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HS-3530ARH, HS-3530AEH
product pages
FN4653 Rev 4.00
Jun 18, 2018
Page 1 of 7
HS-3530ARH, HS-3530AEH
Ordering Information
ORDERING
NUMBER (Notes
1, 2)
5962F9568701QGA
5962F9568701VGA
5962F9568702VGA
5962F9568701VXC
5962F9568702VXC
5962F9568701V9A
5962F9568702V9A
HS2-3530ARH/PROTO (Note
3)
HS9-3530ARH/PROTO (Note
3)
PART
NUMBER
HS2-3530ARH-8
HS2-3530ARH-Q
HS2-3530AEH-Q
HS9-3530ARH-Q
HS9-3530AEH-Q
HS0-3530ARH-Q
HS0-3530AEH-Q
HS2-3530ARH/PROTO
HS9-3530ARH/PROTO
Radiation Hardness
HDR
100krad(Si)
100krad(Si)
100krad(Si)
100krad(Si)
100krad(Si)
100krad(Si)
100krad(Si)
LDR
-
-
50krad(Si)
-
50krad(Si)
-
50krad(Si)
-
-
-
TEMP.
RANGE (°C)
-55 to +125
-55 to +125
-55 to +125
-55 to +125
-55 to +125
-55 to +125
-55 to +125
-55 to +125
-55 to +125
-55 to +125
PACKAGE (RoHS
COMPLIANT
8 LD METAL CAN
8 LD METAL CAN
8 LD METAL CAN
10 LD FLATPACK,
SOLDER SL
10 LD FLATPACK,
SOLDER SL
DIE
DIE
8 LD METAL CAN
10 LD FLATPACK,
SOLDER SL
DIE
PKG. DWG. #
T8.C
T8.C
T8.C
K10.A
K10.A
-
-
T8.C
K10.A
-
HSO-3530ARH/SAMPLE (Note
3)
HSO-3530ARH/SAMPLE
NOTES:
1. These Pb-free Hermetic packaged products employ 100% Au plate - e4 termination finish, which is RoHS compliant and compatible with both SnPb
and Pb-free soldering operations.
2. Specifications for Rad Hard QML devices are controlled by the Defense Logistics Agency Land and Maritime (DLA). The SMD numbers listed must be
used when ordering.
3. The /PROTO and /SAMPLE are not rated or certified for Total Ionizing Dose (TID) or Single Event Effect (SEE) immunity. These parts are intended for
engineering evaluation purposes only. The /PROTO parts meet the electrical limits and conditions across the temperature range specified in the DLA
SMD and are in the same form and fit as the qualified device. The /SAMPLE die is capable of meeting the electrical limits and conditions specified
in the DLA SMD at +25°C only. The /SAMPLE is a die and does not receive 100% screening across the temperature range to the DLA SMD electrical
limits. These part types do not come with a certificate of conformance because there is no radiation assurance testing and they are not DLA qualified
devices.
Pin Configurations
HS2-3530ARH, HS2-3530AEH (CAN), MACY1-X8
TOP VIEW
I
SET
8
OFFSET
NULL
INVERTING
INPUT
2
1
7
V+
6
OUTPUT
NON-INVERTING
INPUT
3
4
V-
5
OFFSET
NULL
HS9-3530ARH, HS9-3530AEH(FLATPACK), CDFP3-F10
TOP VIEW
NC
OFFSET
- IN
+ IN
V-
1
2
3
4
5
10
9
8
7
6
I
SET
V+
OUTPUT
OFFSET
NC
FN4653 Rev 4.00
Jun 18, 2018
Page 2 of 7
HS-3530ARH, HS-3530AEH
Die Characteristics
DIE DIMENSIONS:
1720µm x 1390µm x 483µm ±25.4µm
(68 mils x 55 mils x 19 mils ±1 mil)
ASSEMBLY RELATED INFORMATION
SUBSTRATE POTENTIAL:
Unbiased (DI)
ADDITIONAL INFORMATION
WORST CASE CURRENT DENSITY:
<2.0 x 10
5
A/cm
2
INTERFACE MATERIALS
GLASSIVATION
Type: Silox (SiO
2
)
Thickness: 8.0kA ±1.0kA
TRANSISTOR COUNT:
49
TOP METALLIZATION
Type: AlSiCu
Thickness: 16.0kA ±2kA
SUBSTRATE:
Radiation Hardened Silicon Gate,
Dielectric Isolation
BACKSIDE FINISH:
Silicon
Metallization Mask Layout
IN+
(3)
Pin Numbers shown are for the Can Package
HS-3530ARH, HS-3530AEH
IN-
(2)
OFFSET
(1)
NC
V- (4)
NC
I
SET
(8)
NC
OFFSET (5)
OUTPUT (6)
NC
V+ (7)
FN4653 Rev 4.00
Jun 18, 2018
Page 3 of 7
HS-3530ARH, HS-3530AEH
Revision History
The revision history provided is for informational purposes only and is believed to be accurate, but not warranted. Please visit our website to make sure
you have the latest revision.
DATE
Jun 18, 2018
REVISION
FN4653.4
CHANGE
Added Related Literature section.
Moved information from Specifications section to Ordering Information on page 2.
Added footnotes and packaging information to Ordering Information on page 2.
Updated Die Dimensions on page 2.
Removed About Intersil section and added new disclaimer.
Added Rev History and About Intersil Verbiage.
Updated datasheet by removing sentence that was not in compliance.
Feb 9, 2015
FN4653.3
FN4653 Rev 4.00
Jun 18, 2018
Page 4 of 7
HS-3530ARH, HS-3530AEH
Package Outline Drawing
Metal Can Packages (Can)
REFERENCE PLANE
A
L
L2
L1
A
A
ØD ØD1
Ø
e
2
1
Øb1
F
Q
Øb
BASE AND
SEATING PLANE
BASE METAL
LEAD FINISH
N
k1
ØD2
For the most recent package outline drawing, see
T8.C.
T8.C
MIL-STD-1835 MACY1-X8 (A1)
e
1
8 LEAD METAL CAN PACKAGE
INCHES
SYMBOL
A
Øb
Øb1
Øb2
ØD
ØD1
k
C
L
MILLIMETERS
MIN
4.19
0.41
0.41
0.41
8.51
7.75
2.79
MAX
4.70
0.48
0.53
0.61
9.40
8.51
4.06
NOTES
-
1
1
-
-
-
-
-
-
-
-
2
1
1
1
-
3
3
4
Rev. 0 5/18/94
MIN
0.165
0.016
0.016
0.016
0.335
0.305
0.110
MAX
0.185
0.019
0.021
0.024
0.375
0.335
0.160
ØD2
e
e1
F
k
k1
L
L1
L2
Q
0.200 BSC
0.100 BSC
-
0.027
0.027
0.500
-
0.250
0.010
45
o
BSC
45
o
BSC
8
0.040
0.034
0.045
0.750
0.050
-
0.045
-
5.08 BSC
2.54 BSC
1.02
0.86
1.14
19.05
1.27
-
1.14
0.69
0.69
12.70
-
6.35
0.25
45
o
BSC
45
o
BSC
8
Øb1
Øb2
SECTION A-A
NOTES:
1. (All leads) Øb applies between L1 and L2. Øb1 applies between L2
and 0.500 from the reference plane. Diameter is uncontrolled in L1
and beyond 0.500 from the reference plane.
2. Measured from maximum diameter of the product.
3.
is the basic spacing from the centerline of the tab to terminal 1 and
is
the basic spacing of each lead or lead position (N -1 places)
from
looking
at the bottom of the package.
4. N is the maximum number of terminal positions.
5. Dimensioning and tolerancing per ANSI Y14.5M - 1982.
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