LM3S5R31-IBZ80-C5T datasheet, PDF

LM3S5R31-IBZ80-C5T: DescriptionStellaris LM3S Microcontroller 108-NFBGA -40 to 85; CategoryThe embedded processor and controller Microcontrollers and processors; File Size7MB，1275 Pages; ManufacturerTexas Instruments; Websitehttp://www.ti.com.cn/; Environmental Compliance

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Stellaris LM3S Microcontroller 108-NFBGA -40 to 85

Parameter Name	Attribute value
Brand Name	Texas Instruments
Is it Rohs certified?	conform to
Maker	Texas Instruments
Parts packaging code	BGA
package instruction	LFBGA,
Contacts	108
Reach Compliance Code	compli
Has ADC	YES
Address bus width
bit size	32
maximum clock frequency	16 MHz
DAC channel	NO
DMA channel	YES
External data bus width
JESD-30 code	S-PBGA-B108
JESD-609 code	e1
length	10 mm
Humidity sensitivity level	3
Number of I/O lines	67
Number of terminals	108
Maximum operating temperature	85 °C
PWM channel	YES
Package body material	PLASTIC/EPOXY
encapsulated code	LFBGA
Package shape	SQUARE
Package form	GRID ARRAY
Peak Reflow Temperature (Celsius)	260
Certification status	Not Qualified
ROM programmability	FLASH
Maximum seat height	1.5 mm
speed	80 MHz
Maximum supply voltage	3.6 V
Minimum supply voltage	3 V
Nominal supply voltage	3.3 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	Tin/Silver/Copper (Sn/Ag/Cu)
Terminal form	BALL
Terminal pitch	0.8 mm
Terminal location	BOTTOM
Maximum time at peak reflow temperature	NOT SPECIFIED
width	10 mm
uPs/uCs/peripheral integrated circuit type	MICROCONTROLLER

	LM3S5R31-IBZ80-C5T	LM3S5R31-IQC80-C5T
Description	Stellaris LM3S Microcontroller 108-NFBGA -40 to 85	Stellaris LM3S Microcontroller 100-LQFP -40 to 85
Brand Name	Texas Instruments	Texas Instruments
Is it Rohs certified?	conform to	conform to
Maker	Texas Instruments	Texas Instruments
Parts packaging code	BGA	QFP
package instruction	LFBGA,	1.40 MM HEIGHT, GREEN, MS-026BED, LQFP-100
Contacts	108	100
Reach Compliance Code	compli	compli
Has ADC	YES	YES
bit size	32	32
maximum clock frequency	16 MHz	16 MHz
DAC channel	NO	NO
DMA channel	YES	YES
JESD-30 code	S-PBGA-B108	S-PQFP-G100
length	10 mm	14 mm
Humidity sensitivity level	3	3
Number of I/O lines	67	67
Number of terminals	108	100
Maximum operating temperature	85 °C	85 °C
PWM channel	YES	YES
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	LFBGA	LFQFP
Package shape	SQUARE	SQUARE
Package form	GRID ARRAY	FLATPACK
Peak Reflow Temperature (Celsius)	260	260
Certification status	Not Qualified	Not Qualified
ROM programmability	FLASH	FLASH
Maximum seat height	1.5 mm	1.6 mm
speed	80 MHz	80 MHz
Maximum supply voltage	3.6 V	3.6 V
Minimum supply voltage	3 V	3 V
Nominal supply voltage	3.3 V	3.3 V
surface mount	YES	YES
technology	CMOS	CMOS
Temperature level	INDUSTRIAL	INDUSTRIAL
Terminal form	BALL	GULL WING
Terminal pitch	0.8 mm	0.5 mm
Terminal location	BOTTOM	QUAD
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED
width	10 mm	14 mm
uPs/uCs/peripheral integrated circuit type	MICROCONTROLLER	MICROCONTROLLER

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