PKF 4000A I
6.6–10 W DC/DC Power Modules
48 V Input Series
• SMD and through-hole versions
with ultra low component height
8.0 mm (0.315 in.)
• 83% efficiency (typ at 5V)
• 1,500 V dc isolation voltage
• Switching frequency syncronization
• MTBF >4.9 million hours at
+55°C case temperature (+40°C
ambient)
• Low EMI measured according to
CISPR 22 and FCC part 15J
Patents
US: D357901 DE: M94022763
The MacroDens™ 10W PKF 4000A I series true
component level on-board DC/DC power modules are
intended as distributed power sources in decentralized
– 48 and – 60V DC power systems. Utilization of
thick film technology and a high degree of silicon
integra-tion has made it possible to achieve a MTBF
of more than 4.9 million hours.
The high reliability and the very low height of these
DC/DC power modules makes them particularly
suited for Information Technology and Telecom
(IT&T) applications, with board spacing down to
15 mm or 0.6 in.
The over-moulded rugged design also makes them
suitable for other demanding industrial applications.
They are optimized for free convection cooling and
have an operational ambient temperature range in
compliance with present and future application needs,
including non temperature controlled environments.
The mechanical design offers the choice of surface
mount or through-hole versions, delivered in ready-
to-use tubes, trays or tape & reel package, and
compati-bility with semi and fully aqueous cleaning
processes.
The PKF series is manufactured using highly
automated manufacturing lines with a world-class
quality commitment and a five-year warranty.
Ericsson Microelectronics AB has been an ISO 9001
certified supplier since 1991.
For a complete product
program please reference the back cover.
E
General
Absolute Maximum Ratings
Characteristics
T
C
T
S
V
I
V
ISO
V
tr
V
RC
V
adj
Case temperature at full output power
Storage temperature
Continuous input voltage
1)
Isolation voltage
(input to output test voltage)
Transient input energy
Remote control voltage pin 10, 11 ref. to pin 17
Output adjust voltage pin 8, 9 ref. to pin 17
–5
–5
min
–45
–55
–0.5
1,500
0.01
+16
+40
max
+100
+125
+75
Unit
°C
°C
V dc
V dc
Ws
V dc
V dc
Stress in excess of Absolute Maximum
Ratings may cause permanent damage.
Absolute Maximum Ratings, sometimes
referred to as no destruction limits, are
normally tested with one parameter at a
time exceeding the limits of Output data
or Electrical Characteristics. If exposed to
stress above these limits, function and per-
formance may degrade in an unspecified
manner.
Input
T
C
< T
Cmax
unless otherwise specified
Characteristics
V
I
V
Ioff
V
Ion
C
I
P
Ii
P
RC
Input voltage range
1)2)
Turn-off input voltage
Turn-on input voltage
Input capacitance
Input idling power
Input stand-by power
I
O
= 0, T
C
= –30…+ 95 °C
T
C
= –30…+ 95 °C,
RC connected to pin 17
(V
I
= 53V)
(V
I
= 66V)
(V
I
= 53V)
(V
I
= 66V)
30
45
See typical characteristics
See typical characteristics
Conditions
min
38
30.0
typ
max
72
Unit
V
V
V
mF
NOTES:
1)
The input
34.5
36
1.4
36.0
38.0
310
310
mW
mW
2)
3)
voltage range 38…72 V dc meets
the European Telecom Standard prETS
300 132-2 Nominal input voltage range in
48 V and 60 V dc power systems,
– 40.5… –57.0 V and –50.0… – 72.0 V
respectively. At input voltages exceeding 72 V
(abnormal voltage) the power loss will be
higher than at normal input voltage and T
C
must be limited to max +95 °C. Absolute max
continuous input voltage is 75 V dc. Output
characteristics will be marginally affected at
input voltages exceeding 72 V.
The power modules will operate down to
£
36 V, when V
I
decreases, but will turn on at
V
I
£
38 V, when V
I
increases (see also Operating
information).
The test is applicable for through-hole versions.
Environmental Characteristics
Characteristics
Vibration
(Sinusoidal)
JESD 22-B103
(IEC 68-2-6 F
c)
Test procedure & conditions
Frequency
Amplitude
Acceleration
Number of cycles
Frequency
Acceleration density
spectrum
Duration
Reproducability
Peak acceleration
Shock duration
Temperature
Number of cycles
Temperature
Humidity
Duration
Temperature, solder
Duration
Duration
Temperature
Concentration
10…500 Hz
0.75 mm
10 g
10 in each axis
10…500 Hz
0.5 g
2
/Hz
10 min in 3 directions
medium (IEC 62-2-36)
200 g
3 ms
–40°C…+125°C
500
85°C
85% RH
1000 hours
260°C
10…13 s
96 h
35°C
5%
Random
vibration
MIL-STD-883
Method 2026
(IEC 68-2-34 E
d)
Shock
(Half sinus)
Temperature
change
Accelerated
damp heat
Solder
resistability
3)
Aggressive
environment
JESD 22-B104
(IEC 68-2-27 E
a)
JESD 22-A104
(IEC 68-2-14 N
a)
JESD 22-A101
(IEC 68-2-3 C
a
with bias)
JESD 22-B106
(IEC 68-2-20 T
b
1A)
IEC 68-2-11 K
a
2
EN/LZT 146 30 R2A © Ericsson Microelectronics AB, October 2000
Mechanical Data
Through-hole version
Surface-mount version
Foot print Component side
Foot print Component side
1
2
3
4
5
6
7
8
9
40.0 [1.575]
5.0 [0.197]
40.0 [1.575]
3.6 [0.142]
Dimensions in mm (in)
24.0 [0.945]
29.6 [1.165]
18 17 16 15 14 13 12 11 10
2.8 [0.110]
Dimensions in mm (in)
Connections
Pin
1
2
3–6
7
8
9
10
11
12–16
17
18
Designation
Out 1
Rtn
NC
Sync
V
adj
NOR
TOA
RC
NC
– In
+ In
Function
Output 1. Positive voltage ref. to Rtn.
Output return.
Not connected.
Synchronization input.
Output voltage adjust. To set typical output voltage (V
O i
)
connect pin 8 to pin 9.
Connection of Nominal Output voltage Resistor. (See Operating
Information, Output Voltage Adjust).
Turn-on/off input voltage adjust (V
I on
/V
I off
). Used to decrease the
turn-on/off input voltage threshold.
Remote control and turn-on/off input voltage adjust. Used to turn-on
and turn-off output and to set the turn-on/off input voltage threshold.
Not connected.
Negative input.
Positive input.
Weight
Maximum 20 g (0.71 oz).
Case
The case consists of semiconductor grade
epoxy with embedded pins.
Coefficient of thermal expansion (CTE) is
typ. 15 ppm/°C.
Connection Pins
Base material is copper (Cu), first plating is
nickel (Ni) and second (outer) plating is
palladium (Pd).
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EN/LZT 146 30 R2A © Ericsson Microelectronics AB, October 2000
Thermal Data
Two-parameter model
This model provides a more precise description of the thermal charac-
teristics to be used for thermal calculations.
Thermally the power module can be considered as a component and
the case temperature can be used to characterize the properties. The
thermal data for a power module with the substrate in contact with
the case can be described with two thermal resistances. One from case
to ambient air and one from case to PB (Printed circuit Board).
The thermal characteristics temperature can be calculated from the
following formula:
T
PB
= (T
C
–T
A
)×(R
th C–PB
+R
th C–A
)/R
th C–A
–P
d
×R
th C–PB
+T
A
Where:
dissipated power, calculated as P
O
×(l/h–1)
max average case temperature
ambient air temperature at the lower side of the power
module
temperature in the PB between the PKF connection pins
T
PB
:
R
th C-PB
: thermal resistance from case to PB under the power
module
R
th C-A
: thermal resistance from case to ambient air
v:
velocity of ambient air
R
th C-PB
is constant and R
th C-A
is dependent on the air velocity.
Free convection is equal to an air velocity of approx. 0.2 – 0.3 m/s.
See figure below.
P
d
:
T
C
:
T
A
:
Reflow Soldering Information
The PKF series of DC/DC power modules are manufactured in surface
mount technology. Extra precautions must therefore be taken when
reflow soldering the surface mount version. Neglecting the soldering
information given below may result in permanent damage or signifi-
cant degradation of power module performance.
The PKF series can be reflow soldered using IR, Natural Convection,
Forced Convection or Combined IR/Convection Technologies. The high
thermal mass of the component and its effect on
DT
(°C) requires that
particular attention be paid to other temperature sensitive components.
IR Reflow technology may require the overall profile time to be ex-
tended to approximately 8–10 minutes to ensure an acceptable
DT.
Higher activity flux may be more suitable to overcome the increase in
oxidation and to avoid flux burn-up.
The general profile parameters detailed in the diagram, with this ex-
tended time to reach peak temperatures, would then be suitable.
Note!
These are maximum parameters. Depending on process varia-
tions, an appropriate margin must be added.
Palladium plating is used on the terminal pins. A pin temperature (T
p
)
in excess of the solder fusing temperature (+183°C for Sn/Pb 63/37)
for more than 25 seconds and a peak temperature above 195°C, is
required to guarantee a reliable solder joint.
Both pin 1 and pin 9 must be monitored.
No responsibility is assumed if these recommendations are not
strictly followed.
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EN/LZT 146 30 R2A © Ericsson Microelectronics AB, October 2000
Safety
The PKF 4000A I series DC/DC power modules are designed in
accordance with EN 60 950,
Safety of information technology equipment
including electrical business equipment.
SEMKO certificate no. 9814213.
The PKF power modules are recognized by UL and meet the applica-
ble requirements in UL 1950
Safety of information technology equipment,
the applicable Canadian safety requirements and UL 1012
Standard
for power supplies.
The DC/DC power module shall be installed in an end-use equip-
ment and considerations should be given to measuring the case tem-
perature to comply with T
C max
when in operation. Abnormal compo-
nent tests are conducted with the input protected by an external
15 A fuse. The need for repeating these tests in the end-use
appliance shall be considered if installed in a circuit having higher
rated devices.
When the supply to the DC/DC power module meets all the require-
ments for SELV (<60 V dc), the output is considered to remain within
SELV limits (level 3). The isolation is an operational insulation in
accordance with EN 60 950.
The DC/DC power module is intended to be supplied by isolated
secondary circuitry and shall be installed in compliance with the
requirements of the ultimate application. If they are connected to a
60 V DC system reinforced insulation must be provided in the power
supply that isolates the input from the mains. Single fault testing in
the power supply must be performed in combination with the
DC/DC power module to demonstrate that the output meets the
requirement for SELV. One pole of the input and one pole of the
output is to be grounded or both are to be kept floating.
The terminal pins are only intended for connection to mating con-
nectors of internal wiring inside the end-use equipment.
These DC/DC power modules may be used in telephone equipment
in accordance with paragraph 34 A.1 of UL 1459 (Standard for Tele-
phone Equipment, second edition).
The galvanic isolation is verified in an electric strength test. Test
voltage (V
ISO
) between input and output is 1,500 V dc for 60 s. In
production the test duration may be decreased to 1 s.
The capacitor between input and output has a value of 1 nF and the
leakage current is less than 1µA @ 53 V dc.
The case is designed in non-conductive epoxy. Its flammability
rating meets UL 94V-0. The oxygen index is 34%
.
Electrical Data
Fundamental circuit diagram
Single output
Transient input voltage
Single voltage pulse at +25 °C ambient temperature
.
EN/LZT 146 30 R2A © Ericsson Microelectronics AB, October 2000
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