TECHNICAL NOTE
High-performance Regulator IC Series for PCs
300mA Linear Regulators
for Desktop PC
BD35613HFV/EFJ/HFN, BD35615HFV/EFJ/HFN, BD35618HFV/EFJ/HFN
●Description
BD3561□ series is a LDO regulator with output current 300mA. The output accuracy is±1% of output voltage. BD3561
□
series has some kinds of output voltage line-up and package line-up. Thus, it is used for the wide applications of
digital appliances. Over current protection (for protecting the IC destruction by output short circuit), shutdown ON/OFF
switch (for setting the circuit current 0μA at shutdown mode), and thermal shutdown circuit (for protecting ICs from heat
destruction by over load condition) are all built in.
●Features
1) Output current 300mA
2) Output voltage accuracy :
±1%
3) Built-in Over Current Protection circuit (OCP)
4) Built-in Thermal Shut Down circuit (TSD)
5) With shut down switch
6) Rich package line-up : HSON8, HTSOP-J8, HVSOF6
●Line-up
Product name
BD3561□HFN
BD3561□EFJ
BD3561□HFV
8.0V
○
○
○
5.0V
○
○
○
3.3V
○
○
○
Package
HSON8
HTSOP-J8
HVSOF6
Product name : BD3561□
□□□
a
b
Symbol
a
1□
18
15
13
Output Voltage (V)
8.0V typ.
5.0V typ.
3.3V typ.
□□□
HFN
EFJ
HFV
b
Package
HSON8
HTSOP-J8
HVSOF6
Oct. 2008
●Absolute
maximum ratings (Ta=25℃)
Parameter
Power Supply Voltage
EN Voltage
HSON8
Power Dissipation
HTSOP-J8
HVSOF6
Operating Temperature Range
Storage Temperature Range
Junction Temperature
Symbol
Vcc
VEN
Pd
Topr
Tstg
Tjmax
Limits
15.0 *
1
15.0
1350
*2
2110
*3
850.0
*4
-10½+100
-55½+150
+150
Unit
V
V
mW
℃
℃
℃
*1 Not to exceed Pd
*2 Reduced by 10.8mW for each increase in Ta of 1℃ over 25℃.
(when mounted on a board 70.0mm×70mm×1.6mm Glass-epoxy PCB. (copper foil area:100mm
2
))
*3 Reduced by 16.9mW for each increase in Ta of 1℃ over 25℃.
(when mounted on a board 70.0mm×70mm×1.6mm Glass-epoxy PCB, 2 layer)
*4 Reduced by 6.8mW for each increase in Ta of 1℃ over 25℃.
(when mounted on a board 70.0mm×70mm×1.6mm Glass-epoxy PCB. (copper foil area:100mm
2
))
●Operating
Conditions (Ta=25℃)
Parameter
Input Power Supply Voltage
EN Voltage
Output Current
Symbol
VCC
VEN
Io
Min.
Vo+1.8
-
-
Max.
14.0
14.0
300
Unit
V
V
mA
★This
product should not be used in a radioactive environment.
●ELECTRICAL
CHARACTERISTICS
BD3561□HFN/EFJ/HFV (Unless otherwise noted, Ta=25℃, EN=3V, Vcc=12V)
Parameter
Symbol
Min.
Typ.
Vo(T)×
Output Voltage 1
Vo1
Vo(T)
0.99
Vo(T)×
Output Voltage 2
Vo2
Vo(T)
0.985
Circuit Current at shutdown mode
Isd
-
0
Bias Current
Icc
-
200
Output Current Ability
Io
300
-
Line Regulation
EN Low Voltage
EN High Voltage
EN Bias Current
Reg.I
V
EN
(Low)
V
EN
(High)
IEN
-
0
2.4
0.5
25
-
-
1.0
Max.
Vo(T)×
1.01
Vo(T)×
1.015
5
300
-
50
0.8
14.0
5.0
Unit
V
V
μA
μA
mA
MV
V
V
μA
Conditions
Io=0mA
Tj=0 to 100℃
Io=0mA→300mA
EN=0V, @OFF mode
Vcc=(Vo+1.8V)→14.0V,
Io=300mA
2/12
●Reference
Data
BD35618HFV (Unless otherwise specified, Ta=25℃, EN=3V, Vcc=12V)
Vo
100mV/div
Vo
100mV/div
EN
5V/div
Io
200mA/di
Io
200mA/di
Vo
5V/div
(20m sec/div)
(10μsec/div)
(0.2msec/div)
Fig.1 Transient Response
(50→0mA)
Co=1μF
EN
5V/div
EN
5V/div
Fig.2 Transient Response
(0→50mA)
Co=1μF
Fig.3 Waveform at output start
Co=1μF
EN
5V/div
VCC
5V/div
VCC
5V/div
VCC
5V/div
Vo
5V/div
Vo
5V/div
Vo
5V/div
(1sec/div)
(1msec/div)
(1msec/div)
Fig.4 Waveform at output OFF
Co=1μF
8.5
Fig.5 Input sequence 1
Co=1μF
230
1.0
Fig.6 Input sequence 2
Co=1μF
8.3
220
0.8
VOUT [V]
Icc [μA]
8.1
210
Icc [A]
0.6
7.9
200
0.4
7.7
190
0.2
7.5
-10
15
40
Ta [℃]
65
90
100
180
-10
10
30
50
Ta [℃]
70
90
100
0.0
-10
10
30
50
Ta [℃]
70
90
100
Fig.7 Ta-Vo (Io=0mA)
Fig.8 Ta-Icc
(V
EN
=12V)
8.20
8.10
8.00
7.90
7.80
7.70
10
Fig.9 Ta-Icc
(Vcc=12V, V
EN
=0V)
2.0
1.6
8
0.8
ISTB [μA]
Ien [μA]
1.2
6
Vo [V]
4
0.4
2
0.0
-10
10
30
50
Ta [℃]
70
90
100
0
0
100
Io [mA]
200
300
0
5
10
15
20
25
Vcc [V]
Fig.10 Ta-IEN
(Vcc=12V, V
EN
=3V)
Fig.11 Io-Vo
Fig.12 Vcc-ISTB
(Vcc=12V, V
EN
=3V)
3/12
●Reference
Data
BD35618HFV (Unless otherwise specified, Ta=25℃, EN=3V, Vcc=12V)
10
8
6
Vo [V]
4
2
0
0
5
10
Vcc [V]
15
20
25
Fig.13 Vcc-Vo
●Heat
Dissipation Characteristics
◎HSON8
[W]
2.0
③1.75W
PCB size：70mm×70mm×1.6mmt
Board①：1 layer (copper foil area: less than 0.2%)
Board②：1 layer (copper foil area:7％)
Board③：1 layer (copper foil area:65％)
◎HTSOP-J8
[W]
4.0
④3.76W
Board①：θja=153.2℃/W
Board②：θja=113.6℃/W
Board③：θja=59.2℃/W
Board④：θja=33.3℃/W
③2.11W
Power Dissipation [Pd]
②1.35W
①：θja=198.4℃/W
②：θja=92.4℃/W
③：θja=71.4℃/W
①0.63W
1.0
Power Dissipation [Pd]
1.5
3.0
2.0
②1.10W
0.5
1.0
①0.82W
0
25
50
75
100
125
Ambient Temperature [Ta]
150
[℃]
0
25
50
75
100
125
Ambient Temperature [Ta]
150
[℃]
[W]
3.0
2.5
Power Dissipation [Pd]
◎HVSOF6
PCB size：70mm×70mm×1.6mm
Board①：1 layer (copper foil area:100mm
2
).
Board②：1 layer (copper foil area:900 mm
2
)
Board③：1 layer (copper foil area: 2500mm
2
)
③1.70W
②1.40W
①：θja=147.1℃/W
②：θja=89.3℃/W
③：θja=73.5℃/W
2.0
1.5
1.0
0.5
0
①0.85W
0
25
50
75
100
125
150
Ambient Temperature [Ta]
[℃]
4/12
●Block
Diagram
(HSON8, HTSOP-J8)
GND
5
1
Vcc
(Vo+1.8)½14V
6
OCP
GND_S
SOFT
Vo
3
Vo
Ceramic
≧
1uF
Capacitor
V
FB
EN
8
TSD
(HVSOF6)
GND
2
OCP
Vcc
6
(Vo+1.8)½14V
3
GND_S
SOFT
Vo
1
Vo
Ceramic
≧
1uF
Capacitor
V
FB
EN
4
TSD
5/12
京公网安备 11010802033920号
EEWORLD
