOT-23 -55 to 125 |
Enhanced Product Single Schmitt-Trigger Buffer 5-SC70 -55 to 125 |
| Brand Name |
Texas Instruments |
Texas Instruments |
Texas Instruments |
| Is it Rohs certified? |
conform to |
conform to |
conform to |
| Maker |
Texas Instruments |
Texas Instruments |
Texas Instruments |
| Parts packaging code |
SOIC |
SOT-23 |
SOIC |
| package instruction |
SC-70, 5 PIN |
LSSOP, TSOP5/6,.11,37 |
TSSOP, TSSOP5/6,.08 |
| Contacts |
5 |
5 |
5 |
| Reach Compliance Code |
compliant |
compli |
compli |
| series |
LVC/LCX/Z |
LVC/LCX/Z |
LVC/LCX/Z |
| JESD-30 code |
R-PDSO-G5 |
R-PDSO-G5 |
R-PDSO-G5 |
| JESD-609 code |
e4 |
e4 |
e4 |
| length |
2 mm |
2.9 mm |
2 mm |
| Load capacitance (CL) |
50 pF |
50 pF |
50 pF |
| Logic integrated circuit type |
BUFFER |
BUFFER |
BUFFER |
| MaximumI(ol) |
0.024 A |
0.032 A |
0.032 A |
| Humidity sensitivity level |
1 |
1 |
1 |
| Number of functions |
1 |
1 |
1 |
| Number of entries |
1 |
1 |
1 |
| Number of terminals |
5 |
5 |
5 |
| Maximum operating temperature |
125 °C |
125 °C |
125 °C |
| Minimum operating temperature |
-55 °C |
-55 °C |
-55 °C |
| Package body material |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
| encapsulated code |
TSSOP |
LSSOP |
TSSOP |
| Encapsulate equivalent code |
TSSOP5/6,.08 |
TSOP5/6,.11,37 |
TSSOP5/6,.08 |
| Package shape |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
| Package form |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| method of packing |
TAPE AND REEL |
TR |
TR |
| Peak Reflow Temperature (Celsius) |
260 |
260 |
260 |
| power supply |
3.3 V |
3.3 V |
3.3 V |
| propagation delay (tpd) |
11 ns |
11 ns |
11 ns |
| Certification status |
Not Qualified |
Not Qualified |
Not Qualified |
| Schmitt trigger |
YES |
YES |
YES |
| Maximum seat height |
1.1 mm |
1.45 mm |
1.1 mm |
| Maximum supply voltage (Vsup) |
5.5 V |
5.5 V |
5.5 V |
| Minimum supply voltage (Vsup) |
1.65 V |
1.65 V |
1.65 V |
| Nominal supply voltage (Vsup) |
3.3 V |
3.3 V |
3.3 V |
| surface mount |
YES |
YES |
YES |
| technology |
CMOS |
CMOS |
CMOS |
| Temperature level |
MILITARY |
MILITARY |
MILITARY |
| Terminal surface |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Nickel/Palladium/Gold (Ni/Pd/Au) |
| Terminal form |
GULL WING |
GULL WING |
GULL WING |
| Terminal pitch |
0.65 mm |
0.95 mm |
0.65 mm |
| Terminal location |
DUAL |
DUAL |
DUAL |
| Maximum time at peak reflow temperature |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
| width |
1.25 mm |
1.6 mm |
1.25 mm |
| Base Number Matches |
1 |
1 |
1 |
| Is it lead-free? |
- |
Lead free |
Lead free |
| ECCN code |
- |
EAR99 |
EAR99 |
| Factory Lead Time |
- |
6 weeks |
6 weeks |
| Maximum supply current (ICC) |
- |
0.01 mA |
0.01 mA |
| Prop。Delay @ Nom-Su |
- |
5.5 ns |
5.5 ns |