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SIS476DN

Description
N-Channel 30 V (D-S) MOSFET
File Size580KB,13 Pages
ManufacturerVishay
Websitehttp://www.vishay.com
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SIS476DN Overview

N-Channel 30 V (D-S) MOSFET

New Product
SiS476DN
Vishay Siliconix
N-Channel 30 V (D-S) MOSFET
PRODUCT SUMMARY
V
DS
(V)
30
R
DS(on)
(Ω) (Max.)
0.0025 at V
GS
= 10 V
0.0035 at V
GS
= 4.5 V
I
D
(A)
f
40
g
40
g
Q
g
(Typ.)
22.5 nC
FEATURES
Halogen-free According to IEC 61249-2-21
Definition
• TrenchFET
®
Gen IV Power MOSFET
• 100 % R
g
and UIS Tested
• Compliant to RoHS Directive 2002/95/EC
PowerPAK
®
1212-8
APPLICATIONS
3.30 mm
S
1
2
3
4
D
8
7
6
5
D
D
D
S
S
G
3.30 mm
Switch Mode Power Supplies
Personal Computers and Servers
Telecom Bricks
VRM’s and POL
G
D
Bottom
View
Ordering Information:
SiS476DN-T1-GE3 (Lead (Pb)-free and Halogen-free)
S
N-Channel MOSFET
ABSOLUTE MAXIMUM RATINGS
(T
A
= 25 °C, unless otherwise noted)
Parameter
Drain-Source Voltage
Gate-Source Voltage
T
C
= 25 °C
Continuous Drain Current (T
J
= 150 °C)
T
C
= 70 °C
T
A
= 25 °C
T
A
= 70 °C
Pulsed Drain Current (t = 300 µs)
Continuous Source-Drain Diode Current
Single Pulse Avalanche Current
Single Pulse Avalanche Energy
T
C
= 25 °C
T
A
= 25 °C
L = 0.1 mH
T
C
= 25 °C
Maximum Power Dissipation
T
C
= 70 °C
T
A
= 25 °C
P
D
I
DM
I
S
I
AS
E
AS
I
D
Symbol
V
DS
V
GS
Limit
30
+ 20, - 16
40
g
40
g
28.6
a, b
26.2
a, b
80
40
g
3.3
a, b
20
20
52
43
3.7
a, b
3.1
a, b
- 55 to 150
260
W
mJ
A
Unit
V
T
A
= 70 °C
Operating Junction and Storage Temperature Range
Soldering Recommendations (Peak Temperature)
c, d
T
J
, T
stg
°C
THERMAL RESISTANCE RATINGS
Parameter
Maximum Junction-to-Ambient
Maximum Junction-to-Case (Drain)
a, e
t
10 s
Steady State
Symbol
R
thJA
R
thJC
Typical
24
1.9
Maximum
33
2.4
Unit
°C/W
Notes:
a. Surface mounted on 1" x 1" FR4 board.
b. t = 10 s.
c. See solder profile (www.vishay.com/doc?73257). The PowerPAK 1212-8 is a leadless package. The end of the lead terminal is exposed
copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and
is not required to ensure adequate bottom side solder interconnection.
d. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components.
e. Maximum under steady state conditions is 81 °C/W.
f. Based on T
C
= 25 °C.
g. Package limited.
Document Number: 63583
S11-2310-Rev. A, 21-Nov-11
www.vishay.com
1
This document is subject to change without notice.
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000

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