Requirements: good performance, TI product, mainstream, preferably with rich video input and output interfaces, 6000 series, or DSP+ARM dual-core, or DSP+FPGA. Of course, it would be even better if it...
The IEEE 802.16 working group recently released the wireless metropolitan area network standards IEEE 802.16-2004 and IEEE 802.16e, which support fixed and mobile broadband wireless access. Both IEEE ...
Power management for portable applications is becoming a bright spot in the semiconductor field. According to a market report published by market research company CIR, the market prospects for power d...
Analog circuit design itself is a very complex subject, and understanding the related devices is the top priority in learning. This e-book tutorial focuses on analog electronic devices and sorts out t...
[i=s]This post was last edited by frank188 on 2019-8-8 22:22[/i]Hello!
Is there anyone who has tuned tps65982 and can give me some advice?
Best regardsthanks...
Flip-chip and ball grid array (BGA) are two widely used packaging technologies in the electronics industry. Each has its own advantages and limitations, and in some cases, they can complement each ...[Details]
A parallel inverter consists of two thyristors (T1 and T2), a capacitor, a center-tapped transformer, and an inductor. The thyristors provide a current path, while the inductor L maintains a consta...[Details]
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1. Multi-channel DAC technology bottleneck
Currently,
the development of multi-channel DAC technology focuses on two core challenges.
First, industrial applications urgently ...[Details]
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On August 20, it was reported that the specifications of Intel's upcoming Panther Lake mobile processor appeared on the Intel GFX CI website, which mainly focuses on Intel's open source Linux drive...[Details]