IC 1-OUTPUT TWO TERM VOLTAGE REFERENCE, 2.5 V, UUC, WAFER, Voltage Reference
| Parameter Name | Attribute value |
| Maker | National Semiconductor(TI ) |
| package instruction | DIE, |
| Reach Compliance Code | unknown |
| ECCN code | EAR99 |
| Analog Integrated Circuits - Other Types | TWO TERMINAL VOLTAGE REFERENCE |
| JESD-30 code | X-XUUC-N |
| Number of functions | 1 |
| Output times | 1 |
| Maximum output voltage | 2.5495 V |
| Minimum output voltage | 2.4505 V |
| Nominal output voltage | 2.5 V |
| Package body material | UNSPECIFIED |
| encapsulated code | DIE |
| Package shape | UNSPECIFIED |
| Package form | UNCASED CHIP |
| Certification status | Not Qualified |
| surface mount | YES |
| Maximum voltage temperature coefficient | 150 ppm/°C |
| Terminal form | NO LEAD |
| Terminal location | UPPER |
| Fine-tuning/adjustable output | NO |
| LM4040D-2.5MWC | LM4040CI4.1MDA | LM4040C-2.5MDA | LM4040D-2.5MDC | |
|---|---|---|---|---|
| Description | IC 1-OUTPUT TWO TERM VOLTAGE REFERENCE, 2.5 V, UUC, WAFER, Voltage Reference | IC 1-OUTPUT TWO TERM VOLTAGE REFERENCE, 4.096 V, UUC, DIE, Voltage Reference | IC 1-OUTPUT TWO TERM VOLTAGE REFERENCE, 2.5 V, UUC, DIE, Voltage Reference | IC 1-OUTPUT TWO TERM VOLTAGE REFERENCE, 2.5 V, UUC, DIE, Voltage Reference |
| package instruction | DIE, | DIE, DIE OR CHIP | DIE, | DIE, |
| Reach Compliance Code | unknown | unknown | unknown | unknow |
| ECCN code | EAR99 | EAR99 | EAR99 | EAR99 |
| Analog Integrated Circuits - Other Types | TWO TERMINAL VOLTAGE REFERENCE | TWO TERMINAL VOLTAGE REFERENCE | TWO TERMINAL VOLTAGE REFERENCE | TWO TERMINAL VOLTAGE REFERENCE |
| JESD-30 code | X-XUUC-N | X-XUUC-N | X-XUUC-N | X-XUUC-N |
| Number of functions | 1 | 1 | 1 | 1 |
| Output times | 1 | 1 | 1 | 1 |
| Maximum output voltage | 2.5495 V | 4.11648 V | 2.52875 V | 2.5495 V |
| Minimum output voltage | 2.4505 V | 4.07552 V | 2.47125 V | 2.4505 V |
| Nominal output voltage | 2.5 V | 4.096 V | 2.5 V | 2.5 V |
| Package body material | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED |
| encapsulated code | DIE | DIE | DIE | DIE |
| Package shape | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED |
| Package form | UNCASED CHIP | UNCASED CHIP | UNCASED CHIP | UNCASED CHIP |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| surface mount | YES | YES | YES | YES |
| Maximum voltage temperature coefficient | 150 ppm/°C | 100 ppm/°C | 100 ppm/°C | 150 ppm/°C |
| Terminal form | NO LEAD | NO LEAD | NO LEAD | NO LEAD |
| Terminal location | UPPER | UPPER | UPPER | UPPER |
| Fine-tuning/adjustable output | NO | NO | NO | NO |
| Maker | National Semiconductor(TI ) | - | National Semiconductor(TI ) | National Semiconductor(TI ) |