|
bq24272YFFR |
bq24272RGER |
bq24272RGET |
bq24272YFFT |
| Description |
2.5A, Singe Input, Single Cell Switchmode Li-Ion BATTERY CHARGER with Power Path Management 49-DSBGA -40 to 85 |
2.5A, Singe Input, Single Cell Switchmode Li-Ion BATTERY CHARGER with Power Path Management 24-VQFN -40 to 85 |
2.5A, Singe Input, Single Cell Switchmode Li-Ion BATTERY CHARGER with Power Path Management 24-VQFN -40 to 85 |
2.5A, Singe Input, Single Cell Switchmode Li-Ion BATTERY CHARGER with Power Path Management 49-DSBGA -40 to 85 |
| Brand Name |
Texas Instruments |
Texas Instruments |
Texas Instruments |
Texas Instruments |
| Is it lead-free? |
Lead free |
Lead free |
Lead free |
Lead free |
| Is it Rohs certified? |
conform to |
conform to |
conform to |
conform to |
| Maker |
Texas Instruments |
Texas Instruments |
Texas Instruments |
Texas Instruments |
| package instruction |
VFBGA, |
HVQCCN, |
HVQCCN, |
VFBGA, |
| Reach Compliance Code |
compliant |
compliant |
compli |
compli |
| ECCN code |
EAR99 |
EAR99 |
EAR99 |
EAR99 |
| Factory Lead Time |
16 weeks |
6 weeks |
6 weeks |
16 weeks |
| Analog Integrated Circuits - Other Types |
POWER SUPPLY MANAGEMENT CIRCUIT |
POWER SUPPLY MANAGEMENT CIRCUIT |
POWER SUPPLY MANAGEMENT CIRCUIT |
POWER SUPPLY MANAGEMENT CIRCUIT |
| JESD-30 code |
R-XBGA-B49 |
S-PQCC-N24 |
S-PQCC-N24 |
R-XBGA-B49 |
| JESD-609 code |
e1 |
e4 |
e4 |
e1 |
| Humidity sensitivity level |
1 |
2 |
2 |
1 |
| Package body material |
UNSPECIFIED |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
UNSPECIFIED |
| encapsulated code |
VFBGA |
HVQCCN |
HVQCCN |
VFBGA |
| Package shape |
RECTANGULAR |
SQUARE |
SQUARE |
RECTANGULAR |
| Package form |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
| Peak Reflow Temperature (Celsius) |
260 |
260 |
260 |
260 |
| Maximum supply voltage (Vsup) |
10 V |
10 V |
10 V |
10 V |
| Minimum supply voltage (Vsup) |
4.2 V |
4.2 V |
4.2 V |
4.2 V |
| surface mount |
YES |
YES |
YES |
YES |
| Terminal surface |
Tin/Silver/Copper (Sn/Ag/Cu) |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Tin/Silver/Copper (Sn/Ag/Cu) |
| Terminal form |
BALL |
NO LEAD |
NO LEAD |
BALL |
| Terminal location |
BOTTOM |
QUAD |
QUAD |
BOTTOM |
| Maximum time at peak reflow temperature |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |