|
MSP430P325AIPG |
MSP430P325AIFN |
MSP430P325AIPM |
PMS430E325AFZ |
| Description |
16-bit Microcontrollers - MCU 16kB OTP 512B RAM 14b ADC/84 seg LCD |
16-bit Microcontrollers - MCU 16kB OTP 512B RAM 14b ADC/84 seg LCD |
16-bit Microcontrollers - MCU 16kB OTP 512B RAM 14b ADC/84 seg LCD |
16-bit Microcontrollers - MCU 16B Ultra-Low-Pwr MCU 16kB EPROM |
| Is it lead-free? |
Contains lead |
Contains lead |
Contains lead |
Contains lead |
| Is it Rohs certified? |
conform to |
conform to |
conform to |
incompatible |
| Maker |
Texas Instruments |
Texas Instruments |
Texas Instruments |
Texas Instruments |
| Parts packaging code |
QFP |
LCC |
QFP |
LCC |
| package instruction |
QFP, QFP64,.7X.95,40 |
QCCJ, LDCC68,1.0SQ |
LFQFP, QFP64,.47SQ,20 |
QCCJ, LDCC68,1.0SQ |
| Contacts |
64 |
68 |
64 |
68 |
| Reach Compliance Code |
unknown |
unknow |
unknow |
_compli |
| Has ADC |
YES |
YES |
YES |
YES |
| bit size |
16 |
16 |
16 |
16 |
| maximum clock frequency |
0.032 MHz |
0.032 MHz |
0.032 MHz |
0.032 MHz |
| DAC channel |
NO |
NO |
NO |
NO |
| DMA channel |
NO |
NO |
NO |
NO |
| JESD-30 code |
R-PQFP-G64 |
S-PQCC-J68 |
S-PQFP-G64 |
S-CQCC-J68 |
| Number of I/O lines |
14 |
14 |
14 |
14 |
| Number of terminals |
64 |
68 |
64 |
68 |
| Maximum operating temperature |
85 °C |
85 °C |
85 °C |
85 °C |
| Minimum operating temperature |
-40 °C |
-40 °C |
-40 °C |
-40 °C |
| PWM channel |
NO |
NO |
NO |
NO |
| Package body material |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
CERAMIC, METAL-SEALED COFIRED |
| encapsulated code |
QFP |
QCCJ |
LFQFP |
QCCJ |
| Encapsulate equivalent code |
QFP64,.7X.95,40 |
LDCC68,1.0SQ |
QFP64,.47SQ,20 |
LDCC68,1.0SQ |
| Package shape |
RECTANGULAR |
SQUARE |
SQUARE |
SQUARE |
| Package form |
FLATPACK |
CHIP CARRIER |
FLATPACK, LOW PROFILE, FINE PITCH |
CHIP CARRIER |
| Peak Reflow Temperature (Celsius) |
260 |
260 |
260 |
NOT SPECIFIED |
| power supply |
3/5 V |
3/5 V |
3/5 V |
3/5 V |
| Certification status |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
| RAM (bytes) |
512 |
512 |
512 |
512 |
| rom(word) |
16384 |
16384 |
16384 |
16384 |
| ROM programmability |
OTPROM |
OTPROM |
OTPROM |
OTPROM |
| speed |
3.3 MHz |
3.3 MHz |
3.3 MHz |
3.3 MHz |
| Maximum supply voltage |
5.5 V |
5.5 V |
5.5 V |
5.5 V |
| Minimum supply voltage |
2.5 V |
2.5 V |
2.5 V |
2.5 V |
| Nominal supply voltage |
5 V |
5 V |
5 V |
5 V |
| surface mount |
YES |
YES |
YES |
YES |
| technology |
CMOS |
CMOS |
CMOS |
CMOS |
| Temperature level |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
| Terminal form |
GULL WING |
J BEND |
GULL WING |
J BEND |
| Terminal pitch |
1 mm |
1.27 mm |
0.5 mm |
1.27 mm |
| Terminal location |
QUAD |
QUAD |
QUAD |
QUAD |
| Maximum time at peak reflow temperature |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
| uPs/uCs/peripheral integrated circuit type |
MICROCONTROLLER, RISC |
MICROCONTROLLER, RISC |
MICROCONTROLLER, RISC |
MICROCONTROLLER, RISC |
| Brand Name |
Texas Instruments |
Texas Instruments |
Texas Instruments |
- |
| JESD-609 code |
e4 |
e4 |
e4 |
- |
| length |
20 mm |
24.2316 mm |
10 mm |
- |
| Humidity sensitivity level |
3 |
4 |
3 |
- |
| Maximum seat height |
3.1 mm |
4.57 mm |
1.6 mm |
- |
| Terminal surface |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Nickel/Palladium/Gold (Ni/Pd/Au) |
- |
| width |
14 mm |
24.2316 mm |
10 mm |
- |