0.3mmピッチ
0.3mm pitch/Connectors for FPC
FXV
CONNECTOR
Emboss Tape
Specifications –––––––––––––––––––
The FXV connector is a market require
space saving and low profile 0.3mm pitch
connector, and designed for corresponding
to FPC with protrusions. As FPC with
protrusions is used for this FXV connector,
easy insertion operation, protection of
incomplete insertion and miss-insertion
are realized.
• Double ZIF design for easy insertion
operation of FPC
• Self-lock cover design
• Low profile and space saving
• FPC with protrusions
• Current rating: 0.2A AC, DC
• Voltage rating: 50V AC, DC
• Temperature range: -25˚C to +85˚C
(including temperature rise in applying
electrical current)
• Contact resistance: Initial value/60m
Ω
max.
After environmental testing/60m
Ω
max.
(variation from initial value)
• Insulation resistance:
50M
Ω
min.
• Withstanding voltage: 200V AC/minute
• Applicable FPC: Conductor pitch/0.3mm
Conductor width/0.3mm
Mating part thickness/0.2±0.03mm
* RoHS compliant products are published.
* Refer to "General Instruction and Notice when using
Terminals and Connectors" at the end of this catalog.
* Contact JST for details.
PC board layout (viewed from component side) and Assembly layout
0.6
±0.03
0.48
±0.05
A
±0.05
0.3
±0.05
2.8
0.3
±0.03
0.75
±0.05
3.3
±0.05
0.3
±0.05
0.6
±0.03
1.5
±0.05
0.3
±0.05
0.2
0.05
B
±0.05
C
±0.05
Note: 1. Tolerances are non-cumulative:
±
0.05mm for all centers.
2. The dimensions above should serve as a guideline. Contact JST for details.
192
0.9
FXV CONNECTOR
Connector
Circuits
1.45
0.6
D
A
Model No.
11FXV-RSM1-GAN-TF
17FXV-RSM1-GAN-TF
21FXV-RSM1-GAN-TF
25FXV-RSM1-GAN-TF
27FXV-RSM1-GAN-TF
31FXV-RSM1-GAN-TF
33FXV-RSM1-GAN-TF
39FXV-RSM1-GAN-TF
43FXV-RSM1-GAN-TF
51FXV-RSM1-GAN-TF
Dimensions (mm)
A
2.4
4.2
5.4
6.6
7.2
8.4
9.0
10.8
12.0
14.4
B
3.0
4.8
6.0
7.2
7.8
9.0
9.6
11.4
12.6
15.0
C
4.82
6.62
7.82
9.02
9.62
10.82
11.42
13.22
14.42
16.82
D
5.3
7.1
8.3
9.5
10.1
11.3
11.9
13.7
14.9
17.3
Q'ty /
reel
5,000
5,000
5,000
5,000
5,000
5,000
5,000
5,000
5,000
5,000
11
17
21
25
27
31
1.15
B
2.8
0.9
33
39
43
51
C
Material and Finish
Contact: Copper alloy, nickel-undercoated, gold-plated (nickel-stripe)
Housing: Heat resisting resin, UL94V-0
Solder tab: Copper alloy, copper-undercoated, tin-plated (reflow treatment)
Cover: Heat resisting resin, UL94V-0
RoHS compliance
This product displays (LF)(SN)(M) on a label.
This products listed above are supplied on embossed-tape.
Lead section dimensions of FPC
（0.3×N）
＋1.2
±0.1
±
0.3
（N＋1）
0.05
±0.07
±
0.3
（N−1）
0.03
0.3
0.3
±0.07
＋0.04
0.3
−0.03
0.3
（N−3）
0.6
±0.02
±0.03
0.2
±0.03
1.2
±0.05
1.87
±0.05
2.1
±0.3
Note: N --- Number of circuits
1.87
±0.05
3
±0.5
Reinforcing layer
193
FXV
CONNECTOR
Taping specifications ––––––––––––––––––––––––––––––––––––––––––––––––––––––
Feeding direction
Feeding direction
Carrier tape
Cover tape leader
φ
330±2.0
The end part Connector
mounting part
160min.
Leader part
100min.
400min.
φ
( 13)
W1
+2.5
–1.0
2.0±0.5
(11 to 21 circuits)
1.75±0.1
2.95±0.1
4.0±0.1
φ
1.55±0.05
(25 to 51 circuits)
1.05±0.1 4.0±0.1
Cover tape
φ
1.55±0.05
1.75±0.1
Cover tape
F±0.1
W±0.3
F±0.1
Carrier tape
8.0±0.1
W±0.3
Carrier tape
8.0±0.1
Circuits
11 to 21
25 to 51
Taping dimensions (mm)
F
7.5
11.5
Reel dimensions
(mm)
W1
17.5
25.5
W
16.0
24.0
Q'ty /
reel
5,000
5,000
Note: 1. Specifications conform to JIS C 0806. The tape width, connector
loading recess square hole dimensions, etc. are determined by the
number of circuits and external shape of the connector to be loaded.
Note:
2. Specifications are subject to change without prior notice.
FPGA/CPLD
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