|
S-2939AIF10 |
S-2919AI10 |
S-2939AI10 |
S-2919AIF10 |
S-2929AI10 |
S-2929AIF10 |
| Description |
EEPROM, 256X16, Serial, CMOS, PDSO8, SOP-8 |
EEPROM, 64X16, Serial, CMOS, PDIP8, DIP-8 |
EEPROM, 256X16, Serial, CMOS, PDIP8, DIP-8 |
EEPROM, 64X16, Serial, CMOS, PDSO8, SOP-8 |
EEPROM, 128X16, Serial, CMOS, PDIP8, DIP-8 |
EEPROM, 128X16, Serial, CMOS, PDSO8, SOP-8 |
| Is it lead-free? |
Contains lead |
Contains lead |
Contains lead |
Contains lead |
Contains lead |
Contains lead |
| Is it Rohs certified? |
incompatible |
incompatible |
incompatible |
incompatible |
incompatible |
incompatible |
| Parts packaging code |
SOIC |
DIP |
DIP |
SOIC |
DIP |
SOIC |
| package instruction |
LSOP, SOP8,.3 |
DIP, DIP8,.3 |
DIP, DIP8,.3 |
LSOP, SOP8,.3 |
DIP, DIP8,.3 |
LSOP, SOP8,.25 |
| Contacts |
8 |
8 |
8 |
8 |
8 |
8 |
| Reach Compliance Code |
unknown |
unknown |
unknown |
unknown |
unknown |
unknown |
| ECCN code |
EAR99 |
EAR99 |
EAR99 |
EAR99 |
EAR99 |
EAR99 |
| Other features |
DATA RETENTION = 10 YEARS; 100000 ERASE/WRITE CYCLES |
DATA RETENTION = 10 YEARS; 100000 ERASE/WRITE CYCLES |
DATA RETENTION = 10 YEARS; 100000 ERASE/WRITE CYCLES |
DATA RETENTION = 10 YEARS; 100000 ERASE/WRITE CYCLES |
DATA RETENTION = 10 YEARS; 100000 ERASE/WRITE CYCLES |
DATA RETENTION = 10 YEARS; 100000 ERASE/WRITE CYCLES |
| Maximum clock frequency (fCLK) |
0.5 MHz |
0.5 MHz |
0.5 MHz |
0.5 MHz |
0.5 MHz |
0.5 MHz |
| Data retention time - minimum |
10 |
100 |
10 |
100 |
10 |
10 |
| Durability |
100000 Write/Erase Cycles |
100000 Write/Erase Cycles |
100000 Write/Erase Cycles |
100000 Write/Erase Cycles |
100000 Write/Erase Cycles |
100000 Write/Erase Cycles |
| JESD-30 code |
R-PDSO-G8 |
R-PDIP-T8 |
R-PDIP-T8 |
R-PDSO-G8 |
R-PDIP-T8 |
R-PDSO-G8 |
| JESD-609 code |
e0 |
e0 |
e0 |
e0 |
e0 |
e0 |
| length |
5.2 mm |
9.3 mm |
9.3 mm |
5.2 mm |
9.3 mm |
5.2 mm |
| memory density |
4096 bit |
1024 bit |
4096 bit |
1024 bit |
2048 bit |
2048 bit |
| Memory IC Type |
EEPROM |
EEPROM |
EEPROM |
EEPROM |
EEPROM |
EEPROM |
| memory width |
16 |
16 |
16 |
16 |
16 |
16 |
| Number of functions |
1 |
1 |
1 |
1 |
1 |
1 |
| Number of terminals |
8 |
8 |
8 |
8 |
8 |
8 |
| word count |
256 words |
64 words |
256 words |
64 words |
128 words |
128 words |
| character code |
256 |
64 |
256 |
64 |
128 |
128 |
| Operating mode |
SYNCHRONOUS |
SYNCHRONOUS |
SYNCHRONOUS |
SYNCHRONOUS |
SYNCHRONOUS |
SYNCHRONOUS |
| Maximum operating temperature |
85 °C |
85 °C |
85 °C |
85 °C |
85 °C |
85 °C |
| Minimum operating temperature |
-40 °C |
-40 °C |
-40 °C |
-40 °C |
-40 °C |
-40 °C |
| organize |
256X16 |
64X16 |
256X16 |
64X16 |
128X16 |
128X16 |
| Output characteristics |
3-STATE |
3-STATE |
3-STATE |
3-STATE |
3-STATE |
3-STATE |
| Package body material |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
| encapsulated code |
LSOP |
DIP |
DIP |
LSOP |
DIP |
LSOP |
| Encapsulate equivalent code |
SOP8,.3 |
DIP8,.3 |
DIP8,.3 |
SOP8,.3 |
DIP8,.3 |
SOP8,.25 |
| Package shape |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
| Package form |
SMALL OUTLINE, LOW PROFILE |
IN-LINE |
IN-LINE |
SMALL OUTLINE, LOW PROFILE |
IN-LINE |
SMALL OUTLINE, LOW PROFILE |
| Parallel/Serial |
SERIAL |
SERIAL |
SERIAL |
SERIAL |
SERIAL |
SERIAL |
| Peak Reflow Temperature (Celsius) |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
| power supply |
1.8/6.5 V |
5 V |
1.8/6.5 V |
5 V |
1.8/6.5 V |
1.8/6.5 V |
| Certification status |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
| Maximum seat height |
1.7 mm |
4.5 mm |
4.5 mm |
1.7 mm |
4.5 mm |
1.7 mm |
| Serial bus type |
MICROWIRE |
3-WIRE |
MICROWIRE |
3-WIRE |
3-WIRE |
3-WIRE |
| Maximum standby current |
0.000001 A |
0.000001 A |
0.000001 A |
0.000001 A |
0.000001 A |
0.000001 A |
| Maximum slew rate |
0.005 mA |
0.005 mA |
0.005 mA |
0.005 mA |
0.005 mA |
0.005 mA |
| Maximum supply voltage (Vsup) |
6.5 V |
6.5 V |
6.5 V |
6.5 V |
6.5 V |
6.5 V |
| Minimum supply voltage (Vsup) |
2.7 V |
2.7 V |
2.7 V |
2.7 V |
2.7 V |
2.7 V |
| Nominal supply voltage (Vsup) |
5 V |
5 V |
5 V |
5 V |
5 V |
5 V |
| surface mount |
YES |
NO |
NO |
YES |
NO |
YES |
| technology |
CMOS |
CMOS |
CMOS |
CMOS |
CMOS |
CMOS |
| Temperature level |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
| Terminal surface |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
| Terminal form |
GULL WING |
THROUGH-HOLE |
THROUGH-HOLE |
GULL WING |
THROUGH-HOLE |
GULL WING |
| Terminal pitch |
1.27 mm |
2.54 mm |
2.54 mm |
1.27 mm |
2.54 mm |
1.27 mm |
| Terminal location |
DUAL |
DUAL |
DUAL |
DUAL |
DUAL |
DUAL |
| Maximum time at peak reflow temperature |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
| width |
4.4 mm |
7.62 mm |
7.62 mm |
4.4 mm |
7.62 mm |
4.4 mm |
| Maximum write cycle time (tWC) |
10 ms |
10 ms |
10 ms |
10 ms |
10 ms |
10 ms |
| write protect |
SOFTWARE |
SOFTWARE |
SOFTWARE |
SOFTWARE |
SOFTWARE |
SOFTWARE |
| Maker |
ABLIC |
- |
- |
ABLIC |
ABLIC |
ABLIC |